Search Results - "Griffoni, A"

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  1. 1

    Laser- and Heavy Ion-Induced Charge Collection in Bulk FinFETs by El-Mamouni, F., Zhang, E. X., Pate, N. D., Hooten, N., Schrimpf, R. D., Reed, R. A., Galloway, K. F., McMorrow, D., Warner, J., Simoen, E., Claeys, C., Griffoni, A., Linten, D., Vizkelethy, G.

    Published in IEEE transactions on nuclear science (01-12-2011)
    “…Through-wafer two-photon absorption laser experiments were performed on bulk FinFETs. Transients show distinct signatures for charge collection from drift and…”
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    Journal Article
  2. 2

    Neutron-Induced Multiple Bit Upsets on Two Commercial SRAMs Under Dynamic-Stress by Rech, P., Galliere, J.-M., Girard, P., Griffoni, A., Boch, J., Wrobel, F., Saigne, F., Dilillo, L.

    Published in IEEE transactions on nuclear science (01-08-2012)
    “…We investigate the occurrence of Multiple Bit Upsets in commercial SRAMs of 4 Mbits and 32 Mbits when irradiated with neutrons. The devices were irradiated at…”
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    Journal Article
  3. 3

    Impact of Back-Gate Bias and Device Geometry on the Total Ionizing Dose Response of 1-Transistor Floating Body RAMs by Mahatme, N. N., Zhang, E. X., Reed, R. A., Bhuva, B. L., Schrimpf, R. D., Fleetwood, D. M., Linten, D., Simoen, E., Griffoni, A., Aoulaiche, M., Jurczak, M., Groeseneken, G.

    Published in IEEE transactions on nuclear science (01-12-2012)
    “…In this paper we investigate how geometry impacts the memory characteristics of 1-transistor dynamic floating body RAMs (FBRAMs) under total ionizing dose…”
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    Journal Article
  4. 4

    ESD characterization of multi-chip RGB LEDs by Vaccari, S., Meneghini, M., Griffoni, A., Barbisan, D., Barbato, M., Carraro, S., La Grassa, M., Meneghesso, G., Zanoni, E.

    Published in Microelectronics and reliability (01-09-2013)
    “…•A ESD characterization of multi-chip RGB LEDs is proposed.•We have submitted LEDs to ESD tests by means of a transmission Line Pulser (TLP).•Red LEDs have an…”
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    Journal Article Conference Proceeding
  5. 5

    A Statistical Approach to Microdose Induced Degradation in FinFET Devices by Griffoni, A., Gerardin, S., Roussel, P.J., Degraeve, R., Meneghesso, G., Paccagnella, A., Simoen, E., Claeys, C.

    Published in IEEE transactions on nuclear science (01-12-2009)
    “…We study the variability of microdose effects induced by heavy-ion strikes on FinFETs. We model the effects through a statistical analysis, which considers the…”
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    Journal Article
  6. 6

    Characterization and Optimization of Sub-32-nm FinFET Devices for ESD Applications by Thijs, S., Tremouilles, D., Russ, C., Griffoni, A., Collaert, N., Rooyackers, R., Linten, D., Scholz, M., Duvvury, C., Gossner, H., Jurczak, M., Groeseneken, G.

    Published in IEEE transactions on electron devices (01-12-2008)
    “…Electrostatic discharge performance of advanced FinFETs shows a delicate sensitivity to device layout and to processing parameters. Both N- and P-type MOS…”
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    Journal Article
  7. 7

    Microdose and Breakdown Effects Induced by Heavy Ions on Sub 32-nm Triple-Gate SOI FETs by Griffoni, A., Gerardin, S., Meneghesso, G., Paccagnella, A., Simoen, E., Put, S., Claeys, C.

    Published in IEEE transactions on nuclear science (01-12-2008)
    “…We studied the permanent effects of heavy-ion strikes on decananometer triple-gate SOI devices. We highlighted the role of the geometry and the…”
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    Journal Article
  8. 8

    Effects of Heavy-Ion Strikes on Fully Depleted SOI MOSFETs With Ultra-Thin Gate Oxide and Different Strain-Inducing Techniques by Griffoni, A., Gerardin, S., Cester, A., Paccagnella, A., Simoen, E., Claeys, C.

    Published in IEEE transactions on nuclear science (01-12-2007)
    “…We study the immediate and long-term effects of heavy-ion strikes on 65-nm Fully Depleted SOI MOSFETs with different strain engineering solutions. Some of the…”
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    Journal Article
  9. 9

    Electrostatic Discharge Effects in Irradiated Fully Depleted SOI MOSFETs With Ultra-Thin Gate Oxide by Gerardin, S., Griffoni, A., Tazzoli, A., Cester, A., Meneghesso, G., Paccagnella, A.

    Published in IEEE transactions on nuclear science (01-12-2007)
    “…We present new results on electrostatic discharges in fully depleted SOI MOSFETs struck by heavy ions. We investigate the sensitivity of irradiated MOSFETs to…”
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    Journal Article
  10. 10

    Degradation of static and dynamic behavior of CMOS inverters during constant and pulsed voltage stress by Gerardin, S., Griffoni, A., Cester, A., Paccagnella, A., Ghidini, G.

    Published in Microelectronics and reliability (01-09-2006)
    “…We study the degradation of CMOS inverters under DC and pulsed stress conditions before the occurrence of the gate oxide breakdown. Our results show an overall…”
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    Journal Article Conference Proceeding
  11. 11

    Dose Enhancement Due to Interconnects in Deep-Submicron MOSFETs Exposed to X-Rays by Griffoni, A., Silvestri, M., Gerardin, S., Meneghesso, G., Paccagnella, A., Kaczer, B., de Potter de ten Broeck, M., Verbeeck, R., Nackaerts, A.

    Published in IEEE transactions on nuclear science (01-08-2009)
    “…We present the first experimental report of dose-enhancement effects due to interconnects in deep-submicron CMOS, using ad hoc designed MOSFETs with different…”
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    Journal Article
  12. 12

    Radiation Effects in Advanced Multiple Gate and Silicon-on-Insulator Transistors by Simoen, E., Gaillardin, M., Paillet, P., Reed, R. A., Schrimpf, R. D., Alles, M. L., El-Mamouni, F., Fleetwood, D. M., Griffoni, A., Claeys, C.

    Published in IEEE transactions on nuclear science (01-06-2013)
    “…The aim of this review paper is to describe in a comprehensive manner the current understanding of the radiation response of state-of-the-art…”
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    Journal Article
  13. 13

    Charged device model (CDM) ESD challenges for laterally diffused nMOS (nLDMOS) silicon controlled rectifier (SCR) devices for high-voltage applications in standard low-voltage CMOS technology by Griffoni, A, Chen, S.-H, Thijs, S, Linten, D, Scholz, M, Groeseneken, G

    “…The turn-on behavior of high-voltage-tolerant nLDMOS SCRs is investigated during CDM ESD events. An early failure occurs because of gate-oxide damage. A device…”
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    Conference Proceeding
  14. 14

    Unexpected failure during HBM ESD stress in nanometer-scale nLDMOS-SCR devices by Chen, S.-H, Thijs, S., Griffoni, A., Linten, D., De Keersgieter, A., Groeseneken, G.

    “…Unexpected gate oxide failure has been observed during HBM ESD stress on high-voltage tolerant nLDMOS-SCR devices in standard low-voltage CMOS technology. TCAD…”
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    Conference Proceeding
  15. 15

    Proton-Induced Mobility Degradation in FinFETs With Stressor Layers and Strained SOI Substrates by Kobayashi, D, Simoen, E, Put, S, Griffoni, A, Poizat, M, Hirose, K, Claeys, C

    Published in IEEE transactions on nuclear science (01-06-2011)
    “…Proton irradiation effects on fin-type field effect transistors (FinFETs) are examined from the viewpoint of their electrical-performance parameter of…”
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    Journal Article
  16. 16

    Neutron-Induced Soft Errors in Graphic Processing Units by Rech, P., Aguiar, C., Ferreira, R., Silvestri, M., Griffoni, A., Frost, C., Carro, L.

    Published in 2012 IEEE Radiation Effects Data Workshop (01-07-2012)
    “…This paper presents and analyzes the results of neutron experiments on 40nm Graphic Processing Units. We have measured the internal memory resources cross…”
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    Conference Proceeding
  17. 17

    Off-State Degradation of High-Voltage-Tolerant nLDMOS-SCR ESD Devices by Griffoni, A, Shih-Hung Chen, Thijs, S, Kaczer, B, Franco, J, Linten, D, De Keersgieter, A, Groeseneken, G

    Published in IEEE transactions on electron devices (01-07-2011)
    “…The OFF-state degradation of n-channel laterally diffused metal-oxide-semiconductor (MOS) silicon-controlled-rectifier electrostatic-discharge (ESD) devices…”
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    Journal Article
  18. 18

    HBM parameter extraction and Transient Safe Operating Area by Linten, D, Thijs, S, Griffoni, A, Scholz, M, Chen, S.-H, Lafonteese, D, Vashchenko, V, Sawada, M, Concannon, A, Hopper, P, Jansen, P, Groeseneken, G

    “…The extraction of ESD parameters and a Transient Safe Operating Area (TSOA) based on on-wafer HBM-IV measurements with voltage and current waveform capturing…”
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    Conference Proceeding
  19. 19

    SCCF - System to component level correlation factor by Thijs, S, Scholz, M, Linten, D, Griffoni, A, Russ, C, Stadler, W, Lafonteese, D, Vashchenko, V, Sawada, M, Concannon, A, Hopper, P, Jansen, P, Groeseneken, G

    “…As a first step towards correlation of system level ESD robustness based on component level ESD results, on-wafer Human Metal Model (HMM) measurements are…”
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    Conference Proceeding
  20. 20

    Total ionizing dose effects on ultra thin buried oxide floating body memories by Mahatme, N. N., Schrimpf, R. D., Reed, R. A., Bhuva, B. L., Griffoni, A., Simoen, E., Aoulaiche, M., Linten, D., Jurczak, M., Groeseneken, G.

    “…The total-ionizing-dose response of 1-transistor floating body memory cells is investigated. Factors affecting the robustness of these novel devices for high…”
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    Conference Proceeding