Search Results - "Hössinger, Andreas"

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  1. 1

    ReaxFF Reactive Molecular Dynamics Study of Orientation Dependence of Initial Silicon Carbide Oxidation by Šimonka, Vito, Hössinger, Andreas, Weinbub, Josef, Selberherr, Siegfried

    “…We analyze the early stage of the highly anisotropic silicon carbide oxidation behavior with reactive force field molecular dynamics simulations. The oxidation…”
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    Journal Article
  2. 2

    Automatic grid refinement for thin material layer etching in process TCAD simulations by Lenz, Christoph, Manstetten, Paul, Aguinsky, Luiz Felipe, Rodrigues, Francio, Hössinger, Andreas, Weinbub, Josef

    Published in Solid-state electronics (01-02-2023)
    “…Thin material layers are common structures in modern semiconductor device fabrication and are particularly necessary for light-emitting diodes and…”
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    Journal Article
  3. 3

    Curvature based feature detection for hierarchical grid refinement in TCAD topography simulations by Lenz, Christoph, Toifl, Alexander, Quell, Michael, Rodrigues, Francio, Hössinger, Andreas, Weinbub, Josef

    Published in Solid-state electronics (01-05-2022)
    “…•Improved simulation time of selective epitaxial growth simulation.•Curvature of the waver surface utilized to detect features.•Locally increased grid…”
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    Journal Article
  4. 4

    Modeling incomplete conformality during atomic layer deposition in high aspect ratio structures by Aguinsky, Luiz Felipe, Rodrigues, Frâncio, Reiter, Tobias, Klemenschits, Xaver, Filipovic, Lado, Hössinger, Andreas, Weinbub, Josef

    Published in Solid-state electronics (01-03-2023)
    “…Atomic layer deposition allows for precise control over film thickness and conformality. It is a critical enabler of high aspect ratio structures, such as 3D…”
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    Journal Article
  5. 5

    A Complementary Topographic Feature Detection Algorithm Based on Surface Curvature for Three-Dimensional Level-Set Functions by Lenz, Christoph, Aguinsky, Luiz Felipe, Hössinger, Andreas, Weinbub, Josef

    Published in Journal of scientific computing (01-03-2023)
    “…The level-set method is widely used in expanding front simulations in numerous fields of computational research, such as computer graphics, physics, or…”
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    Journal Article
  6. 6

    A shared memory parallel multi-mesh fast marching method for re-distancing by Diamantopoulos, Georgios, Hössinger, Andreas, Selberherr, Siegfried, Weinbub, Josef

    Published in Advances in computational mathematics (01-08-2019)
    “…A common problem arising in expanding front simulations is to restore the signed distance field property of a discretized domain (i.e., a mesh), by calculating…”
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    Journal Article
  7. 7

    Accelerating Flux Calculations Using Sparse Sampling by Gnam, Lukas, Manstetten, Paul, Hössinger, Andreas, Selberherr, Siegfried, Weinbub, Josef

    Published in Micromachines (Basel) (26-10-2018)
    “…The ongoing miniaturization in electronics poses various challenges in the designing of modern devices and also in the development and optimization of the…”
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    Journal Article
  8. 8

    Accelerated redistancing for level set-based process simulations with the fast iterative method by Weinbub, Josef, Hössinger, Andreas

    Published in Journal of computational electronics (01-12-2014)
    “…The finite iterative method is compared to an industry-hardened fast marching method for accelerating the redistancing step essential for Level Set-based…”
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    Journal Article
  9. 9

    Shared-memory block-based fast marching method for hierarchical meshes by Quell, Michael, Diamantopoulos, Georgios, Hössinger, Andreas, Weinbub, Josef

    “…The fast marching method is commonly used in expanding front simulations in various fields, such as, fluid dynamics, computer graphics, and in…”
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    Journal Article
  10. 10

    Evaluation of the shared-memory parallel Fast Marching Method for re-distancing problems by Diamantopoulos, Georgios, Weinbub, Josef, Hossinger, Andreas, Selberherr, Siegfried

    “…The Fast Marching Method is widely used for the solution of the Eikonal equation in problems arising in science and engineering applications. A common…”
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    Conference Proceeding
  11. 11

    The Level-Set Method for Multi-Material Wet Etching and Non-Planar Selective Epitaxy by Toifl, Alexander, Quell, Michael, Klemenschits, Xaver, Manstetten, Paul, Hossinger, Andreas, Selberherr, Siegfried, Weinbub, Josef

    Published in IEEE access (2020)
    “…We present numerical methods to enable accurate and robust level-set based simulation of anisotropic wet etching and non-planar epitaxy for semiconductor…”
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    Journal Article
  12. 12
  13. 13

    Phenomenological modeling of low-bias sulfur hexafluoride plasma etching of silicon by Aguinsky, Luiz Felipe, Rodrigues, Frâncio, Wachter, Georg, Trupke, Michael, Schmid, Ulrich, Hössinger, Andreas, Weinbub, Josef

    Published in Solid-state electronics (01-05-2022)
    “…•Low-bias plasma etching of Si using SF6 is a near-isotropic alternative to wet etching.•Precise topography simulation of the final etched geometries is…”
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    Journal Article
  14. 14

    3D modeling of feature-scale fluorocarbon plasma etching in silica by Rodrigues, Frâncio, Felipe Aguinsky, Luiz, Lenz, Christoph, Hössinger, Andreas, Weinbub, Josef

    Published in Journal of computational electronics (01-10-2023)
    “…Fluorocarbon dry etching of vertical silica-based structures is essential to the fabrication of advanced complementary metal-oxide-semiconductor and dynamic…”
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    Journal Article
  15. 15

    Parallelization of a Monte Carlo ion implantation simulator by Hossinger, A., Langer, E., Selberherr, S.

    “…We present a parallelization method based on message passing interface (MPI) for a Monte Carlo program for two-dimensional (2-D) and three-dimensional (3-D)…”
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    Journal Article
  16. 16

    Anisotropic interpolation method of silicon carbide oxidation growth rates for three-dimensional simulation by Šimonka, Vito, Nawratil, Georg, Hössinger, Andreas, Weinbub, Josef, Selberherr, Siegfried

    Published in Solid-state electronics (01-02-2017)
    “…We investigate anisotropical and geometrical aspects of hexagonal structures of Silicon Carbide and propose a direction dependent interpolation method for…”
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    Journal Article
  17. 17

    Framework to model neutral particle flux in convex high aspect ratio structures using one-dimensional radiosity by Manstetten, Paul, Filipovic, Lado, Hössinger, Andreas, Weinbub, Josef, Selberherr, Siegfried

    Published in Solid-state electronics (01-02-2017)
    “…We present a computationally efficient framework to compute the neutral flux in high aspect ratio structures during three-dimensional plasma etching…”
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    Journal Article
  18. 18

    Parallel Velocity Extension for Level-Set-Based Material Flow on Hierarchical Meshes in Process TCAD by Quell, Michael, Suvorov, Vasily, Hossinger, Andreas, Weinbub, Josef

    Published in IEEE transactions on electron devices (01-11-2021)
    “…The level-set method is widely used for high-accuracy 3-D topography simulations in process technology computer-aided design (TCAD) because of its robustness…”
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    Journal Article
  19. 19

    Empirical Model for Electrical Activation of Aluminum- and Boron-Implanted Silicon Carbide by Simonka, Vito, Hossinger, Andreas, Weinbub, Josef, Selberherr, Siegfried

    Published in IEEE transactions on electron devices (01-02-2018)
    “…Accurate modeling of the electrical properties of impurities in semiconductors is essential for the mandatory support of the development of novel semiconductor…”
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    Journal Article
  20. 20

    Molecular dynamics study of Al implantation in 4H-SiC by Leroch, Sabine, Stella, Robert, Hossinger, Andreas, Filipovic, Lado

    “…We have performed a molecular dynamics study of Al-implantation in 4H-SiC while investigating the types of defects produced and their quantity depending on the…”
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    Conference Proceeding