Search Results - "Hölck, Ole"

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    Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation by Pak, Anna, Nanbakhsh, Kambiz, Hölck, Ole, Ritasalo, Riina, Sousa, Maria, Van Gompel, Matthias, Pahl, Barbara, Wilson, Joshua, Kallmayer, Christine, Giagka, Vasiliki

    Published in Micromachines (Basel) (30-03-2022)
    “…Liquid crystal polymer (LCP) has gained wide interest in the electronics industry largely due to its flexibility, stable insulation and dielectric properties…”
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    Journal Article
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    Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis by Franieck, Erick, Fleischmann, Martin, Hölck, Ole, Kutuzova, Larysa, Kandelbauer, Andreas

    Published in Polymers (26-05-2021)
    “…We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding…”
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    Journal Article
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    Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals by Hartmann, Steffen, Sturm, Heinz, Blaudeck, Thomas, Hölck, Ole, Hermann, Sascha, Schulz, Stefan E, Gessner, Thomas, Wunderle, Bernhard

    Published in Journal of materials science (01-02-2016)
    “…To study the mechanical interface behavior of single-walled carbon nanotubes (CNTs) embedded in a noble metal, we performed CNT–metal pull-out tests with in…”
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    Journal Article
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    Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations by Hölck, Ole, Böhning, Martin, Heuchel, Matthias, Siegert, Martin R., Hofmann, Dieter

    Published in Journal of membrane science (01-02-2013)
    “…Detailed atomistic simulations were carried out for swelling polymer/gas systems related to experimental sorption and dilation data for CO2 and CH4 in three…”
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    Journal Article
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    Multiscale perspectives of interface delamination in microelectronic packaging applications by Iwamoto, Nancy, Hölck, Ole, Noijen, Sander

    Published in Molecular simulation (01-07-2011)
    “…With the increasing complexity and ongoing miniaturisation of microelectronic systems, reliability issues and their associated structural dimensions cross over…”
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    Journal Article
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    Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers by Hölck, Ole, Heuchel, Matthias, Böhning, Martin, Hofmann, Dieter

    “…A molecular modeling investigation of dilation effects induced by sorbed gas molecules in two glassy polymers is presented. As experimental reference, integral…”
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    Journal Article
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    Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polysulfone and poly(ether sulfone) by Heuchel, Matthias, Böhning, Martin, Hölck, Ole, Siegert, Martin R., Hofmann, Dieter

    “…Atomistic packing models have been created, which help to better understand the experimentally observed swelling behavior of glassy polysulfone and poly (ether…”
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    Journal Article
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    CO2 Sorption Induced Dilation in Polysulfone:  Comparative Analysis of Experimental and Molecular Modeling Results by Hölck, Ole, Siegert, Martin R, Heuchel, Matthias, Böhning, Martin

    Published in Macromolecules (26-12-2006)
    “…Experimental sorption and dilation data of the polysulfone/CO2 system at 308 K and pressures up to 50 bar were measured utilizing a gravimetric sorption…”
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    Journal Article
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    In-situ infrared spectroscopy for chemical analysis in electronic packaging processes by Niegisch, Corinna, Haag, Sabine, Braun, Tanja, Holck, Ole, Schneider-Ramelow, Martin

    “…Epoxy resins are commonly used for the encapsulation of electronic components in electronic packaging processes. The chemical crosslinking process and…”
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    Conference Proceeding
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    Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology by Huber, Saskia, Stegmaier, Andreas, van Dijk, Marius, Nguyen, Nina, Holck, Ole, Wittler, Olaf, Schneider-Ramelow, Martin

    “…During the production of Fan-Out Wafer/Panel Level Packages (FOWLP/ FOPLP), one of the key challenges is to keep the warpage low. Many production steps are…”
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    Conference Proceeding
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    A Closer Look to Fan-out Panel Level Packaging by Braun, Tanja, Holck, Ole, Voitel, Marcus, Obst, Mattis, Voges, Steve, Becker, Karl-Friedrich, Aschenbrenner, Rolf, Schneider-Ramelow, Martin

    “…Fan-out Wafer and Panel Level Packaging are two of the dominating trends in microelectronics packaging. Both approaches with different flavors as RDL last…”
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    Conference Proceeding
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    Atomistic packing models for experimentally investigated swelling states induced by CO 2 in glassy polysulfone and poly(ether sulfone) by Heuchel, Matthias, Böhning, Martin, Hölck, Ole, Siegert, Martin R., Hofmann, Dieter

    “…Atomistic packing models have been created, which help to better understand the experimentally observed swelling behavior of glassy polysulfone and poly (ether…”
    Get full text
    Journal Article
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