Search Results - "Hiro, Akito"

Overexpression of Rhodobacter sphaeroides PufX-bearing maltose-binding protein and its effect on the stability of reconstituted light-harvesting core antenna complex by Sakai, Shunnsuke, Hiro, Akito, Kondo, Masaharu, Mizuno, Toshihisa, Tanaka, Toshiki, Dewa, Takehisa, Nango, Mamoru

“…The PufX protein, encoded by the pufX gene of Rhodobacter sphaeroides, plays a key role in the organization and function of the core antenna (LH1)-reaction…”
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Lateral Organization of a Membrane Protein in a Supported Binary Lipid Domain:  Direct Observation of the Organization of Bacterial Light-Harvesting Complex 2 by Total Internal Reflection Fluorescence Microscopy by Dewa, Takehisa, Sugiura, Ryuta, Suemori, Yoshiharu, Sugimoto, Miku, Takeuchi, Toshikazu, Hiro, Akito, Iida, Kouji, Gardiner, Alastair T, Cogdell, Richard J, Nango, Mamoru

“…A unique method is described for directly observing the lateral organization of a membrane protein (bacterial light-harvesting complex LH2) in a supported…”
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Reconstitution and Organization of Photosynthetic Antenna Protein Complex Bearing Functional Hydrophilic Domains by Sakai, Shunsuke, Hiro, Akito, Sumino, Ayumi, Mizuno, Toshihisa, Tanaka, Toshiki, Hashimoto, Hideki, Dewa, Takehisa, Nango, Mamoru

“…Bacterial photosynthetic antenna polypeptide (LH1-α) was synthesized as a water-soluble fusion protein with maltose-binding protein (MBP) and a His-tag portion…”
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An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem by Noda, Hiroto, Hiro, Akito, Nishiguchi, Naoki, Derakhshandeh, Jabber, Slabbekoorn, John, Beyne, Eric

“…A hybrid bonding system is developed with epoxy-based spin-on polymer underfill. This study enables (i) a low temperature (≤200 °C) hybrid bonding technique,…”
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Advanced plating photoresist development for semiconductor packages by Sakakibara, Hirokazu, Akimaru, Hisanori, Hiro, Akito, Sato, Keiichi, Fujiwara, Koichi, Okamoto, Kenji, Kusumoto, Shiro

“…In recent years, novel electronic products like mobile phones, tablets, and personal computer have shrunk dramatically and become highly functionalized. These…”
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Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques by Leech, Damien Jon, Hiro, Akito, Schoofs, Geert, Altintas, Bensu Tunca, Phommahaxay, Alain, Kennes, Koen, Beyer, Gerald, Beyne, Eric

“…The quality of a dicing lane is a qualitative measurement, with many characterization methods available including mechanical and optical profilometry, however…”
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Novel plating photoresist development for advanced packaging by Li, Rui, Matsumoto, Tomoyuki, Taniguchi, Takuhiro, Nishiguchi, Naoki, Hiro, Akito, Sakakibara, Hirokazu, Hasegawa, Koichi

“…As electronic devices are getting smaller and thinner, the packaging structures for semiconductors are becoming more complex. Packaging technologies such as…”
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One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material by Flack, Warren W., Hsieh, Robert, Nguyen, Ha-Ai, Slabbekoorn, John, Suhard, Samuel, Miller, Andy, Hiro, Akito, Ridremont, Romain

“…This study investigates creation of 1.0μm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the…”
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Ultra thick photo resist for FO-WLP by Satou, Keiichi, Katsurayama, Makoto, Hiro, Akito, Sakakibara, Hirokazu, Okamoto, Kenji, Hasegawa, Koichi

“…With the current tremendous market growth of mobile devices toward the new era of Internet of Things/Internet of Everything, the requirements for semiconductor…”
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Advanced plating photoresist development for advanced IC packages by Sakakibara, Hirokazu, Akimaru, Hisanori, Hiro, Akito, Sato, Keiichi, Fujiwara, Koichi, Okamoto, Kenji, Hasegawa, Kouichi, Kusumoto, Shiro

“…The advanced IC packaging technologies such as 3D-TSV, 2.5D interposer, PoP and Flip-Chip wafer micro-bumping are being implemented for consumer electronic…”
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