Search Results - "Holzworth, M."

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  1. 1

    Desoxycorticosterone pivalate‐salt treatment leads to non‐dipping hypertension in Per1 knockout mice by Solocinski, K., Holzworth, M., Wen, X., Cheng, K.‐Y., Lynch, I. J., Cain, B. D., Wingo, C. S., Gumz, M. L.

    Published in Acta Physiologica (01-05-2017)
    “…Aim Increasing evidence demonstrates that circadian clock proteins are important regulators of physiological functions including blood pressure. An established…”
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    Journal Article
  2. 2

    Ion beam-mixed Ge electrodes for high capacity Li rechargeable batteries by Rudawski, N.G., Yates, B.R., Holzworth, M.R., Jones, K.S., Elliman, R.G., Volinsky, A.A.

    Published in Journal of power sources (01-02-2013)
    “…Ion beam modification to effect ion beam mixing without changing morphology was investigated as a means to improve the electrochemical performance of Ge thin…”
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    Journal Article
  3. 3

    Investigation of the effect of temperature during off-state degradation of AlGaN/GaN High Electron Mobility Transistors by Douglas, E.A., Chang, C.Y., Gila, B.P., Holzworth, M.R., Jones, K.S., Liu, L., Kim, Jinhyung, Jang, Soohwan, Via, G.D., Ren, F., Pearton, S.J.

    Published in Microelectronics and reliability (2012)
    “…► AlGaN/GaN HEMTs exhibit a negative temperature dependence for V CRI. ► Breakdown at V CRI does not occur immediately with applied bias. ► DC stress results…”
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    Journal Article Conference Proceeding
  4. 4

    Recovery in dc and rf performance of off-state step-stressed AlGaN/GaN high electron mobility transistors with thermal annealing by Kim, Byung-Jae, Hwang, Ya-Hsi, Ahn, Shihyun, Zhu, Weidi, Dong, Chen, Lu, Liu, Ren, Fan, Holzworth, M. R., Jones, Kevin S., Pearton, Stephen J., Smith, David J., Kim, Jihyun, Zhang, Ming-Lan

    Published in Applied physics letters (13-04-2015)
    “…The recovery effects of thermal annealing on dc and rf performance of off-state step-stressed AlGaN/GaN high electron mobility transistors were investigated…”
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    Journal Article
  5. 5

    Under-gate defect formation in Ni-gate AlGaN/GaN high electron mobility transistors by Whiting, P.G., Rudawski, N.G., Holzworth, M.R., Pearton, S.J., Jones, K.S., Liu, L., Kang, T.S., Ren, F.

    Published in Microelectronics and reliability (01-11-2012)
    “…AlGaN/GaN high electron mobility transistors (HEMTs) represent a rapidly maturing technology plagued by reliability issues which are not well understood. One…”
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    Journal Article
  6. 6

    Characterization of the gate oxide of an AlGaN/GaN high electron mobility transistor by Holzworth, M. R., Rudawski, N. G., Pearton, S. J., Jones, K. S., Lu, L., Kang, T. S., Ren, F., Johnson, J. W.

    Published in Applied physics letters (21-03-2011)
    “…A subnanometer thick interfacial oxide layer present between the Ni/Au gate metal stack and semiconducting epilayers of an AlGaN/GaN high electron mobility…”
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    Journal Article
  7. 7

    Nanocrack formation in AlGaN/GaN high electron mobility transistors utilizing Ti/Al/Ni/Au ohmic contacts by Whiting, P.G., Rudawski, N.G., Holzworth, M.R., Pearton, S.J., Jones, K.S., Liu, L., Kang, T.S., Ren, F.

    Published in Microelectronics and reliability (01-03-2017)
    “…AlGaN/GaN HEMTs are poised to become the technology of choice in RF and power electronics applications where high operating frequencies and high breakdown…”
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    Journal Article
  8. 8

    Erosion defect formation in Ni-gate AlGaN/GaN high electron mobility transistors by Whiting, P.G., Holzworth, M.R., Lind, A.G., Pearton, S.J., Jones, K.S., Liu, L., Kang, T.S., Ren, F., Xin, Y.

    Published in Microelectronics and reliability (01-03-2017)
    “…High electron mobility transistors based on Aluminum Gallium Nitride/Gallium Nitride heterostructures are poised to become the technology of choice for a wide…”
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    Journal Article
  9. 9

    Field-induced defect morphology in Ni-gate AlGaN/GaN high electron mobility transistors by Holzworth, M. R., Rudawski, N. G., Whiting, P. G., Pearton, S. J., Jones, K. S., Lu, L., Kang, T. S., Ren, F., Patrick, E., Law, M. E.

    Published in Applied physics letters (08-07-2013)
    “…AlGaN/GaN high electron mobility transistors were electrically stressed using off-state high reverse gate biases. In devices demonstrating the largest, most…”
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    Journal Article
  10. 10

    Characterization of the gate oxide of an AlGaN/GaN high electronmobility transistor by Holzworth, M. R., Rudawski, N. G., Pearton, S. J., Jones, K. S., Lu, L., Kang, T. S., Ren, F., Johnson, J. W.

    Published in Applied physics letters (21-03-2011)
    “…A subnanometer thick interfacial oxide layer present between the Ni/Au gate metal stack and semiconducting epilayers of an AlGaN/GaN high electron mobility…”
    Get full text
    Journal Article
  11. 11