Search Results - "Hirasawa, Shigeki"

Thermophysical properties and thermal characteristics of phase change emulsion for thermal energy storage media by Kawanami, Tsuyoshi, Togashi, Kenichi, Fumoto, Koji, Hirano, Shigeki, Zhang, Peng, Shirai, Katsuaki, Hirasawa, Shigeki

“…A great deal of attention has been paid to energy saving devices in place of conventional air-cooled and water-cooled devices. The thermal energy storage…”
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Fundamental melting process of water-insoluble phase change material immersed in water by Tsuyoshi KAWANAMI, Ryota HIRAI, Katsuaki SHIRAI, Shigeki HIRASAWA

“…This study examined the melting behavior and heat transfer characteristics of a water-insoluble material immersed in water. n-Hexadecane, popularly used as a…”
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Study on dry-out occurrence in inclined loop thermosyphon for CPU cooling by Hiroyuki TOYODA, Yoshihiro KONDO, Shigemasa SATO, Shigeyasu TSUBAKI, Shigeki HIRASAWA

“…A loop thermosyphon is known to have a higher heat transfer performance without a pump. In addition, there is demand for the reduction of the electricity…”
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Analysis of Temperature and Plastic Flow during Friction Stir Spot Welding Using Particle Method by Shigeki HIRASAWA, Harsha BADARINARAYAN, Kazutaka OKAMOTO, Toshio TOMIMURA, Tsuyoshi KAWANAMI, Shigeki HIRANO

“…Friction stir spot welding (FSSW) is a new metal-joining process, and a numerical simulation code to calculate optimal welding conditions is desired. In this…”
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Electrocaloric Refrigeration using Multi-Layers of Electrocaloric Material Films and Thermal Switches by Hirasawa, Shigeki, Kawanami, Tsuyoshi, Shirai, Katsuaki

“…The electrocaloric effect in thin films of electrocaloric material has the potential to be used for efficient cooling systems. We numerically calculated the…”
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Analysis of effect of tool geometry on plastic flow during friction stir spot welding using particle method by Hirasawa, Shigeki, Badarinarayan, Harsha, Okamoto, Kazutaka, Tomimura, Toshio, Kawanami, Tsuyoshi

“…The effect of tool geometry on the plastic flow and material mixing during friction stir spot welding (FSSW) is investigated using the particle method…”
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Temperature Distribution and Deposition Rate on Semiconductor Wafers in Low-Pressure CVD Equipment Processing Two Wafers by Watanabe, Tomoji, Hirasawa, Shigeki

“…We studied hot-wall-type low-pressure chemical vapor deposition (LPCVD) equipment processing two wafers. The temperature distribution of the wafers and…”
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A knowledge database on thermal control in manufacturing processes: (Molding, semiconductor manufacturing, and micro-scale manufacturing) by HIRASAWA, Shigeki, SATOH, Isao

“…A prototype version of a knowledge database on thermal control in manufacturing processes, specifically, molding, semiconductor manufacturing, and micro-scale…”
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Development of a new velocity calibration method for laser velocimetry using multiple scattering points on a single slit aperture by Shirai, Katsuaki, Ishimura, Shohei, Kawanami, Tsuyoshi, Hirasawa, Shigeki

“…We developed a new calibration method for minimizing the uncertainty and for establishing the uncertainty traceability of laser velocimetry, especially for…”
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A FAST METHOD OF RADIATIVE HEAT TRANSFER ANALYSIS BETWEEN ARBITRARY THREE-DIMENSIONAL BODIES COMPOSED OF SPECULAR AND DIFFUSE SURFACES by Shigenao Maruyama, Yuhei Takeuchi, Shigeki Hirasawa

“…The radiation element method by ray emission model (REM 2 ) has been improved by using the law of reciprocity for the specular view factor and the incomplete…”
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Evaluation of fundamental performance on magnetocaloric cooling with active magnetic regenerator by Kawanami, Tsuyoshi, Hirano, Shigeki, Fumoto, Koji, Hirasawa, Shigeki

“…This paper deals with the cooling characteristics of a magnetocaloric cooling technique refrigerator an active magnetic regenerator (AMR). The AMR-based…”
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Reduction of heat loss from solar thermal collector by diminishing natural convection with high-porosity porous medium by Hirasawa, Shigeki, Tsubota, Ryohei, Kawanami, Tsuyoshi, Shirai, Katsuaki

“…•Placing a high-porosity porous medium above the collector plate to reduce heat loss.•Porous medium is made of fine lines of 0.05mm in diameter with porosity…”
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Road Map of Micro-Engineering and Nano-Engineering from Manufacturing and Mechanical Engineering Viewpoints by YABE, Akira, HIRASAWA, Shigeki, KASAGI, Nobuhide, KITAMURA, Takayuki, NAKAMACHI, Eiji, TAKANO, Yasunari, OGAWA, Haruo, YOKOBORI, Seiichi, IKEGAWA, Masato

“…A new road map of future trends in micro-engineering and nano-engineering was established from the viewpoints of manufacturing and mechanical engineering. This…”
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Dr. Prof. Wataru Nakayama on his 80th birthday by Bar-Cohen, Avram, Daikoku, Takahiro, Himeno, Nobuhiro, Hirasawa, Shigeki, Inoue, Takayoshi, Ishiguro, Hiroshi, Ishizuka, Masaru, Joshi, Yogendra, Miyauchi, Toshio, Nagasaki, Takao, Nakagawa, Masafumi, Okazaki, Ken, Onda, Kazuo, Suzuki, Osamu, Yabe, Akira, Yamada, Yukio, Yoshida, Hideo

“…Doctor Professor Wataru Nakayama, who is celebrating his 80th birthday, is profiled. Nakayama was born on Jan 7, 1936 in Kamakura, Japan. He attended the…”
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Thermal Characteristics of Si Mask for EB Cell Projection Lithography by NakayamA, Yoshinori, Satoh, Hidetoshi, Saitou, Norio, Hirasawa, Shigeki, Yanagid, Takehiko, Todokoro, Hideo

“…We evaluated the thermal characteristics of a single crystal Si mask for electron beam (EB) cell projection lithography by computer simulation. Due to the low…”
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A Knowledge Database on Thermal Control in Manufacturing Processes: Molding, Semiconductor Manufacturing, and Micro-Scale Manufacturing by HIRASAWA, Shigeki, SATOH, Isao

“…A prototype version of a knowledge database on thermal control in manufacturing processes, specifically, molding, semiconductor manufacturing, and micro-scale…”
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A FAST METHOD OF RADIATIVE HEAT TRANSFER ANALYSIS BETWEEN ARBITRARY THREE-DIMENSIONAL BODIES COMPOSED OF SPECULAR AND DIFFUSE SURFACES by Maruyama, Shigenao, Takeuchi, Yuhei, Hirasawa, Shigeki

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Experiment on evaporation heat transfer performance of porous surface by Hirasawa, Shigeki, Nakajima, Takuya, Urimoto, Tetsuya, Tsujimoto, Yuya, Takeuchi, Yusuke, Kawanami, Tsuyoshi, Shirai, Katsuaki

“…Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of…”
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Analysis of drying shrinkage and flow due to surface tension of spin-coated films on topographic substrates by Hirasawa, S., Saito, Y., Nezu, H., Ohashi, N., Maruyama, P.

“…In semiconductor manufacturing processes, it is important that the SiO/sub 2/ isolation films around aluminum connection lines have flat surfaces in order to…”
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Molecular dynamics analysis of reflow process of sputtered aluminum films by Saito, Y., Hirasawa, S., Saito, T., Nezu, H., Yamaguchi, H., Owada, N.

“…It is important that aluminum films fill the grooves on silicon substrates if high-density devices are to be produced. In this paper, we calculate the changes…”
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