Search Results - "Gao, Baohong"
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Study on the synergistic effect and mechanism of inhibitors benzotriazole and pyrazole on copper surface
Published in Journal of applied electrochemistry (01-08-2023)“…In the giant large-scale integrated circuits manufacturing process, chemical mechanical polishing (CMP) for Cu interconnection can lead to chemical corrosion…”
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Journal Article -
2
Application of surfactant for facilitating benzotriazole removal and inhibiting copper corrosion during post-CMP cleaning
Published in Microelectronic engineering (15-12-2018)“…Wafer surface is usually contaminated by organic residues, such as benzotriazole(BTA), after chemical mechanical planarization (CMP). Due to the reason that…”
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3
A study on the comparison of CMP performance between a novel alkaline slurry and a commercial slurry for barrier removal
Published in Microelectronic engineering (01-10-2012)“…[Display omitted] ► We have proposed a novel alkaline slurry without inhibitors for barrier CMP. ► The slurry provides lower surface roughness values and good…”
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4
Effect of slurry components on chemical mechanical polishing of copper at low down pressure and a chemical kinetics model
Published in Thin solid films (31-10-2011)“…The practical use of low dielectric constant materials as inter-layer dielectrics is driving the demand for copper chemical mechanical polishing (CMP) at low…”
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5
Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing
Published in Microelectronic engineering (01-03-2012)“…A comprehensive model for the copper material removal in a chemical mechanical polishing (CMP) process is presented in which both chemical and mechanical…”
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6
Optimization of slurry components for a copper chemical mechanical polishing at low down pressure using response surface methodology
Published in Microelectronic engineering (2011)“…Copper replaced aluminium and the low-dielectric constant material (low- k dielectrics) served as a better isolator, which has become the inevitable developing…”
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7
Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (05-02-2020)“…[Display omitted] In chemical mechanical polishing (CMP) process, surface defects and contamination will be introduced on the wafer surface due to interfacial…”
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8
Analysis, identification, and application of distribution of relaxation times in CMP slurry
Published in Electrochimica acta (10-12-2024)“…This study delves into the mechanistic roles of oxidants, complexing agents, and inhibitors in slurries through of Distribution of Relaxation Times (DRT)…”
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Theoretical and electrochemical analysis on inhibition effect of benzotriazole and 1,2,4-triazole on cobalt surface
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (20-04-2020)“…The adsorption models of BTA and TAZ on Co (111) surface in aqueous phase were established by Mont Carlo simulation. Nyquist plots of cobalt inhibitors with…”
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10
A study of FTIR and XPS analysis of alkaline‐based cleaning agent for removing Cu‐BTA residue on Cu wafer
Published in Surface and interface analysis (01-05-2019)“…This study is to focus on the benzotriazole (BTA) residue problem in the postchemical mechanical planarization (post‐CMP) cleaning process. The adsorption of…”
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11
Theoretical and electrochemical analysis on inhibition effects of benzotriazole derivatives (un- and methyl) on copper surface
Published in Journal of molecular structure (05-11-2021)“…•Quantum chemical parameters of BTA and M-BTA were evaluated by DFT theory.•N7 and N8 atoms of BTA and M-BTA are the coordination sites of the…”
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Journal Article -
12
MicroRNA-432 is downregulated in cervical cancer and directly targets FN1 to inhibit cell proliferation and invasion
Published in Oncology letters (01-08-2019)“…Numerous studies have identified the dysregulation of microRNAs (miRNAs) in cervical cancer, and dysregulated miRNAs are involved in regulating a number of…”
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13
Recent advances and future developments in PVA brush scrubbing cleaning: A review
Published in Materials science in semiconductor processing (01-12-2022)“…As semiconductor integrated circuits (SICs) have been developed to scale down to obtain higher integration and better performance, more chemical mechanical…”
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14
Application of an optimized alkaline cleaning solution for inhibitor removal during the post-CMP process: Performance evaluation and mechanism analysis
Published in Journal of molecular liquids (01-01-2023)“…[Display omitted] •A novel post-CMP alkaline cleaning solution was developed for BTA residue removal.•This cleaning solution was proved also helps to achieve a…”
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Journal Article -
15
Experimental and computational studies on TAD as an additive of copper chemical mechanical polishing
Published in Surfaces and interfaces (01-07-2024)“…With its low resistivity and high mobility, copper (Cu) is widely used as a metallic material to interconnect processes in the fabrication of integrated…”
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16
Design of a Visual Detection Method for Prohibited Item Packages Detection Based on the YOLO Model
Published in 2024 4th Asia-Pacific Conference on Communications Technology and Computer Science (ACCTCS) (24-02-2024)“…In this paper, we introduce a prohibited item package detection system based on the YOLO model. Utilizing the state-of-the-art YOLO as its core object…”
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Conference Proceeding -
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Study on Infrared Spectrum Detection and Analysis of BTA Residual after Copper CMP
Published in 2019 China Semiconductor Technology International Conference (CSTIC) (01-03-2019)“…During Cu CMP process BTA is widely used as a corrosion inhibitor, reacts with Cu and forms a strong hydrophobic Cu(II)-BTA complex, which causes severe device…”
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Conference Proceeding -
18
Study on Different Surfactants for Post CMP Cleaning of Novel Barrier
Published in 2019 China Semiconductor Technology International Conference (CSTIC) (01-03-2019)“…The effects of different concentration of chelating agent and different surfactants and concentration changes on the removal of BTA and particles on copper…”
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Conference Proceeding