Multiphysic Simulations for MEMS Sensor Package

Presence of sensor is relevant reality on all aspects of human life and based on the development of Internet of Things (IoT) in recent years the presence of sensors in our daily life is expected to continue increasing. The usability of a sensor in an application is derived from its technical perform...

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Bibliographic Details
Published in:	2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) pp. 688 - 695
Main Authors:	Del Sarto, M., Duca, R., Maierna, A., Manca, N., Ghidoni, M. O., Napolitano, Teresa
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-12-2019
Subjects:	Finite element analysis Micromechanical devices Stress Substrates Temperature measurement Temperature sensors
Online Access:	Get full text
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Summary:	Presence of sensor is relevant reality on all aspects of human life and based on the development of Internet of Things (IoT) in recent years the presence of sensors in our daily life is expected to continue increasing. The usability of a sensor in an application is derived from its technical performance but hardly driven from the package design to fit the system. Also cost down roadmap of MEMS based sensor is driving to study new solution to be able to use, for example, consumer market based material for automotive solutions. In this paper we will present an overview of different techniques based on FEM modeling used for virtual characterization, comparative and predictive design used for MEMS based sensor and microsystem modules. The target is to provide a toolbox for package designers at an early stage of product development targeting a design where package is functional part of the device.
DOI:	10.1109/EPTC47984.2019.9026616