Search Results - "Hein, Verena"

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization by Hein, Verena, Erstling, Marco, Sethu, Raj Sekar, Weide-Zaage, Kirsten, Bai, Tianlin

“…The typical via layout in CMOS technology with AlCu-metallizations and tungsten via is cylindrical. Common vias have a size as small as possible in the related…”
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Differences in reliability effects for thick copper and thick aluminium metallizations by Pohl, Martin, Erstling, Marco, Hein, Verena, Weide-Zaage, K., Chen, T.

“…The use of a thick Copper layer on top of an AlCu-metallization stack instead of a common thick Aluminium layer triggers the need for a change in the…”
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The management of complexity in research and development by Hein, Verena

“…The development and research work has always the challenge to act in and with complexity. A complex system/ problem is characterized by some traits. Such…”
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The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications by Hein, Verena, Weide-Zaage, Kirsten, Clausner, Andre

“…The combination of analog/mixed-signal, high-voltage and embedded non-volatile memory options with sensor and actuator integration is still common in…”
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Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects by Moujbani, Aymen, Kludt, Jörg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena, Meinshausen, Lutz

“…•Dynamic simulation of the diffusion paths in interconnects in the consideration of crystal grains show a possible void formation.•The distribution of…”
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The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts by Hein, Verena, Weide-Zaage, Kirsten

“…The experimental determination of the intrinsic life time of a metallization stack is determined by the used test structures of metal lines and via-metal test…”
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Advanced Analysis and Monitoring of Failure Mechanisms in Microelectronics Metallization by Clausner, Andre, Kraatz, Matthias, Crocoll, Sonja, Schuchart, Marc, Hein, Verena

“…Metallization structures in microelectronic systems undergo various degradation processes. They can be caused by diffusion mechanisms induced by electrical…”
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Reliability performance of different layouts of wide metal tracks by Kludt, Jorg, Weide-Zaage, Kirsten, Ackermann, Markus, Kovacs, Christian, Hein, Verena

“…For industrial and automotive applications a 0.35μm aluminium CMOS process is one of the common used technologies. An increasing demand on extended operating…”
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Deformation of octahedron slotted metal tracks by Kludt, Jorg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena

“…The advantage of an increased lifetime of slotted metal tracks for the use in integrated circuits has already been shown. A benefit for slotted metal track…”
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Overlap design for higher tungsten via robustness in AlCu metallizations by Kludt, Jorg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena

“…Due to the miniaturization process of the CMOS components metallization structures are becoming more and more complex. Better knowledge to improve via…”
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Process, geometry and stack related reliability of thick ALCU-metal-tracks by Weide-Zaage, Kirsten, Hein, Verena

“…The downscaling in VLSI systems and the use of new materials requires the development of new test structures and in the case of harsh environment conditions…”
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ALCU-metal heater for interconnect monitoring test structures by Hein, Verena, Erstling, Marco

“…Monitoring Wafer Level Reliability (WLR) tests are common to guarantee process stability and homogeneity. The test cost and test time efficiency are very…”
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Layout optimization of CMOS Interconnects for Heating, Cooling and Improved Stress Distribution by Hein, Verena, Weide-Zaage, Kirsten, Yang, Xi

“…The reliability of CMOS circuits is influenced by local inhomogeneities in current density, temperature and mechanical stress. Mechanical stress caused by…”
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Thick AlCu-metal reliability characterization by Weide-Zaage, Kirsten, Tan, Yuqi, Hein, Verena

“…The layout and design of the on-chip metallization can influence the reliability of products. Thick wide metal tracks are sensitive for failure mechanisms like…”
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"New automotive" - Considerations for reliability, robustness and resilience for CMOS interconnects by Weide-Zaage, Kirsten, Fremont, Helene, Hein, Verena

“…The technology evolution worsens the stress level of microelectronic applications. The shrinking, higher interconnect stacks, the diversity of functions,…”
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Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks by Sethu, Raj Sekar, Hein, Verena, Erstling, Marco, Weide-Zaage, Kirsten

“…The metal layout design influences the reliability of the metallization in semiconductor products. An optimized design of the interconnect stack can help to…”
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Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs by Weide-Zaage, K., Hein, V.

“…The evaluation of via structures, metallisations as well as a miniaturisation of the layout dimensions lead to the determination of new test structures. The…”
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Simulation of Electromigration Test Structures with and without Extrusion Monitors by Hein, V., Hoelzer, G., Schroeter, T., Yeo, Y., Tan Hong Mui

“…The thermal-electrical behavior of metallization structures with and without extrusion monitors has been investigated by finite element method (FEM)…”
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