Search Results - "HAMMAD, A. E"

Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders by El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M.

“…The effects of Zn addition on the microstructure, thermal behavior and tensile creep properties of Sn–1.0Ag–0.3Cu (SAC103) alloy were systematically…”
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Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys by El-Daly, A.A., Hammad, A.E.

“…In this study, the effects of separate and dual additions of small amount of Cu, In and Ag on the microstructure and elastic properties as well as thermal…”
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Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders by El-Daly, A.A., Hammad, A.E.

“…In the present study, the effects of separate and dual addition of small amount of Ag and Cu on the microstructure and mechanical properties of the eutectic…”
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Creep properties of Sn–Sb based lead-free solder alloys by El-Daly, A.A., Swilem, Y., Hammad, A.E.

“…Full implementation of the new generation of lead-free solders requires detailed knowledge and understanding of their mechanical behavior. This paper reports…”
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Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field by Hammad, A E, El-Molla, Sara, El-Rehim, A F Abd, Ragab, M

“…In the current work, applying a rotating magnetic field (RMF) is an innovative approach to improve the microstructure features and creep resistance of…”
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Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In by El-Daly, A.A., El-Tantawy, Farid, Hammad, A.E., Gaafar, M.S., El-Mossalamy, E.H., Al-Ghamdi, A.A.

“…▶ We investigated the structural and elastic properties of Sn–0.7Cu-based solders containing small amount of Ag and In elements. ▶ Additions of Ag and In will…”
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Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications by Hammad, A.E.

“…For development of lead-free solder for advance electrical components, the correlation of microstructure with thermal and creep properties of novel Ni-doped…”
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Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field by Hammad, A. E., Ragab, M.

“…In the present study, for the first time, rotating magnetic field (RMF) was used to improve the solidification microstructure and mechanical properties of…”
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Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions by El-Daly, A.A., Hammad, A.E.

“…► Effect of Ag and In on creep behavior and melting temperature of Sn–Cu alloy was assessed. ► The introduction of Ag and In can refine the grain size of β-Sn…”
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The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy by Ragab, M., Alsnani, Hind, Hammad, A. E., Abd‑Elrahman, Ashraf S.

“…The objective of this research is to investigate the role of Sb addition on the microstructure and creep behaviors of the Sn–6.5Zn–0.3Cu solder alloy…”
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Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions by El-Daly, A.A., Hammad, A.E., Fawzy, A., A. Nasrallh, D.

“…► Effect of Ni and Sb on thermal and creep behavior of Sn–1.0Ag–0.5Cu alloy was assessed. ► Alloying of Ni and Sb resulted in considerably reduced undercooling…”
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Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy by Eid, N. A. M., Attia, A. M., Ibrahiem, A. A., Hammad, A. E.

“…A substantial advancement has been made in the prospective design strategy of composite alloys Sn–5Sb–0.3Cu (SSC503) containing multi-walled carbon nanotubes…”
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Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite by Eid, N A M, El-Daly, A A, Hammad, A E, Ibrahiem, A A

“…The use of innovative Co–Mg–La ferrite nanoparticles (ferrite) facilitates the production of superior Pb-free solder alloy materials that suffer from the…”
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Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In by El-Daly, A.A., Hammad, A.E.

“…• We examine the effects of small amount of Ag and/or In additions on the microstructure and tensile properties of Sn–Cu eutectic solder alloy. Adding Ag and…”
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Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn by El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M.

“…•Small amounts of Zn have been added into Sn–1Ag–0.3Cu solder.•Zn addition refined the microstructure and developed the formation of (Cu,Ag)5Zn8.•This effect…”
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Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions by El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.A., Ibrahiem, A.A.

“…In this paper, we report a convenient and informative procedure for improving the integrity and reliability of eutectic Sn-9Zn solder using minor alloying…”
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Stability and control of HVDC and AC transmissions in parallel by Hammad, A.E.

“…A generic concept combining transient angle and voltage stabilities of parallel AC/DC transmission is introduced. It proves that HVDC schemes in parallel…”
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Efficacy of multiple biocontrol agents against the sweet potato whitefly Bemisia tabaci (Gennadius) (Homoptera: Aleyrodidae) on tomato by Jazzar, C, Hammad, E.A.F

“…:  Biological control provides an environmentally harmonious and potentially stable management tactic to combat noxious pests such as Bemisia tabaci, notorious…”
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Effect of tillage and field condition on soil physical properties, cane and sugar yields in Vertisols of Kenana Sugar Estate, Sudan by Hammad, E.A, Dawelbeit, M.I

“…An experiment was conducted to study the effect of heavy disc harrowing in combination with chisel ploughing to depths of 10, 20, and 30 cm, on soil physical…”
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Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni by Hammad, A.E., El-Taher, A.M.

“…The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with…”
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