Search Results - "Hölck, Ole"
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1
Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation
Published in Micromachines (Basel) (30-03-2022)“…Liquid crystal polymer (LCP) has gained wide interest in the electronics industry largely due to its flexibility, stable insulation and dielectric properties…”
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2
Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
Published in Polymers (26-05-2021)“…We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding…”
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3
Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Published in Journal of materials science (01-02-2016)“…To study the mechanical interface behavior of single-walled carbon nanotubes (CNTs) embedded in a noble metal, we performed CNT–metal pull-out tests with in…”
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4
Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations
Published in Journal of membrane science (01-02-2013)“…Detailed atomistic simulations were carried out for swelling polymer/gas systems related to experimental sorption and dilation data for CO2 and CH4 in three…”
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5
Multiscale perspectives of interface delamination in microelectronic packaging applications
Published in Molecular simulation (01-07-2011)“…With the increasing complexity and ongoing miniaturisation of microelectronic systems, reliability issues and their associated structural dimensions cross over…”
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6
Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers
Published in Journal of polymer science. Part B, Polymer physics (01-01-2008)“…A molecular modeling investigation of dilation effects induced by sorbed gas molecules in two glassy polymers is presented. As experimental reference, integral…”
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7
Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polysulfone and poly(ether sulfone)
Published in Journal of polymer science. Part B, Polymer physics (01-07-2006)“…Atomistic packing models have been created, which help to better understand the experimentally observed swelling behavior of glassy polysulfone and poly (ether…”
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8
Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01-04-2014)“…We present investigations of pull-out tests on CNTs embedded in palladium by means of molecular dynamics (MD) and compare our results of maximum pull-out…”
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Conference Proceeding -
9
CO2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results
Published in Macromolecules (26-12-2006)“…Experimental sorption and dilation data of the polysulfone/CO2 system at 308 K and pressures up to 50 bar were measured utilizing a gravimetric sorption…”
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10
Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy
Published in Mechatronics (Oxford) (01-12-2016)“…In this paper we present results of our recent efforts to understand the mechanical interface behaviour of single-walled carbon nanotubes (SWCNTs) embedded in…”
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11
In-situ infrared spectroscopy for chemical analysis in electronic packaging processes
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13-09-2022)“…Epoxy resins are commonly used for the encapsulation of electronic components in electronic packaging processes. The chemical crosslinking process and…”
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Conference Proceeding -
12
Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01-05-2023)“…During the production of Fan-Out Wafer/Panel Level Packages (FOWLP/ FOPLP), one of the key challenges is to keep the warpage low. Many production steps are…”
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Conference Proceeding -
13
Gas-induced structural changes in polymeric membrane materials combining experiment, phenomenological models and simulation
Published in Desalination (20-11-2006)Get full text
Journal Article Conference Proceeding -
14
A Closer Look to Fan-out Panel Level Packaging
Published in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (07-03-2023)“…Fan-out Wafer and Panel Level Packaging are two of the dominating trends in microelectronics packaging. Both approaches with different flavors as RDL last…”
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Conference Proceeding -
15
Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polymers
Published in Desalination (20-11-2006)Get full text
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16
Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01-06-2021)“…In the last years, the increasing demand for ever higher data rates in wireless communication has exposed the limits of current sub-6 GHz communication systems…”
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Conference Proceeding -
17
CO 2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results
Published in Macromolecules (01-12-2006)Get full text
Journal Article -
18
Atomistic packing models for experimentally investigated swelling states induced by CO 2 in glassy polysulfone and poly(ether sulfone)
Published in Journal of polymer science. Part B, Polymer physics (01-07-2006)“…Atomistic packing models have been created, which help to better understand the experimentally observed swelling behavior of glassy polysulfone and poly (ether…”
Get full text
Journal Article -
19
Atomistic packing models for experimentally investigated swelling states induced by CO 2 in glassy polymers
Published in Desalination (2006)Get full text
Journal Article -
20
An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01-04-2016)“…In this paper we present our recent efforts to develop an in situ tensile test device for thermo-mechanical characterization of interfaces between…”
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Conference Proceeding