Search Results - "Gschwandl, Mario"

The crucial role of external force in the estimation of the topology freezing transition temperature of vitrimers by elongational creep measurements by Kaiser, Simon, Novak, Patrick, Giebler, Michael, Gschwandl, Mario, Novak, Philipp, Pilz, Gerald, Morak, Matthias, Schlögl, Sandra

“…Vitrimers are covalent adaptable networks that rely on associative bond exchange reactions. Along with the glass transition temperature, the service…”
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Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements by Morak, Matthias, Marx, Philipp, Gschwandl, Mario, Fuchs, Peter Filipp, Pfost, Martin, Wiesbrock, Frank

“…For the design of the next generation of microelectronic packages, thermal management is one of the key aspects and must be met by the development of polymers…”
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Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics by Schipfer, Christian, Gschwandl, Mario, Fuchs, Peter, Antretter, Thomas, Feuchter, Michael, Morak, Matthias, Tao, Qi, Schingale, Angelika

“…Surface Mounted Devices (SMDs) are widely used throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based…”
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Solvent Diffusion Modeling in Silicone by Wagner, Stefan, Nagl, Roland, Weissensteiner, Alexander, Strunčnik, Julija, Schönbacher, Lara, Gschwandl, Mario, Fischlschweiger, Michael, Zeiner, Tim

“…The diffusion of solvents into a polymer matrix is critical in various applications, such as medicine and electronic coatings. Previously, one-dimensional…”
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Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics by Gschwandl, Mario, Friedrich, Birgit, Pfost, Martin, Antretter, Thomas, Fuchs, Peter Filipp, Mitev, Ivaylo, Tao, Qi, Schingale, Angelika

“…Power electronics are key-enablers of several industry trends, such as more efficient renewable energy harvesting, eco-friendly mobility and many more. With…”
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Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics by Schipfer, Christian, Gschwandl, Mario, Fuchs, Peter, Antretter, Thomas, Feuchter, Michael, Morak, Matthias, Tao, Qi, Schingale, Angelika

“…Surface Mounted Devices (SMDs) are widely spread throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based…”
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Characterization and modeling of a typical curing material for photoresist films by Peng, Chongnan, Morak, Matthias, Thalhamer, Andreas, Gschwandl, Mario, Fuchs, Peter, Tao, Qi, Krivec, Thomas, Antretter, Thomas, Celigueta, Miguel Angel

“…The photo imaging process is one of the most important advances in the production of printed circuit boards (PCBs). Especially, UV-curable resins are widely…”
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Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics by Gschwandl, Mario, Pfost, Martin, Antretter, Thomas, Fuchs, Peter Filipp, Mitev, Ivaylo, Tao, Qi, Schingale, Angelika

“…Power electronics are key-enablers of several industry trends, such as more efficient renewable energy harvesting, eco-friendly mobility and many more. With…”
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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers by Gschwandl, Mario, Frewein, Markus, Fuchs, Peter Filipp, Antretter, Thomas, Pinter, Gerald, Novak, Philipp

“…Considering the application specific temperature loads microelectronic packages have to endure, thermal management plays a major role for reliability…”
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Finite element analysis of arbitrarily complex electronic devices by Gschwandl, Mario, Fuchs, Peter, Fellner, Klaus, Antretter, Thomas, Krivec, Thomas, Tao Qi

“…The capability and the range of functions of electronic devices have strongly developed over the last decade, while their size has significantly decreased. At…”
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A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip by Gschwandl, Mario, Fuchs, Peter Filipp, Antretter, Thomas, Pfost, Martin, Mitev, Ivaylo, Qi, Tao, Krivec, Thomas, Schingale, Angelika, Decker, Michael

“…The shift of the automotive industry towards e-mobility results in a strong demand for highly reliable power electronics. A major goal in their design is to…”
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Numerical Analysis of the Influence of Polymeric Materials on a MEMS Package Performance Under Humidity and Temperature Loads by Yalagach, Mahesh, Filipp Fuchs, Peter, Wolfberger, Archim, Gschwandl, Mario, Antretter, Thomas, Feuchter, Michael, Tak, Coen, Tao, Qi

“…The rapid expansion of the Internet of Things (IoT) and consumer electronics is driving the demand for microelectromechanical systems (MEMS) in the area of…”
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Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulations by Gschwandl, Mario, Fuchs, Peter Filipp, Mitev, Ivaylo, Yalagach, Mahesh, Antretter, Thomas, Tao Qi, Schingale, Angelika

“…Due to the advancement of electric mobility in recent years, the need for reliable power electronics has risen exponentially. To enable a proper lifetime…”
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