Search Results - "Guan Lim, Teck"

A SiGe BiCMOS Transmitter/Receiver Chipset With On-Chip SIW Antennas for Terahertz Applications by Sanming Hu, Yong-Zhong Xiong, Bo Zhang, Lei Wang, Teck-Guan Lim, Minkyu Je, Madihian, M.

“…This paper presents a terahertz (THz) transmitter (Tx) and receiver (Rx) chipset operating around 400 GHz in 0.13- μm SiGe BiCMOS technology. The Tx chip…”
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77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing by Sun, Mei, Guan Lim, Teck, Soon Wee Ho, David, Wu, Jiaqi, Chai, Tai Chong, Ma, Yugang

“…77-GHz automotive multiple input multiple output (MIMO) radar is traditionally implemented in the bulky PCB board in a cascaded format to achieve a high…”
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135-GHz Micromachined On-Chip Antenna and Antenna Array by Chu, Hui, Guo, Yong-Xin, Lim, Teck-Guan, Khoo, Yee Mong, Shi, Xiangquan

“…This paper presents the design, fabrication and "on-wafer" characterization of multi-membrane-supported and polymer-cavity-backed monopole antenna and 2× 1…”
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Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application by Hu, Sanming, Xiong, Yong-Zhong, Wang, Lei, Li, Rui, Shi, Jinglin, Lim, Teck-Guan

“…This paper presents a cavity-backed slot (CBS) antenna for millimeter-wave applications. The cavity of the antenna is fully filled by polymer material. This…”
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0.7-dB Insertion-Loss D-Band Lange Coupler Design and Characterization in 0.13 μm SiGe BiCMOS Technology by Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan, Yuan, Xiao-Jun

“…Design, measurement, and characterization of a low-loss Lange coupler on Si-substrate up to 170 GHz are presented in this paper. How to determine the value of…”
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Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via by LIU, En-Xiao, LI, Er-Ping, EWE, Wei-Bin, HUI MIN LEE, TECK GUAN LIM, SHAN GAO

“…This paper presents a compact wideband equivalent circuit model for electrical modeling of through-silicon vias (TSVs) in 3-D stacked integrated circuits and…”
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Millimeter-Wave Frequency Doubler With Transistor Grounded-Shielding Structure in 0.13-μm SiGe BiCMOS Technology by LEI WANG, XIONG, Yong-Zhong, BO ZHANG, HU, San-Ming, LIM, Teck-Guan

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Ka-band CPW-to-slotline transition in photoimageable thick film technology for tapered slot antenna applications by Lim, Teck-Guan, Ang, Hwee-Ngoh, Robertson, Ian D., Weiss, Bernard L.

“…A simple and compact coplanar waveguide to slotline transition operating from 22 to 34 GHz is presented. It is designed for feeding tapered slot antennas…”
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Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration by Li, Rui, Jin, Cheng, Ong, Siong Chiew, Lim, Teck Guan, Chang, Ka Fai, Ho, Soon Wee

“…In this paper, a 77-GHz automotive radar sensor transceiver front-end module is packaged with a novel embedded wafer level packaging (EMWLP) technology. The…”
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TSV Technology for Millimeter-Wave and Terahertz Design and Applications by Hu, Sanming, Wang, Lei, Xiong, Yong-Zhong, Lim, Teck Guan, Zhang, Bo, Shi, Jinglin, Yuan, Xiaojun

“…The through silicon via (TSV) technology provides a promising option to realize a compact millimeter-wave (mmW) and terahertz (THz) system with high…”
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273-GHz 2X Subharmonic Up-Conversion Mixer for System-on-Package Applications by Li, Rui, Lim, Teck Guan, Ho, Soon Wee

“…In this paper, a 273-GHz 2X subharmonic passive mixer is proposed for system-on-package applications. The mixer is designed and implemented using thin-film…”
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High Density TSV-Free Interposer (TFI) Packaging with Submicron Cu Damascene RDLs for Integration of CPU/GPU and HBM by Kawano, Masaya, Chum-Mei Wang, Hong-Yu Li, Mian-Zhi Ding, Lim, Sharon Pei-Siang, Teck-Guan Lim, Zi-Hao Chen, Fa-Xing Che

“…TSV-Free Interposer (TFI) packaging technology was developed for central/graphics processing unit (CPU/GPU) and stacked memory system-in-package (SiP)…”
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Millimeter-Wave Frequency Doubler With Transistor Grounded-Shielding Structure in }\mu} SiGe BiCMOS Technology by Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan

“…A low conversion-loss monolithic frequency doubler has been developed for D-band signal generation in 0.13-μm SiGe BiCMOS technology. The circuit uses a…”
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Characterization of FOWLP Antenna in Packages by Mei, Sun, Guan, Lim Teck, Lin, Zhou

“…The Antenna in Package (AiP) based on Fan-Out Wafer-Level-Packaging (FOWLP) enables compact beam steering solutions for Satcom On the Move (SOTM) and 5G…”
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Enhancement of Silicon-Based Inductor Q-Factor Using Polymer Cavity by Khoo, Yee Mong, Lim, Teck Guan, Ho, Soon Wee, Li, Rui, Xiong, Yong-Zhong, Zhang, Xiaowu

“…A simple low-cost post-complementary metal-oxide-semiconductor-compatible process to enhance the performance of the planar spiral inductor in standard silicon…”
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Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit by Wai, Leong Ching, Guan Lim, Teck, Chong, Ser Choong, Zhou, Lin

“…In this paper, the flip chip joints formed by using gold (Au) stud on commercial-off-the shelf (COTS) monolithic microwave integrate circuit (MMIC) designed…”
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Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application by Chen Zihao, Lim Teck Guan, Ho, David Soon Wee, Bhattacharya, Surya

“…In this paper, a 3D integration package of antenna and chip is proposed. A patch antenna array is integrated with RF chip on fan-out wafer level packaging…”
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Characterization of 224 Gbps/lambda Interconnects in Co-Packaged Optics for Hyperscale Data Centers and AI/ML Clusters by Wu, Jiaqi, Lim, Teck Guan, Gourikutty, Sajay Bhuvanendran Nair, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya

“…In this work, interconnects between Optical Engine (OE) and switch in a Co-Packaged Optics (CPO) architecture are characterized. The OE is fabricated in…”
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Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration by Lin, Zhou, Guan, Lim Teck, Jiaqi, Wu, Feng, Xu, Chinq, Jong Ming, Chyn, Ng Yong

“…Silicon interposer is being widely used for 2.5D integration due to its advanced performance. However, the resistivity of the silicon can be impacted by the…”
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Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement by Jiaqi, Wu, Guan, Lim Teck, Tsung-Yang Liow, Jason, Nair Gourikutty, Sajay Bhuvanendran

“…Fan-Out Wafer Level Packaging (FOWLP) can be a good candidate for heterogeneous integration of Photonic ICs (PIC) and Electronic ICs (EIC) in the same package…”
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