Search Results - "Glaser, Caleb"

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  1. 1

    Etched-and-Regrown GaN pn-Diodes With 1600 V Blocking Voltage by Armstrong, Andrew M., Allerman, Andrew A., Pickrell, Greg W., Crawford, Mary H., Glaser, Caleb E., Smith, Trevor

    “…Etched-and-regrown GaN pn-diodes capable of high breakdown voltage (1610 V), low reverse current leakage (1 nA = 6 <inline-formula> <tex-math…”
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    Journal Article
  2. 2

    Optimization of Step-Etched Junction Termination Extensions for Vertical GaN Devices by Binder, Andrew T., Steinfeldt, Jeffrey, Allerman, Andrew A., Rummel, Brian D., Glaser, Caleb, Yates, Luke, Kaplar, Robert J.

    Published in IEEE transactions on electron devices (01-03-2024)
    “…This work provides the first demonstration of a multipoint fit from theory to experiment for step-etched junction terminations on vertical gallium nitride…”
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    Journal Article
  3. 3

    Etched-and-Regrown GaN pn -Diodes With 1600 V Blocking Voltage by Armstrong, Andrew M., Allerman, Andrew A., Pickrell, Greg W., Crawford, Mary H., Glaser, Caleb E., Smith, Trevor

    “…Etched-and-regrown GaN pn-diodes capable of high breakdown voltage (1610 V), low reverse current leakage (1 nA = 6 μA/cm2 at 1250 V), excellent forward…”
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    Journal Article
  4. 4

    Etched and Regrown Vertical GaN Junction Barrier Schottky Diodes by Binder, Andrew T., Pickrell, Greg W., Allerman, Andrew A., Dickerson, Jeramy R., Yates, Luke, Steinfeldt, Jeffrey, Glaser, Caleb, Crawford, Mary H., Armstrong, Andrew, Sharps, Paul, Kaplar, Robert J.

    “…This work provides the first demonstration of vertical GaN Junction Barrier Schottky (JBS) rectifiers fabricated by etch and regrowth of p-GaN. A reverse…”
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    Conference Proceeding
  5. 5

    Analysis of ALD Dielectric Leakage in Bulk GaN MOS Devices by Glaser, Caleb E., Binder, Andrew T., Yates, Luke, Allerman, Andrew A., Feezell, Daniel F., Kaplar, Robert J.

    “…This study analyzes the ability of various processing techniques to reduce leakage current in vertical GaN MOS devices. Careful analysis is required to…”
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    Conference Proceeding