Search Results - "Gruska, Bernd"

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    Ellipsometry and XPS comparative studies of thermal and plasma enhanced atomic layer deposited Al2O3-films by Haeberle, Jörg, Henkel, Karsten, Gargouri, Hassan, Naumann, Franziska, Gruska, Bernd, Arens, Michael, Tallarida, Massimo, Schmeißer, Dieter

    Published in Beilstein journal of nanotechnology (08-11-2013)
    “…We report on results on the preparation of thin (<100 nm) aluminum oxide (Al2O3) films on silicon substrates using thermal atomic layer deposition (T-ALD) and…”
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    Journal Article
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    Thermal and plasma enhanced atomic layer deposition of TiO2: Comparison of spectroscopic and electric properties by Das, Chittaranjan, Henkel, Karsten, Tallarida, Massimo, Schmeißer, Dieter, Gargouri, Hassan, Kärkkänen, Irina, Schneidewind, Jessica, Gruska, Bernd, Arens, Michael

    “…Titanium oxide (TiO2) deposited by atomic layer deposition (ALD) is used as a protective layer in photocatalytic water splitting system as well as a dielectric…”
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    Journal Article
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    Ellipsometry and XPS comparative studies of thermal and plasma enhanced atomic layer deposited Al 2 O 3 -films by Haeberle, Jörg, Henkel, Karsten, Gargouri, Hassan, Naumann, Franziska, Gruska, Bernd, Arens, Michael, Tallarida, Massimo, Schmeißer, Dieter

    Published in Beilstein journal of nanotechnology (08-11-2013)
    “…We report on results on the preparation of thin (<100 nm) aluminum oxide (Al 2 O 3 ) films on silicon substrates using thermal atomic layer deposition (T-ALD)…”
    Get full text
    Journal Article
  8. 8

    Characterisation of epitaxial layers on silicon by spectroscopic ellipsometry by Dittmar, Georg, Gruska, Bernd

    “…The characterisation of epitaxial layers on silicon substrates is becoming more and more important, especially as the thicknesses of the layers decrease…”
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    Journal Article Conference Proceeding
  9. 9

    Characterization of Sputtered Ta and TaN Films by Spectroscopic Ellipsometry by Waechtler, T., Gruska, B., Zimmermann, S., Schulz, S.E., Gessner, T.

    “…Spectroscopic ellipsometry is emerging as a routine tool for in-situ and ex-situ thin-film characterization in semiconductor manufacturing. For interconnects…”
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    Conference Proceeding