Search Results - "Ge, Dandong"

Spatial-Temporal Evolution and Prediction of Carbon Storage: An Integrated Framework Based on the MOP–PLUS–InVEST Model and an Applied Case Study in Hangzhou, East China by Li, Yonghua, Yao, Song, Jiang, Hezhou, Wang, Huarong, Ran, Qinchuan, Gao, Xinyun, Ding, Xinyi, Ge, Dandong

“…Land-use/land-cover change (LUCC) is an important factor affecting carbon storage. It is of great practical significance to quantify the relationship between…”
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Research on spatial differentiation and influencing factors of rural tourism industry based on POI data mining: A case study of Zhejiang province by Ge, Dandong, Zheng, Yanyan, Tong, Lei

“…Based on POI big data, spatial data measurement methods such as nearest neighbor distance analysis, kernel density estimation, Simpson diversity index and…”
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Impact of Young Modulus of Epoxy Glue to Copper Wire Bonding by Tan, K.G., Chung, E.L., Wai, C.M., Dandong, Ge

“…Epoxy glue still remains as one of the main medium being used for die attach process in current semiconductor technologies. Different types of epoxy glue have…”
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Glue selection for robust wire bonding process related to non-stick on pad by Ee Lin Chung, Dandong Ge, Chee Mun Wai

“…Cu wire has gained a significant interest in the semiconductor industry due to its cost competitiveness as well as its electrical and thermal performance, as…”
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Failure mechanism study of power packages during MSL and temperature cycling test with finite element analysis by Yongbo Yang, Dandong Ge, Wenjie Shen

“…For power microelectronic packages, the requirement for moisture absorption level (MSL) is quite high, usually level 1 of JEDEC standard is requested. And the…”
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Effect of moisture related properties of mold compound on the reliability of power packages by Dandong Ge, Xue Ming, Wenjie Shen, Zhao Yun

“…Moisture absorption of epoxy mold compounds (EMC) from IC packages is a serious concern especially for their reliability performance during stress tests…”
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Creep corrosion on uppf lead frame package caused by packing materials by Huan Xu, Kaur, Harvinderpal, Lim, Wee Kiat Crosby, Dandong Ge, Kumara, Kurnia, Ming Xue

“…A NiPdAu-Ag leadframe package was reported with creep corrosion which leads to soldering failure. The DOE experiments narrow down the failure root cause…”
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基于POI数据挖掘的浙江省乡村旅游产业空间分异与影响因素研究 by 葛丹东, 郑艳艳, 童磊

“…TU984;…”
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Study on creep fatigue behaviour of soft solders die attach for power package applications by Dandong Ge, Che, F. X., Yik Siong Tay, Swee Lee Gan, Yazid, M.

“…Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties…”
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Creep properties of soft solder die attach with Ni balls in power package applications by Che, F. X., Dandong Ge, Yik Siong Tay, Yazid, M., Swee Lee Gan

“…Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties…”
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A comparison study of thermal aging effect on mold compound and its impact on leadframe packages stress by Ge Dandong, Chai Chee Meng, Koh Liang Kng Ian, Walter, M.

“…This report discloses an advanced approach to improve the prediction of electronic IC packages' reliability performance by studying packaging materials'…”
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Semi-quantitative analysis of trace elements by Secondary Ion Mass Spectrometry by Dandong Ge, Harald, P, Gan Swee Lee, Koh, L K I

“…Secondary Ion Mass Spectrometry (SIMS) offers a technique of surface specific analysis with an information depth as low as 1 nm. SIMS also has high sensitivity…”
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The impact of high glass transition temperature of molding compounds on power package warpage and stress performance by Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee

“…High Glass Transition Temperature (Tg) Molding Compound (MCs) are preferred for power and automotive packages due to their suitability in high temperature…”
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