Search Results - "Hanbyul Kang"

Formation of octahedral corrosion products in Sn–Ag flip chip solder bump by Kang, Hanbyul, Lee, Miji, Sun, Dongyoon, Pae, Sangwoo, Park, Jongwoo

“…[Display omitted] We investigated the corrosion behavior of the Sn–2.3wt.%Ag flip-chip solder bump in distilled water. At the early stage, dendritic corrosion…”
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Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint by Ha, Sang Su, Kang, Hanbyul, Kim, Gun Rae, Pae, Sangwoo, Lee, Haebum

“…The shear strength and failure behaviors of the Sn-2.3 mass%Ag flip-chip solder joints before and after corrosion test were investigated. The relationships…”
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Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism by Jongwoo Park, Miji Lee, Hanbyul Kang, Wooram Ko, Eunkyeong Choi, Junsik Im, Minwoo Lee, Dohwan Chung, Jinchul Park, Sangchul Shin, Sangwoo Pae

“…Retention fails on flash memory were comprehensively characterized and fault-isolated for the formulation of failure mechanism. Using in-depth TEM and SIMS…”
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Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation by Jongwoo Park, Miji Lee, Kyunghwan Min, Choi, J.-K, Joo, C.-K, Park, S.-C, Hanbyul Kang, Sangwoo Pae

“…Chip-on-film (COF) reliability with fine Cu metal on the film tape used as inner or outer leads for bonding with Au bump that forms electrical contact in…”
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A study of rotary cutting machine (RCM) performance on Korean granite by Shin, Young Jin, Farrokh, Ebrahim, Jung, Jaehoon, Lee, Jaewon, Kang, Hanbyul

“…PurposeDespite the many advantages this type of equipment offers, there are still some major drawbacks. Linear cutting machine (LCM) cannot accurately simulate…”
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Characterization of plate-like Ni-Sn intermetallic compounds in Sn-Ag solder bump by Hanbyul Kang, Miji Lee, Sangkwon Park, Sangsu Ha, Gunrae Kim, Sangchul Shin, Sangwoo Pae

“…We characterized plate-like Ni-Sn IMCs in the Sn-2.3wt.%Ag solder bump using high-resolution 3D X-ray microscopy and transmission electron microscopy. Two…”
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Three Nuances of the Perfect Indicative in the Greek New Testament by Kang, Hanbyul

“…The dissertation analyzes the existence of the three nuances of the perfect tense occurring in the Greek New Testament: resultative-stative, anterior (current…”
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PCB Strip Scale Numerical Study on Vacuum Molded Underfill Void Entrapment in FC-POP Devices by Lee, Moon Soo, Baick, In Hak, Lee, Minwoo, Kim, Byungwook, Lee, Miji, Kang, Hanbyul, Kim, Jinseok, Rhee, Hwasung, Pae, Sangwoo

“…Molded underfill process provides many benefits over capillary underfill process, but increased void defects in molded underfill process could cause…”
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Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR) by Jeong, Seongwon, Kim, Jinseok, Kim, Ayoung, Kim, Byungwook, Lee, Moonsoo, Chang, Jaewon, Baick, In Hak, Kang, Hanbyul, Ji, Younggeun, Shin, Sangchul, Pae, Sangwoo

“…This paper investigates the effect of dummy ball on the board level reliability (BLR) by performing thermal cycling (TC) test for 5 wafer level package (WLP)…”
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In-situ Electrothermal TEM Investigation of Electromigration in fully Embedded Cu/Co Interconnects by Lee, Miji, Chung, Do Hwan, Kim, Hyo-Young, Lee, Mi-Ji, Lee, Moonsoo, Kim, Jinseok, Kang, Hanbyul, Rhee, Hwasung, Pae, Sangwoo

“…A novel in-situ electro-thermal TEM method is presented to observe EM Cu interconnects on Co capping and Co liner/TaN barriers. In order to suppress the…”
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Three-dimensional (3D) Characterization of Electromigration Failure Mechanism of Solder Joints in WLP using X-ray Microscopy by Chang, Jaewon, Choi, Hyunjun, Kim, Jinseok, Park, Sangkwon, Jo, Yoonkyeong, Jeong, Tae-Young, Soo Yeo, Myung, Kang, Hanbyul, Park, Junekyun, Shin, Sangchul, Pae, Sangwoo

“…In this study, we investigated electromigration characteristics of wafer-level-packaging solder joint upon temperature cycling stress and failure mechanism…”
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