Search Results - "Geiler, H"
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Photoelastic characterization of residual stress in GaAs-wafers
Published in Materials science in semiconductor processing (01-02-2006)“…Residual stress in GaAs-wafers was investigated on different length scales by rapid full wafer imaging and by microscopic imaging of dislocation cells, using…”
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Journal Article Conference Proceeding -
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Detection and analysis of crystal defects in silicon by scanning infrared depolarization and photoluminescence heterodyne techniques
Published in Materials science & engineering. B, Solid-state materials for advanced technology (30-04-2002)“…The coupling of photoelasticity and photoluminescence measurement techniques represents a powerful tool for non-destructive defect monitoring in silicon…”
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Nondestructive evaluation of as-implanted and annealed ultra shallow junctions by photothermal and photoluminescence heterodyne techniques
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (01-08-2005)“…The control of implantation dose, ion energy and the junction depth after annealing are key points of the on-line metrology for ultra shallow junction…”
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Investigation of thermophysical properties of AIP coated cutting tools for dry machining
Published in Surface & coatings technology (15-12-1996)“…Generally cutting processes are supported by using coolants which are ecologically harmful and therefore expensive concerning their disposal. The substitution…”
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Characterization of bonded wafer stacks by use of the photoelastic-analysis-method
Published in Microsystem technologies : sensors, actuators, systems integration (01-05-2013)“…The photo-elastic-analysis-method is a powerful method for investigating the overall quality of bonded wafer stacks. It can provide full wafer as well as…”
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Characterization of bonded wafer stacks by use of the photoelastic-analysis-method : WaferBond'11, International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
Published in Microsystem technologies : sensors, actuators, systems integration (2013)Get full text
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Photoelastic stress evaluation and defect monitoring in 300-mm-wafer manufacturing
Published in Materials science in semiconductor processing (01-08-2002)“…Process monitoring and tool characterization on product wafers require rapid non-contact and non-destructive evaluation methods. Because all process steps are…”
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Surface characterization of semiconductors with plasma and thermal waves analysis
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (01-03-1995)“…The well characterized (100)-Si surface is used to demonstrate the capacity of the noncontact measurement of surface recombination velocity of excess carriers…”
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Explosive crystallization phenomena in SOI structures
Published in Journal of materials research (01-12-1989)“…Using the double pulse technique with two synchronized lasers, we studied the conditions of ignition and evolution of explosive crystallization. The structure…”
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Investigation of microwave annealed implanted layers with TWIN metrology system
Published in 2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors (01-09-2008)“…The study of the effects of microwave annealing of ion-implanted layers in silicon substrate evaluated by photo-thermal technique is reported. The technique…”
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Conference Proceeding
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Die Pathogenese des Mikulicz-Syndroms: Mit 7 Textabbildungen
Published in European archives of oto-rhino-laryngology (01-11-1958)Get full text
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Angewandte Entomologie
Published in Journal of pest science (01-01-1970)Get full text
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