Search Results - "Hahn, Herwig"
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Self-Aligned Process for Selectively Etched p-GaN-Gated AlGaN/GaN-on-Si HFETs
Published in IEEE transactions on electron devices (01-09-2018)“…A process for an enhancement-mode p-GaN-gated heterostructure field-effect transistor with self-aligned structuring of the p-GaN is proposed. A gate-first…”
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Development and analysis of thick GaN drift layers on 200 mm CTE-matched substrate for vertical device processing
Published in Scientific reports (23-09-2023)“…This work reports the epitaxial growth of 8.5 µm-thick GaN layers on 200 mm engineered substrates with a polycrystalline AlN core (QST by QROMIS) for CMOS…”
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Impact of Floating Body Effect, Back-Gate Traps, and Trap-Assisted Tunneling on Scaled In0.53Ga0.47As Ultrathin-Body MOSFETs and Mitigation Measures
Published in IEEE transactions on electron devices (01-06-2018)“…Ultrathin-body (UTB) III-V channel MOSFETs are known to suffer from the floating body effect which turns on a parasitic bipolar junction transistor (BJT) and…”
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Physical Modeling of Charge Trapping Effects in GaN/Si Devices and Incorporation in the ASM-HEMT Model
Published in IEEE journal of the Electron Devices Society (2021)“…In this work, the dynamic behavior of gallium nitride on silicon high electron mobility transistors (GaN/Si HEMT) with carbon doped buffer is modeled using a…”
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First Small-Signal Data of GaN-Based p-Channel Heterostructure Field Effect Transistors
Published in Japanese Journal of Applied Physics (01-12-2013)“…p-Channel heterostructure field effect transistors (HFETs) have recently attracted increasing interest. They open up the possibility of fabricating…”
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Gallium Phosphide-on-Silicon Dioxide Photonic Devices
Published in Journal of lightwave technology (15-07-2018)“…The development of integrated photonic circuits utilizing gallium phosphide requires a robust, scalable process for fabrication of GaP-on-insulator devices…”
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p-Channel Enhancement and Depletion Mode GaN-Based HFETs With Quaternary Backbarriers
Published in IEEE transactions on electron devices (01-10-2013)“…Within the last years, III-nitride-based devices have been demonstrated with exceptional performance. There is, however, a severe lack of knowledge when it…”
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The III-Nitride Double Heterostructure Revisited: Benefits for Threshold Voltage Engineering of MIS Devices
Published in IEEE transactions on electron devices (01-02-2016)“…GaN-based devices are seen as ideal candidates for power-switching applications. For the acceptance of GaN-based devices by module designers, obtaining…”
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Metal‐Organic Chemical Vapor Deposition Regrowth of Highly Doped n+ (In)GaN Source/Drain Layers for Radio Frequency Transistors
Published in Physica status solidi. A, Applications and materials science (01-11-2024)“…Herein, epitaxially regrown n+ (In)GaN source/drain layers for radio frequency high electron mobility transistors, addressing material and electrical…”
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Optomechanics with one-dimensional gallium phosphide photonic crystal cavities
Published in Optica (20-05-2019)Get full text
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Epitaxial buffer structures grown on 200 mm engineering substrates for 1200 V E-mode HEMT application
Published in Applied physics letters (27-06-2022)“…In this work, we demonstrate the epitaxial growth of a gallium-nitride (GaN) buffer structure qualified for 1200 V applications on 200 mm engineered poly-AlN…”
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Monolithically Integrated CMOS-Compatible III-V on Silicon Lasers
Published in IEEE journal of selected topics in quantum electronics (01-11-2018)“…CMOS-compatible III-V lasers integrated on silicon are a crucial step to reduce power consumption and cost for next-generation optical transceivers. Here, we…”
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AlN/Si interface engineering to mitigate RF losses in MOCVD-grown GaN-on-Si substrates
Published in Applied physics letters (12-08-2024)“…Fabrication of low-RF loss GaN-on-Si high electron mobility transistor stacks is critical to enable competitive front-end-modules for 5G and 6G applications…”
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Threshold Voltage Engineering in GaN-Based HFETs: A Systematic Study With the Threshold Voltage Reaching More Than 2 V
Published in IEEE transactions on electron devices (01-02-2015)“…One of the key challenges for the adoption of gallium nitride (GaN)-based heterostructure field effect transistors (HFETs) in power-switching applications is…”
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Integration of 650 V GaN Power ICs on 200 mm Engineered Substrates
Published in IEEE transactions on semiconductor manufacturing (01-11-2020)“…GaN power ICs on engineered substrates of Qromis substrate technology (QST) are promising for future power applications, thanks to the reduced parasitics,…”
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Vertical GaN devices: Process and reliability
Published in Microelectronics and reliability (01-11-2021)“…This paper reviews recent progress and key challenges in process and reliability for high-performance vertical GaN transistors and diodes, focusing on the…”
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Influence of mask material and process parameters on etch angle in a chlorine-based GaN dry etch
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-09-2012)“…The vertical structuring of GaN layers for power application purposes is a key step for successful device operation. Thus, the dry etching of GaN becomes a…”
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GaN-on-Si Enhancement Mode Metal Insulator Semiconductor Heterostructure Field Effect Transistor with On-Current of 1.35 A/mm
Published in Japanese Journal of Applied Physics (01-09-2013)“…GaN-on-Si transistors are regarded as a candidate for future power-switching applications. Beside the necessity to achieve enhancement mode behavior,…”
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