Search Results - "Handwerker, Carol A"

The equilibrium crystal shape of strontium titanate and its relationship to the grain boundary plane distribution by Rheinheimer, Wolfgang, Bäurer, Michael, Chien, Harry, Rohrer, Gregory S., Handwerker, Carol A., Blendell, John E., Hoffmann, Michael J.

“…In this study, the equilibrium crystal shape (ECS) of a model system, strontium titanate, is compared with the grain boundary plane distribution (GBPD) as a…”
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Intrinsic and Interdiffusion in Cu-Sn System by Kumar, Santosh, Handwerker, Carol A., Dayananda, Mysore A.

“…Solid-solid diffusion couples assembled with disks of copper, tin and intermetallics (Cu 3 Sn and Cu 6 Sn 5 ) were employed to investigate the Kirkendall…”
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In Situ Study on Cu-to-Cu Thermal Compression Bonding by Niu, Tongjun, Xu, Ke, Shen, Chao, Sun, Tianyi, Oberst, Justin, Handwerker, Carol A., Subbarayan, Ganesh, Wang, Haiyan, Zhang, Xinghang

“…Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the…”
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Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys by Reeve, Kathlene N., Anderson, Iver E., Handwerker, Carol A.

“…Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to…”
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Advances in Pb-free Solder Microstructure Control and Interconnect Design by Reeve, Kathlene N., Holaday, John R., Choquette, Stephanie M., Anderson, Iver E., Handwerker, Carol A.

“…New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder…”
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Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder by Koppes, John P., Grossklaus, Kevin A., Muza, Anthony R., Revur, R. Rao, Sengupta, Suvankar, Rae, Alan, Stach, Eric A., Handwerker, Carol A.

“…► In this study we developed prototype Sn nanoparticle Pb-free solder pastes. ► Particle size, melting temperature, coalescence, and volume loading were…”
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Metal-metal chalcogenide molecular precursors to binary, ternary, and quaternary metal chalcogenide thin films for electronic devices by Zhang, Ruihong, Cho, Seonghyuk, Lim, Daw Gen, Hu, Xianyi, Stach, Eric A, Handwerker, Carol A, Agrawal, Rakesh

“…Bulk metals and metal chalcogenides are found to dissolve in primary amine-dithiol solvent mixtures at ambient conditions. Thin-films of CuS, SnS, ZnS,…”
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Sb Additions in Near-Eutectic Sn-Bi Solder Decrease Planar Slip by Fowler, Hannah N., Loaiza, Alexandra, Bahr, David F., Blendell, John E., Handwerker, Carol A.

“…This study examines the changes in strain rate dependence and the deformation behavior of near-eutectic Sn-Bi alloys as a function of Sb concentration using…”
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Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys by Fowler, Hannah N., Puttur Lakshminarayana, Sukshitha Achar, Lai, Sean Yenyu, Tay, Sui Xiong, Masaeng, Aleena, Subbarayan, Ganesh, Blendell, John E., Handwerker, Carol A.

“…Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this…”
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Growth of single crystalline seeds into polycrystalline strontium titanate: Anisotropy of the mobility, intrinsic drag effects and kinetic shape of grain boundaries by Rheinheimer, Wolfgang, Bäurer, Michael, Handwerker, Carol A., Blendell, John E., Hoffmann, Michael J.

“…We present a suite of measurements and combined analyses of grain growth in SrTiO3 for oriented single crystals into polycrystals. The growth distance and…”
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Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys by Reeve, Kathlene N., Handwerker, Carol A.

“…The limited number of independent β -Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β -Sn grain…”
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Fabrication of conductive interconnects by Ag migration in Cu–Ag core-shell nanoparticles by Kim, Suk Jun, Stach, Eric A., Handwerker, Carol A.

“…Fabrication of conductive nanoparticle films is observed in Cu–Ag core-shell nanoparticles by fast diffusion of Ag at 220 °C from particle surfaces, leading to…”
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Orientation Relationships of Pure Tin on Single Crystal Germanium Substrates by Reeve, Thomas C., Reeve, Samuel Temple, Handwerker, Carol A.

“…The limited number of independent β-Sn grain orientations resulting from the difficulty in nucleating β-Sn during solidification of Sn-based solders has a…”
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Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects by Fan, Yaohui, Wu, Yifan, Dale, Travis F., Lakshminarayana, Sukshitha Achar Puttur, Greene, Colin V., Badwe, Nilesh U., Aspandiar, Raiyo F., Blendell, John E., Subbarayan, Ganesh, Handwerker, Carol A.

“…Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form…”
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Evolution of tin whiskers and subsiding grains in thermal cycling by Wang, Ying, Blendell, John E., Handwerker, Carol A.

“…The evolution of surface morphology, including whisker formation, grain boundary cracking, and subsiding grains, was studied in Sn thin films on Si substrates…”
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Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films by Sarobol, P, Pedigo, A E, Su, P, Blendell, J E, Handwerker, C A

“…In this paper, the concept of a defect phase diagram is introduced which quantifies the effects of Cu and Pb additions to electrodeposited Sn films on surface…”
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Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling by Chen, Wei-Hsun, Sarobol, Pylin, Handwerker, Carol A., Blendell, John E.

“…Four different types of stress relaxation responses have been observed in terms of local microstructural changes along grain boundaries (GBs) in large-grained…”
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Silver layer instability in a SnO2/Ag/SnO2 trilayer on silicon by Kim, Suk Jun, Stach, Eric A., Handwerker, Carol A.

“…Trilayers of SnO2/Ag/SnO2 deposited on oxidized Si (100) substrates at room temperature become unstable after annealing at 100°C and 200°C, exhibiting five…”
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Equilibrium Shape of Internal Cavities in Sapphire by Choi, Jung-Hae, Kim, Doh-Yeon, Hockey, Bernard J., Wiederhorn, Sheldon M., Handwerker, Carol A., Blendell, John E., Carter, W. Craig, Roosen, Andrew R.

“…The equilibrium shape of internal cavities in sapphire was determined through the study of submicrometer internal cavities in single crystals. Cavities formed…”
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Emerging Science and Research Opportunities for Metals and Metallic Nanostructures by Handwerker, Carol A., Pollock, Tresa M.

“…During the next decade, fundamental research on metals and metallic nanostructures (MMNs) has the potential to continue transforming metals science into…”
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