Search Results - "Hansson, Josef"

Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material by Nylander, Andreas, Hansson, Josef, Kabiri Samani, Majid, Chandra Darmawan, Christian, Borta Boyon, Ana, Divay, Laurent, Ye, Lilei, Fu, Yifeng, Ziaei, Afshin, Liu, Johan

“…As feature density increases within microelectronics, so does the dissipated power density, which puts an increased demand on thermal management. Thermal…”
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Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation by Nylander, Andreas, Hansson, Josef, Nilsson, Torbjörn, Ye, Lilei, Fu, Yifeng, Liu, Johan

“…Carbon nanotube (CNT) array thermal interface materials (TIMs) are promising candidates for high-performance applications in terms of thermal performance…”
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Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes by Hansson, Josef, Li, Qi, Smith, Anderson, Zakaria, Isaac, Nilsson, Torbjörn, Nylander, Andreas, Ye, Lilei, Lundgren, Per, Liu, Johan, Enoksson, Peter

“…The electrochemical capacitor (EC) is a key enabler for the miniaturized self-powered systems expected to become ubiquitous with the advent of the…”
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Exploration of Metal Composites and Carbon Nanotubes for Thermal Interfaces by Hansson, Josef

“…Modern microelectronics are perpetually pushing against limitations caused by inadequate heat dissipation. One of the critical bottlenecks is at the interfaces…”
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Solder Matrix Fiber Composite Thermal Interface Materials by Hansson, Josef

“…Overheating has been a problem for microelectronics devices for decades, and the problem is exacerbated by the continued trend of miniaturization of features…”
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Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material by Hansson, Josef, Nilsson, Torbjorn M. J., Ye, Lilei, Liu, Johan

“…Increased demand on the mechanical and thermal properties on the thermal interface and die attach material creates a demand for materials with tailored…”
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Review of current progress of thermal interface materials for electronics thermal management applications by Hansson, Josef, Zanden, Carl, Lilei Ye, Liu, Johan

“…Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are…”
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RF Properties of Carbon Nanotube / Copper Composite Through Silicon Via Based CPW Structure for 3D Integrated Circuits by Nylander, Andreas, Bonmann, Marlene, Vorobiev, Andrei, Hansson, Josef, Wang, Nan, Fu, Yifeng, Liu, Johan

“…The development of integrated circuits (ICs) has seen exponential growth in performance over the last couple of decades and has pushed the boundaries for how…”
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Fabrication and characterization of a carbon fiber solder composite thermal interface material by Hansson, Josef, Lilei Ye, Johan Liu

“…One of the significant bottlenecks in thermal management is to develop thermal interface materials (TIMs) with lower thermal interface resistance while…”
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Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials by Satwara, Maulik, Hansson, Josef, Lilei Ye, Rhedin, Henric, Liu, Johan

“…As microelectronic devices continue to decrease in size, failure of these devices is commonly attributed to ineffectual thermal management. Hence, increased…”
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Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-Heating CVD for Thermal Applications by Hansson, Josef, Samani, Majid Kabiri, Nylander, Andreas, Ye, Lilei, Wang, Nan, Nilsson, Torbjorn, Liu, Johan

“…Hybrid films based on vertically aligned carbon nanotubes (CNTs) on graphene or graphite sheets have been proposed for application as thermal interface…”
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Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects by Mu, Wei, Hansson, Josef, Sun, Shuangxi, Edwards, Michael, Fu, Yifeng, Jeppson, Kjell, Liu, Johan

“…The treatment of densification by vapor on pristineMWCNT bundles are necessary to improve the effective area of the CNT TSV. However, the CNT bundles might…”
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Double-Densified Vertically Aligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects by Wei Mu, Hansson, Josef, Shuangxi Sun, Edwards, Michael, Yifeng Fu, Jeppson, Kjell, Liu, Johan

“…The treatment of densification by vapor on pristine MWCNT bundles are necessary to improve the effective area of the CNT TSV. However, the CNT bundles might…”
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