Search Results - "HEHMANN, J"

Remotely powered intelligent splitter monitor for fiber access networks by Hehmann, J., Straub, M., Jentsch, L., Earnshaw, M., Anthapadmanabhan, P., Pfeiffer, T.

“…We propose an intelligent splitter monitor based on a remote optical powering solution to detect the connectivity status of the customer premises equipment to…”
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Neutron diffraction from photoinduced gratings in a PMMA matrix by RUPP, R. A, HEHMANN, J, MATULL, R, IBEL, K

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Optically powered low-energy demarcation device for monitoring FTTx networks by Roeger, M, Hiba, B, Hoh, M, Hehmann, J, Pfeiffer, T, Huebner, M, Becker, J, Leuthold, J, Freude, W

“…We demonstrate an energy-autarkic FTTx monitor. A special protocol and sophisticated hardware reduce the electrical operating power to 0.7μW, which can be…”
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Embedded OTDR measurement range extension for future metro-access networks employing in-line SOAs by Schmuck, H., Straub, M., Bonk, R., Hehmann, J., Pfeiffer, T.

“…We demonstrate for the first time the measurement range extension of an embedded OTDR system employing SOA within the fiber network. eOTDR monitoring across…”
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Embedded OTDR techniques for cost-efficient fibre monitoring in optical access networks by Schmuck, H., Hehmann, J., Straub, M., Pfeiffer, Th

“…A novel low-cost monitoring concept is presented enabling the supervision of the fibre plant in access networks. By re-using the data transmitter OTDR…”
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Neutron diffraction by laser-generated volume phase gratings by MATULL, R, RUPP, R. A, HEHMANN, J, IBEL, K

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Silicon motherboards for multichannel optical modules by Ambrosy, A., Richter, H., Hehmann, Ferling, D.

“…A novel method of a fluxless, high precision and reliable Au/Au thermo compression flip chip bonding process for optoelectronic devices has been developed. The…”
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Cost efficient non-service interrupting monitoring of optical fiber links in FTTH / FTTB networks by Pfeiffer, T., Schmuck, H., Straub, M., Hehmann, J.

“…We present recent advances in low cost fiber monitoring techniques for FTTH/FTTB networks employing integrated means for localizing fiber faults and for…”
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Silicon motherboards for multichannel optical modules by Ambrosy, A., Richter, H., Hehmann, J., Ferling, D.

“…A novel method of a fluxless, high precision, and reliable Au/Au thermo compression flip chip bonding process for optoelectronic devices has been developed…”
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Flip-chip-mounted pin-photodiode array for 2.5 Gbit/s-per-channel parallel optical interconnections by Spalthoff, U., Scherb, J., Korber, W., Ambrosy, A., Hehmann, J., Ferling, D., Rehm, W.

“…High speed InP-InGaAs-InP pin photodiode arrays on semi-insulating InP substrate have been realized. Essentially flat frequency response up to 4 GHz has been…”
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Wide temperature 1.55 /spl mu/m InGaAsP SL-MQW DFB lasers with high reliability by Klenk, M., Ambrosy, A., Bouayad-Amine, J., Buchali, F., Duetting, K., Hirler, H.-P., Hehmann, J., Idler, W., Lach, E., Laube, G., Weinmann, R., Mayer, H.P., Pagnod, P.

“…The introduction of customer access services require low cost laser modules capable for operation in a wide temperature range. We report on optimization of…”
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