Search Results - "Graham, Samuel"

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  1. 1

    Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices by Cheng, Zhe, Mu, Fengwen, Yates, Luke, Suga, Tadatomo, Graham, Samuel

    Published in ACS applied materials & interfaces (19-02-2020)
    “…The wide bandgap, high-breakdown electric field, and high carrier mobility makes GaN an ideal material for high-power and high-frequency electronics…”
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    Journal Article
  2. 2

    Pool boiling characteristics and critical heat flux mechanisms of microporous surfaces and enhancement through structural modification by Ha, Minseok, Graham, Samuel

    Published in Applied physics letters (28-08-2017)
    “…Experimental studies have shown that microporous surfaces induce one of the highest enhancements in critical heat flux (CHF) during pool boiling. However,…”
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    Journal Article
  3. 3

    Thermal effects in packaging high power light emitting diode arrays by Christensen, Adam, Graham, Samuel

    Published in Applied thermal engineering (01-02-2009)
    “…The package and system level temperature distributions of a high power (>1 W) light emitting diode (LED) array have been investigated using numerical heat flow…”
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    Journal Article
  4. 4

    Thermal charging study of compressed expanded natural graphite/phase change material composites by Mallow, Anne, Abdelaziz, Omar, Graham, Samuel

    Published in Carbon (New York) (01-11-2016)
    “…The thermal charging performance of paraffin wax combined with compressed expanded natural graphite foam was studied for different graphite bulk densities…”
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    Journal Article
  5. 5

    Development of a thermal resistance model for chip-on-board packaging of high power LED arrays by Ha, Minseok, Graham, Samuel

    Published in Microelectronics and reliability (01-05-2012)
    “…The performance of high power LEDs strongly depends on the junction temperature. Operating at high junction temperature causes degradation of light intensity…”
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    Journal Article
  6. 6

    Record-Low Thermal Boundary Resistance between Diamond and GaN-on-SiC for Enabling Radiofrequency Device Cooling by Malakoutian, Mohamadali, Field, Daniel E, Hines, Nicholas J, Pasayat, Shubhra, Graham, Samuel, Kuball, Martin, Chowdhury, Srabanti

    Published in ACS applied materials & interfaces (22-12-2021)
    “…The implementation of 5G-and-beyond networks requires faster, high-performance, and power-efficient semiconductor devices, which are only possible with…”
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    Journal Article
  7. 7

    High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces by Mu, Fengwen, Cheng, Zhe, Shi, Jingjing, Shin, Seongbin, Xu, Bin, Shiomi, Junichiro, Graham, Samuel, Suga, Tadatomo

    Published in ACS applied materials & interfaces (11-09-2019)
    “…High-power GaN-based electronics are limited by high channel temperatures induced by self-heating, which degrades device performance and reliability…”
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    Journal Article
  8. 8

    Development of highly flexible and ultra-low permeation rate thin-film barrier structure for organic electronics by Kim, Namsu, Graham, Samuel

    Published in Thin solid films (29-11-2013)
    “…A flexible thin-film encapsulation architecture for organic electronics was built and consisted of a silicon oxide/alumina and parylene layer deposited over Ca…”
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    Journal Article Conference Proceeding
  9. 9

    The Effects of Cooling on Fine-Grained Sandstone in Relation to Wellbore Injection of Carbon Dioxide by Reppas, Nikolaos, Davie, Colin T., Gui, Yilin, Wetenhall, Ben, Graham, Samuel P.

    Published in Rock mechanics and rock engineering (01-10-2023)
    “…In Carbon Capture and Storage (CCS) procedures, it is important to determine the stability of the wellbore during carbon dioxide (CO 2 ) injection and part of…”
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    Journal Article
  10. 10

    Transient Thermal Characterization of AlGaN/GaN HEMTs Under Pulsed Biasing by Pavlidis, Georges, Kendig, Dustin, Heller, Eric R., Graham, Samuel

    Published in IEEE transactions on electron devices (01-05-2018)
    “…The development of steady-state thermal characterization techniques for AlGaN/GaN high-electron mobility transistors (HEMTs) has been used to measure the…”
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    Journal Article
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  12. 12

    High thermal conductivity in wafer-scale cubic silicon carbide crystals by Cheng, Zhe, Liang, Jianbo, Kawamura, Keisuke, Zhou, Hao, Asamura, Hidetoshi, Uratani, Hiroki, Tiwari, Janak, Graham, Samuel, Ohno, Yutaka, Nagai, Yasuyoshi, Feng, Tianli, Shigekawa, Naoteru, Cahill, David G.

    Published in Nature communications (23-11-2022)
    “…High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as both active functional materials…”
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    Journal Article
  13. 13

    Thermal conductance across β-Ga2O3-diamond van der Waals heterogeneous interfaces by Cheng, Zhe, Yates, Luke, Shi, Jingjing, Tadjer, Marko J., Hobart, Karl D., Graham, Samuel

    Published in APL materials (01-03-2019)
    “…Because of its ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates grown from the melt, β-Ga2O3 has attracted great…”
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    Journal Article
  14. 14

    Low Thermal Boundary Resistance Interfaces for GaN-on-Diamond Devices by Yates, Luke, Anderson, Jonathan, Gu, Xing, Lee, Cathy, Bai, Tingyu, Mecklenburg, Matthew, Aoki, Toshihiro, Goorsky, Mark S, Kuball, Martin, Piner, Edwin L, Graham, Samuel

    Published in ACS applied materials & interfaces (18-07-2018)
    “…The development of GaN-on-diamond devices holds much promise for the creation of high-power density electronics. Inherent to the growth of these devices, a…”
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    Journal Article
  15. 15

    Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries by Sood, Aditya, Cheaito, Ramez, Bai, Tingyu, Kwon, Heungdong, Wang, Yekan, Li, Chao, Yates, Luke, Bougher, Thomas, Graham, Samuel, Asheghi, Mehdi, Goorsky, Mark, Goodson, Kenneth E

    Published in Nano letters (13-06-2018)
    “…Understanding the impact of lattice imperfections on nanoscale thermal transport is crucial for diverse applications ranging from thermal management to energy…”
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    Journal Article
  16. 16

    Experimental observation of localized interfacial phonon modes by Cheng, Zhe, Li, Ruiyang, Yan, Xingxu, Jernigan, Glenn, Shi, Jingjing, Liao, Michael E., Hines, Nicholas J., Gadre, Chaitanya A., Idrobo, Juan Carlos, Lee, Eungkyu, Hobart, Karl D., Goorsky, Mark S., Pan, Xiaoqing, Luo, Tengfei, Graham, Samuel

    Published in Nature communications (25-11-2021)
    “…Interfaces impede heat flow in micro/nanostructured systems. Conventional theories for interfacial thermal transport were derived based on bulk phonon…”
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    Journal Article
  17. 17

    Highly Tunable Molecular Sieving and Adsorption Properties of Mixed-Linker Zeolitic Imidazolate Frameworks by Eum, Kiwon, Jayachandrababu, Krishna C, Rashidi, Fereshteh, Zhang, Ke, Leisen, Johannes, Graham, Samuel, Lively, Ryan P, Chance, Ronald R, Sholl, David S, Jones, Christopher W, Nair, Sankar

    Published in Journal of the American Chemical Society (01-04-2015)
    “…Nanoporous zeolitic imidazolate frameworks (ZIFs) form structural topologies equivalent to zeolites. ZIFs containing only one type of imidazole linker show…”
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    Journal Article
  18. 18

    The role of the dystrophin glycoprotein complex in muscle cell mechanotransduction by Wilson, Darren Graham Samuel, Tinker, Andrew, Iskratsch, Thomas

    Published in Communications biology (27-09-2022)
    “…Dystrophin is the central protein of the dystrophin-glycoprotein complex (DGC) in skeletal and heart muscle cells. Dystrophin connects the actin cytoskeleton…”
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    Journal Article
  19. 19

    Stability of Doped Transparent Carbon Nanotube Electrodes by Jackson, Roderick, Domercq, Benoit, Jain, Rishabh, Kippelen, Bernard, Graham, Samuel

    Published in Advanced functional materials (10-09-2008)
    “…This paper evaluates the effectiveness of p‐doping transparent single‐walled carbon nanotube (SWNT) films via chemical treatment with HNO3 and SOCl2. Stability…”
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    Journal Article
  20. 20

    Solution-based electrical doping of semiconducting polymer films over a limited depth by Kolesov, Vladimir A., Fuentes-Hernandez, Canek, Chou, Wen-Fang, Aizawa, Naoya, Larrain, Felipe A., Wang, Ming, Perrotta, Alberto, Choi, Sangmoo, Graham, Samuel, Bazan, Guillermo C., Nguyen, Thuc-Quyen, Marder, Seth R., Kippelen, Bernard

    Published in Nature materials (01-04-2017)
    “…Solution-based electrical doping protocols may allow more versatility in the design of organic electronic devices; yet, controlling the diffusion of dopants in…”
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    Journal Article