Search Results - "Graff, Joachim S."
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A Comparative Investigation of Duplex and Super Duplex Stainless Steels Processed through Laser Powder Bed Fusion
Published in Metals (Basel ) (01-11-2023)“…The aim of this paper was to compare duplex (DSS) and super duplex stainless steel processed by laser powder bed fusion (LPBF) based on the process parameters…”
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Novel Powder Feedstock towards Microstructure Engineering in Laser Powder Bed Fusion: A Case Study on Duplex/Super Duplex and Austenitic Stainless-Steel Alloys
Published in Metals (Basel ) (01-09-2023)“…Additive manufacturing of Duplex Stainless Steels (DSS) and Super Duplex Stainless Steels (SDSS) has been successfully demonstrated using LPBF in recent years,…”
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Correction: Gargalis et al. A Comparative Investigation of Duplex and Super Duplex Stainless Steels Processed through Laser Powder Bed Fusion. Metals 2023, 13, 1897
Published in Metals (Basel ) (20-03-2024)“…In the original publication [...]…”
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Corrosion performance and degradation mechanism of a bi-metallic aluminum structure processed by wire-arc additive manufacturing
Published in Npj Materials degradation (26-05-2021)“…An Al-5Mg alloy (AA5083) block, deposited over an AA6061 substrate by wire-arc additive manufacturing, was electrochemically tested along two different…”
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Roadmap for additive manufacturing of HAYNES® 282® superalloy by laser beam powder bed fusion (PBF-LB) technology
Published in Materials & design (01-06-2021)“…Although various alloy systems have been explored for additive manufacturing (AM) during the past decade, introducing a new alloy remains a challenging task…”
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Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles
Published in Journal of electronic materials (01-07-2021)“…Thermoelectric modules can be used in waste heat harvesting, sensing, and cooling applications. Here, we report on the fabrication and performance of a…”
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Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01-09-2019)“…Most available fine pitch interconnects, like micro bumps and copper pillars, are not particularly compliant whereas available compliant interconnects, like…”
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