Search Results - "Horine, B. D." :: Katalog Arama

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Mm-wave phased array antenna and system integration on semi-flex packaging by Pan, H. K., Horine, B. D., Ruberto, M., Ravid, S.

Published in 2011 IEEE International Symposium on Antennas and Propagation (APSURSI) (01-07-2011)
“…60GHz technology utilizes world wide exempt 5-9GHz bandwidth to provide multi-gigabit high throughput wireless communication in WPAN and WLAN applications. One…”

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Conference Proceeding
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High-Speed Flex-Circuit Chip-to-Chip Interconnects by Braunisch, H., Jaussi, J.E., Mix, J.A., Trobough, M.B., Horine, B.D., Prokofiev, V., Daoqiang Lu, Baskaran, R., Meier, P.C.H., Dong-Ho Han, Mallory, K.E., Leddige, M.W.

Published in IEEE transactions on advanced packaging (01-02-2008)
“…High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper…”

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