Search Results - "Haznedar, H."
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Impact of stress-induced backflow on full-chip electromigration risk assessment
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01-06-2006)“…This paper presents a linear system formulation for evaluating full-chip electromigration (EM) risk in general (straight line, tree, and mesh) wiring…”
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Journal Article -
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A methodology for chip-level electromigration risk assessment and product qualification
Published in International Symposium on Signals, Circuits and Systems. Proceedings, SCS 2003. (Cat. No.03EX720) (2004)“…Even after the successful introduction of Cu-based metallization, the electromigration (EM) failure risk has remained one of the most important reliability…”
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Conference Proceeding
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A practical approach to static signal electromigration analysis
Published in Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175) (1998)“…Some literature suggests that sweep back effects may make electromigration (EM) a non-issue in signal lines. However this is only the case when the shape of…”
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Conference Proceeding