Search Results - "Guan Huei See"
-
1
A Compact Model for Undoped Silicon-Nanowire MOSFETs With Schottky-Barrier Source/Drain
Published in IEEE transactions on electron devices (01-05-2009)“…A comprehensive physics-based compact model for three-terminal undoped Schottky-barrier (SB) gate-all-around silicon-nanowire MOSFETs is formulated based on a…”
Get full text
Journal Article -
2
Rigorous Surface-Potential Solution for Undoped Symmetric Double-Gate MOSFETs Considering Both Electrons and Holes at Quasi NonEquilibrium
Published in IEEE transactions on electron devices (01-02-2008)“…This paper presents a rigorously-derived analytical solution of the Poisson equation with both electrons and holes in pure silicon, which is applied to the…”
Get full text
Journal Article -
3
"Ground-Referenced" Model for Three-Terminal Symmetric Double-Gate MOSFETs With Source/Drain Symmetry
Published in IEEE transactions on electron devices (01-09-2008)“…This brief presents for the first time a ldquoground-referencedrdquo model to satisfy the Gummel symmetry test in three-terminal MOSFETs without body contact…”
Get full text
Journal Article -
4
A Compact Model Satisfying Gummel Symmetry in Higher Order Derivatives and Applicable to Asymmetric MOSFETs
Published in IEEE transactions on electron devices (01-02-2008)“…This paper presents a new concept for the MOSFET saturation voltages at the drain and source sides referenced to bulk, and applies them to the popularly used…”
Get full text
Journal Article -
5
A New Impact-Ionization Current Model Applicable to Both Bulk and SOI MOSFETs by Considering Self-Lattice-Heating
Published in IEEE transactions on electron devices (01-09-2008)“…In existing impact-ionization current (J sub ) models for short-channel MOSFETs, various models for the characteristic ionization length (I) or the…”
Get full text
Journal Article -
6
Under-Bump Metallization Contact Resistance ( R ) Characterization at 10- \mu \text Polymer Passivation Opening
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-10-2017)“…Under-bump metallization R c is a critical metric for high-density interconnect in electronic devices. We developed a test vehicle to characterize the impact…”
Get full text
Journal Article -
7
Physics-based single-piece charge model for strained-Si MOSFETs
Published in IEEE transactions on electron devices (01-07-2005)“…A physics-based single-piece charge model for strained-silicon (s-Si) MOSFETs from accumulation to strong-inversion regions is presented. The model is…”
Get full text
Journal Article -
8
Surface-Potential Solution for Generic Undoped MOSFETs With Two Gates
Published in IEEE transactions on electron devices (01-01-2007)“…We present a rigorously derived analytical Poisson solution for undoped semiconductors and apply the general solution to generic MOSFETs with two gates,…”
Get full text
Journal Article -
9
Implicit Analytical Surface/Interface Potential Solutions for Modeling Strained-Si MOSFETs
Published in IEEE transactions on electron devices (01-12-2006)“…A new technique for calculating surface and interface potentials in heterostructure MOSFETs such as strained-Si/SiGe using an internal iteration approach is…”
Get full text
Journal Article -
10
Effect of substrate doping on the capacitance-Voltage characteristics of strained-silicon pMOSFETs
Published in IEEE electron device letters (01-01-2006)“…The effect of substrate doping on the capacitance-voltage characteristics of a surface-channel strained-silicon p-channel MOSFET has been studied to explain a…”
Get full text
Journal Article -
11
Subcircuit Compact Model for Dopant-Segregated Schottky Gate-All-Around Si-Nanowire MOSFETs
Published in IEEE transactions on electron devices (01-04-2010)“…In this paper, we demonstrate analytical device models and a unique subcircuit approach to physically and accurately model the dopant-segregated Schottky (DSS)…”
Get full text
Journal Article -
12
-
13
Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…Fan-Out wafer-level packaging (FOWLP) semi-additive process (SAP) flow for three layers of redistribution layer (RDL) has been developed. Patched dicing lane…”
Get full text
Conference Proceeding -
14
Evaluation on multiple layer PBO-based Cu RDL process for Fan-Out Wafer Level Packaging (FOWLP)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01-11-2016)“…Fan-Out Wafer Level Packaging (FOWLP) was proposed and introduced due its advantages in cost reduction [1] and enhanced packaging capabilities. However, there…”
Get full text
Conference Proceeding -
15
Extraction of physical parameters of strained silicon MOSFETs from C-V measurement
Published in Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005 (2005)“…This paper presents a methodology for extraction of the physical parameters of strained-silicon MOSFET from one capacitance-voltage (C-V) measurement based on…”
Get full text
Conference Proceeding -
16
aGround-Referenceda Model for Three-Terminal Symmetric Double-Gate MOSFETs With Source/Drain Symmetry
Published in IEEE transactions on electron devices (01-01-2008)“…This brief presents for the first time a "ground-referenced" model to satisfy the Gummel symmetry test in three-terminal MOSFETs without body contact. Unlike…”
Get full text
Journal Article -
17
Unified regional modeling approach to emerging multiple-gate/nanowire MOSFETs
Published in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (01-10-2008)“…This paper reviews the basic governing equations for a double-gate/gate-all-around (DG/GAA) MOSFET in a generic and unified description. Starting from generic…”
Get full text
Conference Proceeding -
18
Unification of MOS compact models with the unified regional modeling approach
Published in Journal of computational electronics (01-06-2011)“…This paper reviews the development of the MOSFET model (Xsim), for unification of various types of MOS devices, such as bulk, partially/fully-depleted SOI,…”
Get full text
Journal Article -
19
Unified compact modeling for Bulk/SOI/FinFET/SiNW MOSFETs
Published in 2009 2nd International Workshop on Electron Devices and Semiconductor Technology (01-06-2009)“…This paper describes seamless transitions among various MOS devices, ranging from bulk and partially/fully-depleted SOI to double-gate FinFETs and…”
Get full text
Conference Proceeding -
20