Search Results - "Gieser, Horst"
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Identification of Soft Failure Mechanisms Triggered by ESD Stress on a Powered USB 3.0 Interface
Published in IEEE transactions on electromagnetic compatibility (01-02-2019)“…The objective of this work is to identify electrostatic discharge (ESD) related soft failure mechanisms early in the product life cycle. We compare different…”
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Investigating Profiled Side-Channel Attacks Against the DES Key Schedule
Published in IACR transactions on cryptographic hardware and embedded systems (01-06-2020)“…Recent publications describe profiled single trace side-channel attacks (SCAs) against the DES key-schedule of a “commercially available security controller”…”
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Verification of physical designs using an integrated reverse engineering flow for nanoscale technologies
Published in Integration (Amsterdam) (01-03-2020)“…Considering the potential risks of piracy and malicious manipulation of complex integrated circuits using worldwide distributed manufacturing sites, an…”
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Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions
Published in 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE) (14-03-2022)“…Motivated by the threats of malicious modification and piracy arising from worldwide distributed supply chains, the goal of RESEC is the creation,…”
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Conference Proceeding -
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Investigating Profiled Side-Channel Attacks Against the DES Key Schedule
Published in IACR transactions on cryptographic hardware and embedded systems (19-06-2020)“…Recent publications describe profiled single trace side-channel attacks (SCAs) against the DES key-schedule of a “commercially available security controller”…”
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ESD performance evaluation of powered high-speed interfaces
Published in 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01-08-2015)“…An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation…”
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Conference Proceeding Journal Article -
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In-situ ESD current sensing in a pick and place machine
Published in 2024 46th Annual EOS/ESD Symposium (EOS/ESD) (16-09-2024)“…This paper presents a method to measure current discharge directly in an assembly machine. Pre-tests with a multi-purpose current monitor are performed to show…”
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Conference Proceeding -
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Very fast transmission line pulsing of integrated structures and the charged device model
Published in IEEE transactions on components, packaging and manufacturing technology. Part C, Manufacturing (01-10-1998)“…Transmission line pulsing (TLP) is well-established for the IV-characterization of electrostatic discharge (ESD)-protection elements. There still is a…”
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Investigating the CDM susceptibility of IC’s at package and wafer level by capacitive coupled TLP
Published in Microelectronics and reliability (01-12-2009)“…The method of the capacitive coupled transmission line pulsing (CC-TLP) is applied to a product IC at package level and for the first time at wafer level. The…”
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Towards a Comprehensive System for Physical Hardware Inspection for Trust
Published in 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE) (24-10-2023)“…The US National Cybersecurity Strategy asks for "securing the semiconductor supply chain" [1], and the EU Chips Act addresses the "tech sovereignty" [2]. Both…”
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Conference Proceeding -
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System Level ESD Testing with Capacitively Coupled Stress Pulses
Published in 2022 44th Annual EOS/ESD Symposium (EOS/ESD) (18-09-2022)“…A debugging test method is presented which helps to identify susceptible pins which failed after system level ESD testing in compliance with IEC 61000-4-2. It…”
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Conference Proceeding -
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Secondary discharge - A potential risk during system level ESD testing
Published in 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01-09-2015)“…By means of a floating handheld electronic product this work describes the influence of secondary discharge events during system level ESD testing on the…”
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Conference Proceeding -
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ESD Susceptibility of Submicron Air Gaps
Published in Microelectronics and reliability (01-09-2006)“…This work describes the investigation of the ESD susceptibility of submicron air gaps which are used e.g. in filter devices. The breakdown behaviour of the air…”
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Journal Article Conference Proceeding -
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Stress Current Slew Rate Sensitivity of an Ultra-High-Speed Interface IC
Published in IEEE transactions on device and materials reliability (01-12-2019)“…This study analyzes the Electrostatic Discharge (ESD) susceptibility of a 28nm high-speed CMOS Integrated Circuit (IC) for network applications (25Gbps),…”
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On-chip electrostatic discharge ESD
Published in Microelectronics and reliability (01-07-2003)Get full text
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Survey on Very Fast TLP and Ultra Fast Repetitive Pulsing for Characterization in the CDM-Domain
Published in 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual (01-04-2007)“…Charged device model pulses may be less than 1 ns wide with peak currents exceeding 10 A. They are a true challenge for the ESD protection of advanced…”
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Conference Proceeding -
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Advanced integration technology for fabricating high-speed electro-optical sub-assembly
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13-09-2021)“…Here, we report flip-chip bonding processes based on Anisotropic Conductive Film (ACF) and Sn-Ag-Cu (SAC) solder implemented for bonding three test chips (two…”
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Conference Proceeding -
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Integrated Flow for Reverse Engineering of Nanoscale Technologies
Published in 2019 24th Asia and South Pacific Design Automation Conference (ASP-DAC) (21-01-2019)“…In view of potential risks of piracy and malicious manipulation of complex integrated circuits built in technologies of 45 nm and less, there is an increasing…”
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Conference Proceeding -
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Capacitively coupled transmission line pulsing cc-TLP––a traceable and reproducible stress method in the CDM-domain
Published in Microelectronics and reliability (01-02-2005)“…This paper describes a new test method called capacitively coupled transmission line pulsing cc-TLP. It is applied to different test circuits which were…”
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Journal Article