Search Results - "Goudena, E.J.G."
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1
Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and AlN Cooling
Published in IEEE journal of solid-state circuits (01-09-2009)“…This paper reviews special RF/microwave silicon device implementations in a process that allows two-sided contacting of the devices: the back-wafer contacted…”
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2
Sub-500/spl deg/C solid-phase epitaxy of ultra-abrupt p/sup +/-silicon elevated contacts and diodes
Published in IEEE electron device letters (01-05-2006)“…A well-controlled low-temperature process, demonstrated from 350/spl deg/C to 500/spl deg/C, has been developed for epitaxially growing elevated contacts and…”
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3
Sub-500 °C solid-phase epitaxy of ultra-abrupt p+-silicon elevated contacts and diodes
Published in IEEE electron device letters (01-05-2006)Get full text
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4
Design and fabrication of infrared detector arrays for satellite attitude control
Published in Sensors and actuators. A. Physical. (22-05-2000)“…This paper describes the design, modelling and fabrication of infrared detectors for attitude control systems (ACS) for satellites. After a short introduction…”
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5
Optimization of fully-implanted NPNs for high-frequency operation
Published in IEEE transactions on electron devices (01-06-1996)“…With a very straightforward (low-cost) process flow as basis, fully-implanted washed-emitter-base (WEB) NPNs have been optimized for operation in the 10-30 GHz…”
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6
Bipolar integrated Kelvin test structure for contact resistance measurement of self-aligned implantations
Published in IEEE transactions on semiconductor manufacturing (01-08-1996)“…A Kelvin contact resistance test structure has been developed for accurate measurement of highly-doped, shallow n/sup +/ and p/sup +/ implantations, which are…”
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7
High-Frequency SiGe HBT's with Implanted Emitters
Published in ESSDERC '96: Proceedings of the 26th European Solid State Device Research Conference (01-09-1996)“…A method is presented by which the implantation damage induced transient enhanced diffusion of boron and phosphorus is used to fabricate high-frequency SiGe…”
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Conference Proceeding -
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High-speed, high-quality WEB NPN transistors with phosphorus emitters
Published in ESSDERC '92: 22nd European Solid State Device Research conference (1992)“…Phosphorus implanted washed emitters, annealed at low temperatures, are produced in a washed emitter-base scheme with a self-aligned pedestal collector. The…”
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Conference Proceeding -
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Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology
Published in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (01-10-2008)“…This paper reviews several novel process modules developed for the processing of the backside of the wafer of our substrate-transfer technology called…”
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Conference Proceeding -
10
Design considerations for integrated high-frequency p-channel JFETs
Published in IEEE transactions on electron devices (01-11-1988)“…To achieve high-frequency performance of integrated p-channel JFETs, the large substrate capacitance is decoupled by separating the top gate from the bottom…”
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11
Silicon-on-glass technology for RF and microwave device fabrication
Published in 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings (01-10-2006)“…This paper reviews the applications and potentials of back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT) particularly for RF and…”
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Conference Proceeding -
12
RF/microwave device fabrication in silicon-on-glass technology
Published in 2008 26th International Conference on Microelectronics (01-05-2008)“…This paper reviews recent developments in circuit and device implementations based on back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology…”
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13
Kelvin test structure for measuring contact resistance of shallow junctions
Published in Proceedings of International Conference on Microelectronic Test Structures (1996)“…A Kelvin contact resistance test structure has been developed for accurate and direct measurement of highly-doped shallow n/sup +/ and p/sup +/ junctions,…”
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Conference Proceeding