Search Results - "Hoffrogge, Peter"
-
1
High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01-05-2013)“…Among the technological developments pushed by the emergence of 3D-ICs, Through Silicon Via (TSV) technology has become a standard element in device processing…”
Get full text
Conference Proceeding
-
2
Extending acoustic microscopy for comprehensive failure analysis applications
Published in Journal of materials science. Materials in electronics (01-10-2011)“…In manufacturing of microelectronic components, non-destructive failure analysis methods are important for quality control. These non-destructive methods…”
Get full text
Journal Article -
3
-
4
Inspection of Multilayered Electronic Devices via Scanning Acoustic Microscopy Using Synthetic Aperture Focusing Technique
Published in 2022 IEEE International Ultrasonics Symposium (IUS) (10-10-2022)“…Scanning acoustic microscopy (SAM) is a standard tool for the inspection of electronic devices. Modern devices can contain many interfaces, complex structures…”
Get full text
Conference Proceeding -
5
Automated Defect Classification In Semiconductor Devices Using Deep Learning Networks
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18-07-2022)“…More effective Failure Analysis (FA) technologies are required to meet the upcoming challenges in complex semiconductor devices. Because of recent advances in…”
Get full text
Conference Proceeding -
6
Detection of bonding voids in multi-tier stacks with scanning acoustic microscope
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05-12-2023)“…Bonding voids are the key failure mechanism for 3D system integrations, especially for advanced, multi-tier stacks. However, to date there is no reliable…”
Get full text
Conference Proceeding -
7
Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Reliability Testing using Deep Learning (DL)Assisted Scanning Acoustic Microscopy
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05-12-2023)“…This study integrates Scanning Acoustic Microscopy (SAM) A-Scan data with a Deep Learning (DL) network in an effort to improve the reliability assessment of…”
Get full text
Conference Proceeding -
8
Defect detection in Through Silicon Vias by GHz Scanning Acoustic Microscopy: Key ultrasonic characteristics
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01-05-2014)“…Among the technological developments pushed by the emergence of 3D-ICs, Through Silicon Via (TSV) technology has become a standard element in device processing…”
Get full text
Conference Proceeding