Search Results - "Haak, U."

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    Fabrication of MEMS actuators from the BEOL of a 0.25μm BiCMOS technology platform by Kulse, P., Birkholz, M., Ehwald, K.-E., Bauer, J., Drews, J., Haak, U., Höppner, W., Katzer, J., Schulz, K., Wolansky, D.

    Published in Microelectronic engineering (01-09-2012)
    “…[Display omitted] ► Preparation of monolithic integrated 50nm thin TiN actuator. ► Using a standard BEOL module of a 0.25 BiCMOS technology. ► Introducing a…”
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    Journal Article
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    SiGe HBT technology with fT/fmax of 300GHz/500GHz and 2.0 ps CML gate delay by Heinemann, B, Barth, R, Bolze, D, Drews, J, Fischer, G G, Fox, A, Fursenko, O, Grabolla, T, Haak, U, Knoll, D, Kurps, R, Lisker, M, Marschmeyer, S, Rücker, H, Schmidt, D, Schmidt, J, Schubert, M A, Tillack, B, Wipf, C, Wolansky, D, Yamamoto, Y

    “…A SiGe HBT technology featuring f T /f max /BV CEO =300GHz/500GHz/1.6V and a minimum CML ring oscillator gate delay of 2.0 ps is presented. The…”
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    Conference Proceeding
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    Circuit applications of high-performance SiGe:C HBTs integrated in BiCMOS technology by Winkler, W, Borngräber, J, Heinemann, B, Rücker, H, Barth, R, Bauer, J, Bolze, D, Drews, J, Ehwald, K.-E, Grabolla, T, Haak, U, Höppner, W, Knoll, D, Krüger, D, Kuck, B, Kurps, R, Marschmeyer, M, Richter, H, Schley, P, Schmidt, D, Scholz, R, Tillack, B, Wolansky, D, Wulf, H.-E, Yamamoto, Y, Zaumseil, P

    Published in Applied surface science (15-03-2004)
    “…Carbon-doped SiGe (SiGe:C) bipolar devices have been developed and integrated in to a 0.25 μm CMOS platform. The resulting SiGe:C BiCMOS technology offers a…”
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    Journal Article Conference Proceeding
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    Ultrathin TiN Membranes as a Technology Platform for CMOS-Integrated MEMS and BioMEMS Devices by Birkholz, M., Ehwald, K.-E., Kulse, P., Drews, J., Fröhlich, M., Haak, U., Kaynak, M., Matthus, E., Schulz, K., Wolansky, D.

    Published in Advanced functional materials (10-05-2011)
    “…A standard complementary metal‐oxide‐semiconductor (CMOS) process is successfully modified to encompass the preparation of suspended TiN membranes of only 50…”
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    Journal Article
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    BiCMOS embedded RF-MEMS switch for above 90 GHz applications using backside integration technique by Kaynak, M, Wietstruck, M, Scholz, R, Drews, J, Barth, R, Ehwald, K E, Fox, A, Haak, U, Knoll, D, Korndorfer, F, Marschmeyer, S, Schulz, K, Wipf, C, Wolansky, D, Tillack, B, Zoschke, K, Fischer, T, Kim, Y S, Kim, J S, Lee, W.-G, Kim, J W

    “…We demonstrate a novel back-side processed, back to front self-aligned BiCMOS embedded RF-MEMS switch for the 90 to 140GHz frequency band. The switch…”
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    Conference Proceeding
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    A low-parasitic collector construction for high-speed SiGe:C HBTs by Heinemann, B., Barth, R., Bolze, D., Drews, J., Formanek, P., Grabolla, T., Haak, U., Hoppner, W., Kopke, D.K., Kuck, B., Kurps, R., Marschmeyer, S., Richter, H.H., Rucker, H., Schley, P., Schmidt, D., Winkler, W., Wolansky, D., Wulf, H.E., Yamamoto, Y.

    “…We present a new collector construction for high-speed SiGe:C HBTs that substantially reduces the parasitic base-collector capacitance by selectively…”
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    Conference Proceeding
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    2,4-Dimethyl-5-hexanolide, a trail pheromone component of the carpenter ant Camponotus herculeanus by Bestmann, HJ, Haak, U, Kern, F, Hoelldobler, B

    Published in Die Naturwissenschaften (1995)
    “…Here we report the first identification of a trail pheromone component in the genus Camponotus. The ant colony used for our investigations was collected in the…”
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    Journal Article
  14. 14

    Integration of high-performance SiGe:C HBTs with thin-film SOI CMOS by Rucker, H., Heinemann, B., Barth, R., Bolze, D., Drews, J., Fursenko, O., Grabolla, T., Haak, U., Hoppner, W., Knoll, D., Marschmeyer, S., Mohapatra, N., Richter, H.H., Schley, P., Schmidt, D., Tillack, B., Weidner, G., Wolansky, D., Wulf, H.E., Yamamoto, Y.

    “…A new scheme for the integration of high-performance HBTs with thin-film SOI CMOS is demonstrated. The thickness incompatibility problem of thin-body SOI CMOS…”
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    Conference Proceeding
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    A 0.13µm SiGe BiCMOS technology featuring fT/fmax of 240/330 GHz and gate delays below 3 ps by Rucker, H., Heinemann, B., Winkler, W., Barth, R., Borngraber, J., Drews, J., Fischer, G.G., Fox, A., Grabolla, T., Haak, U., Knoll, D., Korndorfer, F., Mai, A., Marschmeyer, S., Schley, P., Schmidt, D., Schmidt, J., Schulz, K., Tillack, B., Wolansky, D., Yamamoto, Y.

    “…A 0.13 mum SiGe BiCMOS technology for millimeter wave applications is presented. This technology features high-speed HBTs (f T =240 GHz, f max =330 GHz, BV CEO…”
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    Conference Proceeding
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    Detection and reduction of via faults by Wolansky, D., Bauer, J., Haak, U., Hoppner, W., Katzer, J., Kulse, P., Mai, A., Rucker, H., Scheit, A., Schulz, K.

    “…A methodology for fast detection of via faults is presented. Defective vias in large via chains are detected by subsequent use of a parametric tester for…”
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    Conference Proceeding
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    SiGe HBT module with 2.5 ps gate delay by Fox, A., Heinemann, B., Barth, R., Bolze, D., Drews, J., Haak, U., Knoll, D., Kuck, B., Kurps, R., Marschmeyer, S., Richter, H.H., Rucker, H., Schley, P., Schmidt, D., Tillack, B., Weidner, G., Wipf, C., Wolansky, D., Yamamoto, Y.

    “…We present a double-polysilicon SiGe:C HBT module showing a CML ring oscillator (RO) gate delay tau of 2.5 ps, and f T / f max /BV CEo values of 300 GHz/350…”
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    Conference Proceeding
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    SiGe BiCMOS Technology with 3.0 ps Gate Delay by Rucker, H., Fursenko, O., Grabolla, T., Haak, U., Hoppner, W., Knoll, D., Kopke, K., Kuck, B., Mai, A., Marschmeyer, S., Morgenstern, T., Heinemann, B., Richter, H. H., Schley, P., Schmidt, D., Schulz, K., Tillack, B., Weidner, G., Winkler, W., Wolansky, D., Wulf, H.-E., Yamamototo, Y., Barth, R., Bauer, J., Blum, K., Bolze, D., Drews, J., Fischer, G. G., Fox, A.

    “…This work reports on a 130 nm BiCMOS technology with high-speed SiGe:C HBTs featuring a transit frequency of 255 GHz and a maximum oscillation frequency of 315…”
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    Conference Proceeding