Search Results - "Higurashi, E."

Au-Au Surface-Activated Bonding and Its Application to Optical Microsensors With 3-D Structure by Higurashi, E., Chino, D., Suga, T., Sawada, R.

“…Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic…”
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Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films by Higurashi, E., Imamura, T., Suga, T., Sawada, R.

“…A low-temperature bonding of vertical-cavity surface-emitting laser (VCSEL) chips on Si substrates was achieved by using plasma activation of Au films. After…”
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An integrated laser blood flowmeter by Higurashi, E., Sawada, R., Ito, T.

“…We have constructed a very small and lightweight blood flowmeter using micromachining and surface mounting techniques for a wearable health monitoring system…”
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An accelerometer incorporating a laser microencoder for a wide measurable range by Sawada, R., Higurashi, E., Ito, T., Ishikawa, I.

“…A small, highly accurate accelerometer that can measure a wide range of accelerations has been developed. The accelerometer incorporates an optical linear…”
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Optically induced rotation of anisotropic micro-objects fabricated by surface micromachining by Higurashi, E., Ukita, H., Tanaka, H., Ohguchi, O.

“…Optical trapping and directional high-speed rotation by radiation pressure are demonstrated for anisotropic micro-objects fabricated by reactive ion-beam…”
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A three-dimensional MEMS optical switching module having 100 input and 100 output ports by Yamamoto, T., Yamaguchi, J., Takeuchi, N., Shimizu, A., Higurashi, E., Sawada, R., Uenishi, Y.

“…This paper describes an optical switching module based on microelectromechanical systems (MEMS) two-axis tilt mirror arrays and low-cost highly accurate…”
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Hybrid microlaser encoder by Sawada, R., Higurashi, E., Jin, Y.

“…We have developed a microlaser encoder that can detect displacements relative to an external grating scale with a resolution on the order of 10 nm. Its size is…”
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Optically induced rotation of a trapped micro-object about an axis perpendicular to the laser beam axis by Higurashi, E., Sawada, R., Ito, T.

“…A strongly focused Nd:YAG laser beam has been used experimentally to achieve optical trapping and simultaneous rotation of a micro-object about an axis…”
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Three-dimensional integrated circuits with NFET and PFET on separate layers fabricated by low temperature Au/SiO2 hybrid bonding by Goto, M., Hagiwara, K., Iguchi, Y., Ohtake, H., Saraya, T., Higurashi, E., Toshiyoshi, H., Hiramoto, T.

“…We report the first demonstration of 3D ICs formed by the direct bonding of NFET and PFET prepared on separate layers. Hybrid bonding of Au/SiO 2 at a low…”
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Optically induced angular alignment of birefringent micro-objects by linear polarization by Higurashi, E., Sawada, R., Ito, T.

“…Fluorinated polyimide micro-objects having large birefringence of Δn=−0.13 (refractive index n1=1.62, n2=1.49 for the wavelength λ=1.06 μm), which were…”
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Direct bonding of polycrystalline diamond substrate onto Si wafer under atmospheric conditions by Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Higurashi, E.

“…A polycrystalline diamond substrate treated with a mixture of NH 3 and H 2 O 2 was directly bonded with a plasma-activated Si wafer. They formed atomic bonds…”
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Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit by Sawada, R., Higurashi, E., Ito, T.

“…A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on…”
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Direct bonding of GaN and Si substrates using wet cleaning processes by Fukumoto, S., Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Hayase, M., Higurashi, E.

“…Gallium nitride (GaN) substrate was directly bonded with silicon substrate using a sequential wet treatment consisting of H 2 SO 4 /H 2 O 2 and NH 3 /H 2 O 2…”
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Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer by Kariya, S., Matsumae, T., Kurashima, Y., Takagi, H., Hayase, M., Higurashi, E.

“…Au/Ta/Ti metal multilayer was developed for the improved vacuum packaging process. Wafer-level packaging after degas at 200 °C and absorbing gas molecules at…”
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Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering by Kariya, S., Matsumae, T., Kurashima, Y., Takagi, H., Hayase, M., Higurashi, E.

“…We demonstrated that Au/Pt/Ti (from top to bottom) metal multilayers enables wafer-level packaging of degassed assemblies and residual gas gettering. A…”
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Integrated microlaser Doppler velocimeter by Ito, T., Sawada, R., Higurashi, E.

“…We have developed a microlaser Doppler velocimeter in which the laser diode, photodiode, and optical waveguide are monolithically integrated on a GaAs…”
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Optically induced angular alignment of trapped birefringent micro-objects by linearly polarized light by Higurashi, E., Sawada, R., Ito, T.

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GaN-HEMTs on Diamond Prepared by Room-Temperature Bonding Technology by Hiza, S., Shirayanagi, Y., Takiguchi, Y., Nishimura, K., Matsumae, T., Kurashima, Y., Higurashi, E., Takagi, H., Chayahara, A., Mokuno, Y., Yamada, H., Kasamura, K., Toyoda, H., Kubota, A., Yamamuka, M.

“…GaN-on-Diamond high electron mobility transistors were successfully fabricated by surface-activated room-temperature bonding technique. Various diamond…”
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Optical microsensors integrated on a silicon chip by Higurashi, E., Sawada, R.

“…The hybrid integration of various optical microcomponents, such as laser diodes, photodiodes, and gratings, on a silicon micromachined substrate by passive…”
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Development of a miniaturized laser Doppler velocimeter for use as a slip sensor for robot hand control by Morita, N., Nogami, H., Hayashida, Y., Higurashi, E., Ito, T., Sawada, R.

“…We developed a miniaturized laser Doppler velocimeter (LDV) for use as a slip sensor in the control of a robot hand. This sensor is only 1/10,000th of the…”
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