Search Results - "Han, Y.D."

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder by Liu, X.D., Han, Y.D., Jing, H.Y., Wei, J., Xu, L.Y.

“…Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene…”
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Welding heat input effect on the hydrogen permeation in the X80 steel welded joints by Han, Y.D., Jing, H.Y., Xu, L.Y.

“…► The effect of microstructure on hydrogen permeation has been investigated. ► With increasing the welding heat input, the effective diffusivity decreased. ►…”
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Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling by Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M., Wei, J.

“…In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite…”
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Numerical simulation of the effects of various stud and hole configurations on friction hydro-pillar processing by Xu, Y.C., Jing, H.Y., Han, Y.D., Xu, L.Y.

“…This paper focuses on the effects of stud and hole configurations on weld defects in friction hydro-pillar processing (FHPP). Various configurations of the…”
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Hydrogen embrittlement sensitivity of X100 pipeline steel under different pre-strain by Han, Y.D., Wang, R.Z., Wang, H., Xu, L.Y.

“…In the present study, the influences of hydrogen on the mechanical properties as well as the pre-strain on the HE susceptibility of X100 pipeline steel were…”
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Sulphide stress cracking behaviour of the coarse-grained heat-affected zone in X100 pipeline steel under different heat inputs by Han, Y.D., Wang, R.Z., Jing, H.Y., Zhao, L., Xu, L.Y., Xin, P.

“…The sulphide stress cracking (SSC) behaviour of a simulated coarse-grained heat-affected zone was investigated under different heat inputs. The microstructure…”
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A modified constitutive model of Ag nanoparticle-modified graphene/Sn–Ag–Cu/Cu solder joints by Han, Y.D., Gao, Y., Jing, H.Y., Wei, J., Zhao, L., Xu, L.Y.

“…In this study, Sn–Ag–Cu solder alloys and Sn–Ag–Cu solder alloys reinforced with 0.1 wt% Ag-graphene nanosheets (Ag-GNSs) by mechanical mixing (H for…”
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Effects of deep cryogenic treatment on the residual stress and mechanical properties of electron-beam-welded Ti–6Al–4V joints by Xu, L.Y., Zhu, J., Jing, H.Y., Zhao, L., Lv, X.Q., Han, Y.D.

“…The effects of deep cryogenic treatment (DCT) on the residual stress and mechanical properties of electron beam (EB)-welded Ti–6Al–4V(TC4) joints were…”
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Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation by Han, Y.D., Gao, Y., Zhang, S.T., Jing, H.Y., Wei, J., Zhao, L., Xu, L.Y.

“…In this study, mechanical mixing and ball milling were used to mix a variety of different mass fractions of Ag nanoparticle-modified graphene nanosheets…”
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Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers by Jing, H.Y., Guo, H.J., Wang, L.X., Wei, J., Xu, L.Y., Han, Y.D.

“…In this study, varying amounts of Ag-modified graphene nanosheets (Ag-GNSs) were added to Sn–Ag–Cu (SAC) solders to synthesize composite solders. Then, the…”
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417P Lymph node (LN) retrieval as a high-risk factor in stage II and III colon cancer by Kim, Y.T., Kim, H.S., Shin, S.J., Beom, S-H., Kim, N.K., Lee, K.Y., Min, B.S., Hur, H., Cho, M.S., Han, Y.D., Yang, S.Y., Koom, W.S., Chang, J.S., Kim, T.I., Cheon, J.H., Park, S.J., Park, J.J., Seo, N.E., Lim, J.S., Ahn, J.B.

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Interfacial reaction between n- and p-type thermoelectric materials and SAC305 solders by Zhang, H., Jing, H.Y., Han, Y.D., Xu, L.Y., Lu, G-Q.

“…•Three layers with different morphologies occur in solder/p-type TE material couple.•A self-forming diffusion barrier layer is formed by solder/n-type material…”
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A finite element model of carbon steel welded joint corrosion under plastic strain by Lu, Y. X., Jing, H. Y., Han, Y. D., Xu, L. Y.

“…A finite element (FE) model is presented in this work that simulates and predicts the mechano‐chemical corrosion behavior of welded joint under different…”
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Electrochemical Behavior of Corrosion Resistance of X65/Inconel 625 Welded Joints by Xu, L.Y., Li, M., Jing, H.Y., Han, Y.D.

“…The corrosion resistant alloy of Inconel 625 is cladded on the inner surface of the carbon pipeline steels of X65. Two sections of the corrosion resistant…”
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Creep behavior of eutectic 80Au/20Sn solder alloy by Zhang, G.S., Jing, H.Y., Xu, L.Y., Wei, J., Han, Y.D.

“…Eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging in which the creep property of the solder joint is…”
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Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy by Jing, H.Y., Zhang, Y.Y., Xu, L.Y., Zhang, G.S., Han, Y.D., Wei, J.

“…•The 80Au/20Sn solder has a high degree of organizational stability.•Using Coffin-Manson and Morrow models to predict the low cycle fatigue behavior.•The…”
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Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder by Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M., Wei, J.

“…The creep behavior and hardness of Sn-3.5Ag-0.7Cu solder were studied using Berkovich depth-sensing indentation at temperatures of 25°C to 125°C. Assuming a…”
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Failure analysis of Incoloy 800HT pipe at high temperature by Xu, L.Y., Zhu, P., Jing, H.Y., Guo, K., Zhong, S.X., Han, Y.D.

“…► The welding process, corrosion and creep have insignificant effect on the failure of the pipe. ► The microstructure of the Incoloy 800HT kept constant during…”
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Erratum to “Electrochemical Behavior of Corrosion Resistance of X65/Inconel 625 Welded Joints, Int. J. Electrochem. Sci., 8(2013) 2069 – 2079” by Xu, L.Y., Li, M., Jing, H.Y., Han, Y.D.

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MRI Assessment of Peritumoral Brain Edema in Human Astrocytomas: Correlation with Angiogenesis Biomarkers by Wei, G.Q., He, H.D., Liu, W.P., Zhen, H.N., Zhao, J., Li, J., Han, Y.D., Yang, Y., Huan, Y.

“…Mass effect due to peritumoral brain edema (PTBE) is one of the most common imaging characteristics encountered in glial tumors. The severity and variety of…”
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