Search Results - "Guoshun, Wan"

Effects of Mg or Sr Doping on the Intrinsic Characteristics and Absorption Properties of Micro-nano BaFe12O19 Hollow Multiphase Ceramic Microspheres by Hongfei, Lou, Jianjiang, Wang, Baocai, Xu, Guoshun, Wan, Yongshen, Hou, Haitao, Gao, Weimin, Ye

“…Micro-nano BaM hollow multiphase ceramic microspheres (HMCMs) and Mg-doped and Sr-doped BaM HMCMs were prepared by combining the low-temperature self-reactive…”
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Effect of flame partition and flight behaviors on intrinsic characteristics and absorption properties of hollow ceramic microspheres by Lou, Hongfei, Wang, Jianjiang, Xu, Baocai, Zhao, Zhining, Wan, Guoshun, Hou, Yongshen

“…•High-speed photography used for flame field partition and flight combustion behaviors.•Relationship between intrinsic characteristics of HMCMs and flame…”
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Damage analysis of carbon fiber composites exposed to combined lightning current components D and C by Dong, Qi, Wan, Guoshun, Guo, Yunli, Zhang, Leian, Wei, Xiuting, Yi, Xiaosu, Jia, Yuxi

“…The damage properties of carbon fiber reinforced polymer (CFRP) laminates exposed to combined lightning components D and C were explored by standardized…”
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Multifunctional nickel‐coated carbon fiber veil for improving both fracture toughness and electrical performance of carbon fiber/epoxy composite laminates by Liu, Hui, Guo, Yunli, Zhou, Yong, Wan, Guoshun, Chen, Zhongli, Jia, Yuxi

“…The poor lightning strike resistance limits the application of carbon fiber‐reinforced polymer (CFRP) composites in aircraft. Multifunctional fiber composites…”
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Analysis on electrical and thermal conduction of carbon fiber composites under lightning based on electrical-thermal-chemical coupling and arc heating models by Wan, Guoshun, Dong, Qi, Zhi, Jieying, Guo, Yunli, Yi, Xiaosu, Jia, Yuxi

“…Based on arc heating involved electrical-thermal-chemical coupling models of CFRPs subjected to combined lightning components D and C, the changing…”
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Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics by Wan, Guoshun, Dong, Qi, Sun, Xiaochen, Zheng, Hao, Cheng, Mengxuan, Qiao, Wen, Jia, Yuxi

“…This study explores the application of Convolutional Neural Networks (CNN) in predicting the partitioned homogeneous properties (PHPs) of electronic product…”
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Simulated Analysis of Lightning-induced Mechanical Damages in Fiber Reinforced Composites Based on a Pyrolysis-affected Damage Constitutive Model by Wan, Guoshun, Dong, Qi, Li, Ting, Sun, Xiaochen, Jia, Yuxi

“…Carbon fiber reinforced polymers (CFRPs) will exhibit complex coupling responses accompanied by multi-physical damages under the strike of lightning, which…”
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Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect by Wan, Guoshun, Dong, Qi, Sun, Xiaochen, Zheng, Hao, Cheng, Mengxuan, Zhao, Zhiyan, Jia, Yuxi

“…This study introduces a cross-scale numerical analysis approach for modeling the lamination process and predicting the post-lamination warping deformation of…”
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Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints by Zheng, Ruiqian, Li, Wenqian, Cheng, Mengxuan, Zheng, Hao, Zhao, Zhiyan, Wan, Guoshun, Jia, Yuxi

“…Printed Circuit Board Assemblies (PCBA) are crucial components of integrated circuit products. To address the issue of solder joint failure in PCBA under…”
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Coupled thermal-mechanical damage model of laminated carbon fiber/resin composite subjected to lightning strike by Dong, Qi, Wan, Guoshun, Ping, Lu, Guo, Yunli, Yi, Xiaosu, Jia, Yuxi

“…The degradation model of stiffness matrix containing thermal-mechanical coupling damage was constructed by the user-defined subroutine VUMAT on the basis of…”
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Highly efficient and accurate algorithm for multiscale equivalent modeling and mechanical performance simulation of printed circuit boards by Wan, Guoshun, Dong, Qi, Sun, Xiaochen, Cheng, Mengxuan, Zheng, Hao, Zhao, Zhiyan, Jia, Yuxi

“…The increasing prevalence of reliability issues related to printed circuit boards (PCBs) has led to significant interest in applying finite element analysis…”
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Experimental and numerical studies on low‐velocity impact damage of composite laminates toughened by nickel‐coated carbon fiber veil by Liu, Hui, Qu, Peng, Guo, Yunli, Zhou, Yong, Wan, Guoshun, Jia, Yuxi

“…The low‐velocity impact response of carbon fiber composite laminates toughened by nickel‐coated carbon fiber (NiCF) veil interleaves was investigated…”
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Lightning Damage of Carbon Fiber/Epoxy Laminates with Interlayers Modified by Nickel-Coated Multi-Walled Carbon Nanotubes by Dong, Qi, Wan, Guoshun, Xu, Yongzheng, Guo, Yunli, Du, Tianxiang, Yi, Xiaosu, Jia, Yuxi

“…The numerical model of carbon fiber reinforced polymer (CFRP) laminates with electrically modified interlayers subjected to lightning strike is constructed…”
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Numerical analysis and fiber Bragg grating monitoring of thermocuring processes of carbon fiber/epoxy laminates by Wang, Qinglin, Gao, Linlin, Wang, Xiaoxia, Dong, Qi, Wan, Guoshun, Du, Tianxiang, Guo, Yunli, Zhang, Chen, Jia, Yuxi

“…A three-dimensional differential viscoelastic model combining the effects of curing degree, thermal expansion, chemical shrinkage and stress relaxation for…”
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Effects of Mg or Sr Doping on the Intrinsic Characteristics and Absorption Properties of Micro-nano BaFe sub(12)O sub(19) Hollow Multiphase Ceramic Microspheres by Lou, Hongfei, Wang, Jianjiang, Xu, Baocai, Wan, Guoshun, Hou, Yongshen, Gao, Haitao, Ye, Weimin

“…Micro-nano BaM hollow multiphase ceramic microspheres (HMCMs) and Mg-doped and Sr-doped BaM HMCMs were prepared by combining the low-temperature self-reactive…”
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New Homogenization Method for Equivalent Thermal Expansion Coefficient of Wiring Structures Using Embedded Unit Cells by Zhao, Zhiyan, Wan, Guoshun, Jia, Yuxi

“…Thermal mismatch, as a crucial factor affecting the thermal reliability of IC products, is of great importance to control. Due to the presence of multi-level…”
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New Equivalent Approach and Optimized Strategy for Evaluating Warpage Characteristics in PCB Milling Process by Cheng, Mengxuan, Wan, Guoshun, Jia, Yuxi

“…In the production of large-scale multi-layer Printed Circuit Boards (PCBs), warpage is a common phenomenon that can lead to various reliability issues during…”
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Efficient Prediction of Equivalent Thermo-Mechanical Properties for Embedded Unit Cells in Reliability Simulations of Complex Circuit Wiring Structures Using a Transformer-CNN Model by Qiao, Wen, Zhao, Zhiyan, Wan, Guoshun, Zheng, Hao, Li, Wenqian, Cheng, Mengxuan, Zhao, Xiaohui, Jia, Yuxi

“…In the field of reliability simulation and analysis of complex circuit wiring structures, the remarkable effectiveness of the Convolutional Neural Network…”
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Efficient and Accurate Calculation of Equivalent Thermal Conductivity of Wiring Structures in Mesoscopic Scale and Intelligent Prediction by Zheng, Hao, Zhao, Zhiyan, Wan, Guoshun, Cheng, Mengxuan, Qiao, Wen, Zheng, Ruiqian, Jia, Yuxi

“…With the development of artificial intelligence and autonomous driving technologies, the complexity of the conductive layers (CDLs) in the integrated circuit…”
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