Search Results - "Ha-Duong Ngo"

Tuning Piezo ion channels to detect molecular-scale movements relevant for fine touch by Poole, Kate, Herget, Regina, Lapatsina, Liudmila, Ngo, Ha-Duong, Lewin, Gary R.

“…In sensory neurons, mechanotransduction is sensitive, fast and requires mechanosensitive ion channels. Here we develop a new method to directly monitor…”
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Real-Time Impedance Monitoring of Epithelial Cultures with Inkjet-Printed Interdigitated-Electrode Sensors by Mojena-Medina, Dahiana, Hubl, Moritz, Bäuscher, Manuel, Jorcano, José Luis, Ngo, Ha-Duong, Acedo, Pablo

“…From electronic devices to large-area electronics, from individual cells to skin substitutes, printing techniques are providing compelling applications in…”
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Dual-Rotor Electromagnetic-Based Energy Harvesting System for Smart Home Applications by Dinulovic, Dragan, Shousha, Mahmoud, Al-Batol, Muaadh, Zafar, Talha, Bickel, Jan, Ngo, Ha-Duong, Haug, Martin

“…This work presents the development of a dual-rotor rotational electromagnetic energy harvesting (EH) generator and its power management system (PMS). The…”
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Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors by Wang, Bei, Sun, Ling, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

“…Safety is a crucial issue in hydrogen energy applications due to the unique properties of hydrogen. Accordingly, a suitable hydrogen sensor for leakage…”
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Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments by Ngo, Ha-Duong, Mukhopadhyay, Biswaijit, Ehrmann, Oswin, Lang, Klaus-Dieter

“…In this paper we present and discuss two innovative liquid-free SOI sensors for pressure measurements in harsh environments. The sensors are capable of…”
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Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE by Mackowiak, Piotr, Erbacher, Kolja, Schiffer, Michael, Manier, Charles-Alix, Topper, Michael, Ngo, Ha-Duong, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

“…This article presents prime results on process development and optimization of dry etching of silicon carbide (SiC) for via formation and deep etching for…”
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Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor by Mackowiak, Piotr, Erbacher, Kolja, Baeuscher, Manuel, Schiffer, Michael, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Ngo, Ha-Duong

“…A novel 4H SiC piezoresistive pressure sensor has been fabricated using a high temperature metallization system. The sensor has been fabricated using 100 mm…”
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Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS by Wang, Bei, Baeuscher, Manuel, Hu, Xiaodong, Woehrmann, Markus, Becker, Katharina, Juergensen, Nils, Hubl, Moritz, Mackowiak, Piotr, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

“…A novel capacitive sensor for measuring the water-level and monitoring the water quality has been developed in this work by using an enhanced screen printing…”
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Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application by Hu, Xiaodong, Mackowiak, Piotr, Bäuscher, Manuel, Ehrmann, Oswin, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Linke, Stefan, Ngo, Ha-Duong

“…In this paper, we present our work developing a family of silicon-on-insulator (SOI)⁻based high-g micro-electro-mechanical systems (MEMS) piezoresistive…”
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A WSi⁻WSiN⁻Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems by Ngo, Ha-Duong, Mukhopadhyay, Biswajit, Mackowiak, Piotr, Kröhnert, Kevin, Ehrmann, Oswin, Lang, Klaus-Dieter

“…In this paper, we present and discuss our new WSi⁻WSiN⁻Pt metallization scheme for SiC-based microsystems for applications in harsh environments…”
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Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications by Pabst, Oliver, Schiffer, Michael, Obermeier, Ernst, Tekin, Tolga, Lang, Klaus Dieter, Ngo, Ha-Duong

“…Silicon carbide (SiC) is a promising material for applications in harsh environments. Standard silicon (Si) microelectromechanical systems (MEMS) are limited…”
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Quantum capacitance transient phenomena in high-k dielectric armchair graphene nanoribbon field-effect transistor model by Avnon, Asaf, Golman, Roman, Garzón, Esteban, Ngo, Ha-Duong, Lanuzza, Marco, Teman, Adam

“…•Quantum capacitance becomes dominant with high-k ultra-thin dielectrics.•Quantum capacitance in Nanoribbons is influenced by Van-Hove singularities.•The…”
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Plasma‐Based Additive Manufacturing Method for MEMS Using APSLD (Atmospheric Pressure Sputtering Layer Deposition) Technology by Bickel, J., Gesche, Roland, Scherer, Joachim, Kovacs, Reinhold, Hu, Xiaodong, Ngo, Ha Duong

“…This paper reports a novel additive manufacturing technique for MEMS devices using newly developed APSLD (atmospheric pressure sputtering layer deposition)…”
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Tracking Objects Based on Multiple Particle Filters for Multipart Combined Moving Directions Information by Ha, Ngo Duong, Bao, Pham The, Shimizu, Ikuko

“…Object tracking is an important procedure in the computer vision field as it estimates the position, size, and state of an object along the video’s timeline…”
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Nano-Materials-Based Printed Glucose Sensor for Use in Incontinence Products for Health-Care Applications by Hubl, Moritz, Atta, Raghied M., Kaufhold, Robin, Wang, Bei, Ngo, Ha Duong

“…Our recent development of a wireless humidity sensor system embedded in incontinence products enables new sensor applications to diagnose and supervise…”
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Violence region localization in video and the school violent actions classification by Ha, Ngo Duong, Tran, Nhu Y., Thuy, Le Nhi Lam, Shimizu, Ikuko, Bao, Pham The

“…Classification of school violence has been proven to be an effective solution for preventing violence within educational institutions. As a result, technical…”
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Fabrication of High Voltage Capable TSV Using Backside via Last Process and Laser Abblation of Dry Film BCB by Mackowiak, Piotr, Wilke, Martin, Wohrmann, Markus, Gernhard, Robert, Zoschke, Kai, Lang, Klaus-Dieter, Scheider-Ramelow, Martin, Ngo, Ha-Duong

“…The use of TSV (Through Silicon Via) technology has widely spread in the past decade. Its advantages in complexity reduction of the RDL (Redistribution Layer)…”
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Editorial for the Special Issue on MEMS Accelerometers by Rasras, Mahmoud, Elfadel, Ibrahim Abe M, Ngo, Ha Duong

“…Micro-Electro-Mechanical Systems (MEMS) devices are widely used for motion, pressure, light, and ultrasound sensing applications [...]…”
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Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies by Mackowiak, Piotr, Erbacher, Kolja, Zoschke, Kai, Al-Magazachi, Samer, Bauscher, Manuel, Schiffer, Michael, Lang, Klaus-Dieter, Ngo, Ha-Duong

“…This paper describes a fabrication technology for embedding sensors into flex circuit with a partial glass carrier and the electrical test of the circuit. Two…”
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Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method by Baeuscher, Manuel, Reinicke, Oliver, Henke, Matthaus, Mackowiak, Piotr, Schiffer, Michael, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

“…This work is about the design, manufacturing process and characterization of an interdigital capacitor (IDC) sensor for graphene based biosensing applications…”
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