Search Results - "Hobart, Karl"
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Integration of polycrystalline Ga2O3 on diamond for thermal management
Published in Applied physics letters (10-02-2020)“…Gallium oxide (Ga2O3) has attracted great attention for electronic device applications due to its ultra-wide bandgap, high breakdown electric field, and…”
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Experimental observation of localized interfacial phonon modes
Published in Nature communications (25-11-2021)“…Interfaces impede heat flow in micro/nanostructured systems. Conventional theories for interfacial thermal transport were derived based on bulk phonon…”
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Vertical GaN Junction Barrier Schottky Rectifiers by Selective Ion Implantation
Published in IEEE electron device letters (01-08-2017)“…This letter demonstrates vertical GaN junction barrier Schottky (JBS) rectifiers fabricated with novel ion implantation techniques. We used two different…”
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Control of the in-plane thermal conductivity of ultra-thin nanocrystalline diamond films through the grain and grain boundary properties
Published in Acta materialia (15-01-2016)“…The in-plane thermal conductivity of polycrystalline diamond near its nucleation site, which is a key parameter to an efficient integration of diamond in…”
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5
Structural transition and recovery of Ge implanted β-Ga2O3
Published in Applied physics letters (12-10-2020)“…Ion implantation-induced effects were studied in Ge implanted β-Ga2O3 with the fluence and energy of 3 × 1013 cm−2/60 keV, 5 × 1013 cm−2/100 keV, and 7 × 1013…”
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Tunable Thermal Energy Transport across Diamond Membranes and Diamond–Si Interfaces by Nanoscale Graphoepitaxy
Published in ACS applied materials & interfaces (22-05-2019)“…The development of electronic devices, especially those that involve heterogeneous integration of materials, has led to increased challenges in addressing…”
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GaN-On-Diamond HEMT Technology With TAVG = 176°C at PDC,max = 56 W/mm Measured by Transient Thermoreflectance Imaging
Published in IEEE electron device letters (01-06-2019)“…Record DC power has been demonstrated in AlGaN/GaN high electron mobility transistors fabricated using a substrate replacement process in which a thick diamond…”
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Detecting defects that reduce breakdown voltage using machine learning and optical profilometry
Published in Scientific reports (28-03-2024)“…Semiconductor wafer manufacturing relies on the precise control of various performance metrics to ensure the quality and reliability of integrated circuits. In…”
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Hybrid Edge Termination in Vertical GaN: Approximating Beveled Edge Termination via Discrete Implantations
Published in IEEE transactions on electron devices (01-12-2022)“…This work examines a new hybrid edge termination structure for vertical GaN diodes. The hybrid JTE-GR termination consists of superimposed guard rings (GRs)…”
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10
Valence band offsets for CuI on (-201) bulk Ga2O3 and epitaxial (010) (Al0.14Ga0.86)2O3
Published in Applied physics letters (29-10-2018)“…Thin films of copper iodide (CuI) were grown on (-201) bulk Ga2O3 and (010) epitaxial (Al0.14Ga0.86)2O3 using a copper film iodination reaction method. The…”
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Optimizing performance and yield of vertical GaN diodes using wafer scale optical techniques
Published in Scientific reports (13-01-2022)“…To improve the manufacturing of vertical GaN devices for power electronics applications, the effects of defects in GaN substrates need to be better understood…”
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Activation of implanted Si, Ge, and Sn donors in high-resistivity halide vapor phase epitaxial β-Ga2O3:N with high mobility
Published in Applied physics letters (07-11-2022)“…Activation of implanted donors into a highly-resistive, nitrogen-doped homoepitaxial β-Ga2O3 has been investigated. Nitrogen acceptors with the concentration…”
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13
PtOx Schottky Contacts on Degenerately Doped 2¯01β-Ga2O3 Substrates
Published in Journal of electronic materials (01-06-2024)“…Platinum oxide (PtO x ) Schottky contacts on degenerately doped β -Ga 2 O 3 substrates show an increased barrier height of 85% and 64% when compared to nickel…”
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High-Resolution Thermoreflectance Imaging Investigation of Self-Heating in AlGaN/GaN HEMTs on Si, SiC, and Diamond Substrates
Published in IEEE transactions on electron devices (01-12-2020)“…Gallium nitride (GaN) high electron-mobility transistors (HEMTs) offer considerable high-power operation but suffer in reliability due to potentially damaging…”
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15
Substrate-Dependent Effects on the Response of AlGaN/GaN HEMTs to 2-MeV Proton Irradiation
Published in IEEE electron device letters (01-08-2014)“…AlGaN/GaN high electron mobility transistors grown on Si, SiC, and sapphire substrates were exposed to 2-MeV proton irradiation in incremental fluences up to 6…”
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Using machine learning with optical profilometry for GaN wafer screening
Published in Scientific reports (27-02-2023)“…To improve the manufacturing process of GaN wafers, inexpensive wafer screening techniques are required to both provide feedback to the manufacturing process…”
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17
Assessment of channel temperature in β-(AlxGa1−x)2O3/Ga2O3 heterostructure field-effect transistors using visible wavelength thermoreflectance thermal imaging
Published in Applied physics letters (29-01-2024)“…This work demonstrates direct, rapid 2D thermal mapping measurement capabilities of the ultrawide bandgap semiconductor channel of lateral…”
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Hybrid Edge Termination for High-Voltage Vertical GaN Devices: Empirical Validation and Robust Processing Tolerance
Published in IEEE transactions on electron devices (01-06-2024)“…This study presents empirical validation of a simulated novel hybrid edge termination (HET) structure with planar ion implantation processing for vertical…”
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Novel Codoping Moiety to Achieve Enhanced P‐Type Doping in GaN by Ion Implantation
Published in Physica status solidi. A, Applications and materials science (01-08-2023)“…Codoping of gallium nitride for improved acceptor ionization has long been theorized; however, reduction to practice proves difficult via growth. Herein,…”
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A Simple Edge Termination Design for Vertical GaN P-N Diodes
Published in IEEE transactions on electron devices (01-09-2022)“…Vertical power devices require significant attention to their edge termination designs to obtain higher breakdown voltages without substantial increase in…”
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