Search Results - "Hanumanth Rao, C."

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  1. 1

    Laser-Induced Flexible Electronics (LIFE) for Resistive, Capacitive and Electrochemical Sensing Applications by Kothuru, Avinash, Hanumanth Rao, C., Puneeth, S. B., Salve, Mary, Amreen, Khairunnisa, Goel, Sanket

    Published in IEEE sensors journal (01-07-2020)
    “…Engineering a cost-effective, flexible electronic device in a one-step fabrication process is quite challenging to perform. Herein, we have introduced a…”
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    Journal Article
  2. 2

    Plasma Treatment and Copper Metallization for Reliable Plated-Through-Holes in Microwave PCBs for Space Electronic Packaging by Rao C., Hanumanth, Kothuru, Avinash, Singh, Amrendra Pratap, Varaprasad, B. K. S. V. L., Goel, Sanket

    “…Radio frequency (RF) or microwave printed circuit board (PCB) is a type of PCB designed to operate on signals in megahertz-to-gigahertz frequency (medium to…”
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    Journal Article
  3. 3

    Application of non-woven aramid-polyimide composite materials for high reliability printed circuit boards for use in spacecraft electronics by Muthulakshmi, B., Hanumanth Rao, C., Sharma, S.V.

    Published in Materials today : proceedings (01-01-2021)
    “…An understanding of the impact of current trends on composites begins with the PCB material and its manufacture. Discovery, development and application of new…”
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    Journal Article
  4. 4

    Plasma-Generated Etchback to Improve the Via-Reliability in High-Tg Substrates Used in Multilayer PWBs for Space Electronic Packaging by Hanumanth Rao, C., Singh, Amrendra Pratap, Saravanan, Malliayan, Varaprasad, Bksvl

    “…High-Tg (glass transition temperature, 210°C) woven fiber-glass reinforced multifunctional-epoxy FR-4 laminates are now becoming main trend in the fabrication…”
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    Journal Article
  5. 5

    A Review on Printed Electronics with Digital 3D Printing: Fabrication Techniques, Materials, Challenges and Future Opportunities by Rao, C. Hanumanth, Avinash, Kothuru, Varaprasad, B. K. S. V. L., Goel, Sanket

    Published in Journal of electronic materials (01-06-2022)
    “…The introduction of 3D printing technology has revolutionised the manufacturing and electronic product design in the past few years, where it is used to even…”
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    Journal Article
  6. 6

    Modified quad helix appliance for thumb sucking and cross bite correction by Vinay, C, Sandeep, V, Hanumanth Rao, C, Uloopi, K, Kumar, A

    Published in Contemporary clinical dentistry (01-10-2013)
    “…Digit sucking habit is a learned pattern of behavior commonly seen in children of preschool age. Prolonged digit sucking beyond the preschool age, lead to the…”
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    Journal Article
  7. 7

    Dual metal core multilayer boards (MLBS) - a better option for high speed spacecraft electronic packaging applications by Hanumanth Rao, C., Varghese, Jissy, Suresh, A., Baliga, B.N.

    Published in Circuit world (2006)
    “…Purpose - Realising a solution for effective thermal management for high-speed electronic packaging for spacecraft applications through dual metal core…”
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    Journal Article
  8. 8

    Direct Ink Writing as an Eco-Friendly PCB Manufacturing Technique for Rapid Prototyping by Rao C., Hanumanth, Varaprasad, B. K. S. V. L., Goel, Sanket

    “…Printing the conductive structures with high-rel quality while realizing through non-contact digital writing techniques remains a challenge. Optimization of…”
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    Conference Proceeding
  9. 9

    Dual metal core multilayer boards MLBS a better option for high speed spacecraft electronic packaging applications by Hanumanth Rao, C., Varghese, Jissy, Suresh, A., Baliga, B.N.

    Published in Circuit world (01-05-2006)
    “…Purpose Realising a solution for effective thermal management for highspeed electronic packaging for spacecraft applications through dual metal core MLBs…”
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    Journal Article
  10. 10