Search Results - "Guerrero, Alice"

Process Challenges During CVD Oxide Deposition on the Backside of 20-\mu m Thin 300-mm Wafers Temporarily Bonded to Glass Carriers by Kennes, Koen, Guerrero, Alice, Salahouelhadj, Abdellah, Suhard, Samuel, Derakhshandeh, Jaber, Phommahaxay, Alain, Brems, Steven, Beyer, Gerald, Beyne, Eric

“…A temporary carrier system is evaluated during several backside processing steps on ultra-thin wafers, down to 20\ \mu\mathrm{m} , with the main focus centered…”
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Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer by Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bauder, Olga, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Liu, Xiao, Schmidt, Thomas, Beyer, Gerald, Beyne, Eric

“…Current roadblocks within the collective die-to-wafer bonding flow, limiting die-transfer yield and throughput, are identified and discussed. Based on the…”
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Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material by Phommahaxay, Alain, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Xiao Liu, Yess, Kim, Arnold, Kim, Spiess, Walter, Griesbach, Tim, Rapps, Thomas, Lutter, Stefan

“…Over the past few years, temporary bonding has spread together with the development of 3D stacked IC (SIC) technology. Maturity of the various processes has…”
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Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications by Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Murdoch, Gayle, Miller, Andy, Rebibis, Kenneth, Guerrero, Alice, McCutcheon, Jeremy, Privett, Mark, Neidrich, Jason, Beyer, Gerald, Beyne, Eric

“…Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding has become a key element in device…”
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Temporary bonding for High-topography Applications: Spin-on Material Versus Dry Film by Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Guerrero, Alice, Bailey, Susan, Privett, Mark, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

“…Handling wafers with sub-100 μm thicknesses requires a support or carrier wafer during handling, transport and processing in a semiconductor process line. This…”
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Improving the Wafer Thinning Flow Robustness for 2.5D & 3D Applications by Jedidi, Nader, Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Beyer, Gerald, Beyne, Eric

“…Packaging technologies (2.5D, 3D) require the thinning of device wafers, down to sub 100 µm in thickness. While using a temporary carrier for that purpose has…”
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Multi-tier die stacking through collective die-to-wafer hybrid bonding by Kennes, Koen, Lin, Ye, Suhard, Samuel, Bex, Pieter, Cuypers, Dieter H., Guerrero, Alice, Bumueller, Dennis, Phommahaxay, Alain, Beyer, Gerald, Beyne, Eric

“…A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a…”
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Carrier Systems for Collective Die-to-Wafer Bonding by Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Suhard, Samuel, Bex, Pieter, Brems, Steven, Liu, Xiao, Tussing, Sebastian, Beyer, Gerald, Beyne, Eric

“…Several alternative carrier systems for collective die-to-wafer transfer, using the laser debonding technique, are evaluated. The principles of laser debonding…”
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Acoustic modulation during laser debonding of collective hybrid bonded dies by Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bumueller, Dennis, Suhard, Samuel, Bex, Pieter, Tussing, Sebastian, Liu, Xiao, Beyer, Gerald, Beyne, Eric

“…Laser debonding is assessed as an alternative to mechanical peel debonding in a collective hybrid bonding flow. Potential risks associated with the laser, such…”
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Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up by Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arnold, Kim

“…As the need for higher degrees of function integration on chips continues to rise, chip-to-chip connection density exponentially increases. The continuous push…”
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Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up by Phommahaxay, Alain, Podpod, Arnita, Slabbekoorn, John, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Arnold, Kim

“…Thin substrate handling has become one of the cornerstone technologies that enabled the development of 3D stacked ICs over the past years. Temporary wafer…”
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The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics by Phommahaxay, Alain, Beyer, Gerald, Radu, Iuliana, Beyne, Eric, Guerrero, Alice, Prenger, Luke, Yess, Kim, Arnold, Kim, Tussing, Sebastian, Spiess, Walter, Rapps, Thomas, Kennes, Koen, Lutter, Stefan, Podpod, Arnita, Brems, Steven, Slabbekoorn, John, Sleeckx, Erik, Huyghebaert, Cedric, Asselberghs, Inge, Miller, Andy

“…Thin substrate handling has become one of the cornerstone technologies that enabled the development of 3D stacked ICs over the past years. Temporary wafer…”
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Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift by Podpod, Arnita, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Liu, Xiao, Wu, Qi, Yess, Kim, Arnold, Kim, Phommahaxay, Alain, Bex, Pieter, Kennes, Koen, Bertheau, Julien, Arumugam, Hariharan, Cochet, Tom, Rebibis, Kenneth, Sleeckx, Erick

“…Next-generation temporary bonding adhesive material is introduced into imec's high interconnect density flip chip on fan-out wafer-level package (FC FOWLP)…”
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Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer by Phommahaxay, Alain, Jourdain, Anne, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Yess, Kim, Arnold, Kim

“…Over the past few years, temporary bonding has expanded together with the development of 3D stacked IC (SIC) technology. As maturity of the various processes…”
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Single-release-layer process for temporary bonding applications in the 3D integration area by Jourdain, Anne, Phommahaxay, Alain, Velenis, Dimitrios, Guerrero, Alice, Dongshun Bai, Yess, Kim, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

“…One of the key aspects in 3D technology today is the bonding/debonding of a device wafer to a carrier wafer to enable wafer thinning and subsequent backside…”
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Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding by Phommahaxay, A., Jourdain, A., Verbinnen, G., Woitke, T., Bisson, P., Gabriel, M., Spiess, W., Guerrero, A., McCutcheon, J., Puligadda, R., Bex, P., Van den Eede, A., Swinnen, B., Beyer, G., Miller, A., Beyne, E.

“…Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in…”
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Process characterization of thin wafer debonding with thermoplastic materials by Phommahaxay, Alain, Jourdain, Anne, Verbinnen, Greet, Woitke, Tobias, Stieber, Ralf, Bisson, Peter, Gabriel, Markus, Spiess, Walter, Guerrero, Alice, McCutcheon, Jeremy, Puligadda, Rama, Bex, Pieter, Van den Eede, Axel, Swinnen, Bart, Beyer, Gerald, Miller, Andy, Beyne, Eric

“…Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in…”
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