Search Results - "Guo, Z.R."

Effect of iron saturation level of lactoferrin on osteogenic activity in vitro and in vivo by Wang, X Y, Guo, H Y, Zhang, W, Wen, P C, Zhang, H, Guo, Z R, Ren, F Z

“…We studied the effect of iron saturation level on the osteogenic activity of lactoferrin (LF) in vitro and in vivo. Different iron saturation levels of LF…”
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The association of circulating endotoxaemia with the development of multiple organ failure in burned patients by Yao, Y.M., Sheng (C. Y. Sheng), Z.Y., Tian, H.M., Yu, Y., Wang, Y.P., Yang, H.M., Guo, Z.R., Gao, W.Y.

“…In this study, we examined the relationship of plasma endotoxin levels to the development of multiple organ failure (MOF), and the outcome in patients with…”
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Local Approximation by Modified Szász Operators by Guo, Z.R., Zhou, D.X.

“…The concept of locally Hölder continuous functions with exponent α (0 < α ≤ 1) on a subset E subset of [0, ∞) is defined. This definition includes the concepts…”
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Poly-residue-induced contact failures in 0.18 /spl mu/m technology by Teh, C.S., Song, Z.H., Dai, J.Y., Guo, Z.R., Redkar, S.

“…During the qualification of a 0.18 /spl mu/m SRAM process technology, severe yield loss due to random single bit and dual bit failures were encountered. This…”
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Application of contact-level ion-beam induced passive voltage contrast in failure analysis of static random access memory by Song, Z.G., Qian, G., Dai, J.Y., Guo, Z.R., Loh, S.K., Teh, C.S., Redkar, S.

“…The demand for improvement of device speed and reduction of power consumption has driven semiconductor devices to be miniaturized continuously. To develop new…”
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Studies on stacking faults and crystalline defects in fabrication silicon wafer substrate by Hua, Y.N., Lim, S.L., An, L.H., Guo, Z.R., Fan, Y.K.

“…Silicon crystalline defects in production silicon wafers affect the yield. In this paper, the 155 Wright etch was used to identify the root causes of silicon…”
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Contamination analyses of Al bond pads using FIB/SEM/EDX by Zhao, S.P., Hua, Y.N., Goh, G.P., Guo, Z.R., Chau, K.W.

“…Aluminum bond pads on semiconductor chips play an important role in IC device reliability and yield. Contaminated Al bond pads can cause poor intermetallic…”
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