Search Results - "Hariharaputhiran, M."

Chemical–mechanical polishing of copper and tantalum with silica abrasives by Li, Y., Hariharaputhiran, M., Babu, S. V.

“…Chemical mechanical polishing of copper and tantalum was performed using fumed amorphous silica abrasive particles dispersed in H2O2, Fe(NO3)3, and glycine…”
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The settling of spheres in a viscoplastic fluid by Hariharaputhiran, Mariappan, Subramanian, R.Shankar, Campbell, Gregory A, Chhabra, Raj.P

“…Results on the variation in the steady settling velocity of spheres with a time interval between experiments in a 0.3 wt% aqueous Carbopol-941 dispersion are…”
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Overcoming Cu/CVD low-k integration challenges in a high performance interconnect technology by Lytle, S.A., Karthikeyan, S., Oladeji, I.O., Lee, T.J., Li, H.M., Zhang, A., Steiner, K.G., Merchant, S.M., Oh, M., Jessen, S.W., Gibson, G.W., Ramappa, D., Taylor, J.A., Tse, T.Y., Hariharaputhiran, M., Hua, G., Kim, H.T., Mattern, L.N., Kamat, N., Chew, P.K.H., Chesire, D.P., Kang, S.H., Vitkavage, S.C., Adebanjo, R.O., Wolf, T.M., Kook, T., Huang, R.Y.S., Cuthbertson, A., Hillenius, S.J., Ibbotson, D.E.

“…In this paper we describe how several challenges have been overcome in the integration of a high performance, manufacturable, Cu/CVD low-k (Coral) 0.13 /spl…”
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