Search Results - "Gershman, Israel"

Nondestructive Quantitative Analysis of Crack Propagation in Solder Joints by Gershman, Israel, Bernstein, Joseph B.

“…Nondestructive quantitative analysis has been developed and can reduce solder joint fatigue experiments by half the time. Additionally, the technique provides…”
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Solder-Joint Quantitative Crack Analysis-Ohmic Resistance Approach by Gershman, I., Bernstein, J. B.

“…This paper presents a novel technique in the area of solder-joint reliability testing, suggesting a new approach for efficient testing of new products. An…”
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Reliability qualification of semiconductor devices based on physics-of-failure and risk and opportunity assessment by Gerling, W. H., Preussger, A., Wulfert, F. W.

“…Qualification frequently is a time‐critical activity at the end of a development project. As time‐to‐market is a competitive issue, the most efficient…”
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The efficacy of a test and ESS program by Katz, Asaf, Argov, Nitay, Shapira, Alon, Gershman, Israel, Refaeli, Nir

“…Statistical results of all the 1621 failure analyses, which cover a four‐year effort, are presented. The failure analyses were part of an elaborate test and…”
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