Search Results - "Gan, Swee Lee"

Study on creep fatigue behaviour of soft solders die attach for power package applications by Dandong Ge, Che, F. X., Yik Siong Tay, Swee Lee Gan, Yazid, M.

“…Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties…”
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Creep properties of soft solder die attach with Ni balls in power package applications by Che, F. X., Dandong Ge, Yik Siong Tay, Yazid, M., Swee Lee Gan

“…Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties…”
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Pd coated Cu wire bond on XoAA material in LQFP package by Wang Mei Yong, Teo, J., Gan Swee Lee, Tan Kian Heong, Swee, A.

“…Pd coated wire is increasely being used as a substitute for bare Cu wire. Being a noble metal, Pd coated wire has high resistance to oxidation enabling longer…”
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Semi-quantitative analysis of trace elements by Secondary Ion Mass Spectrometry by Dandong Ge, Harald, P, Gan Swee Lee, Koh, L K I

“…Secondary Ion Mass Spectrometry (SIMS) offers a technique of surface specific analysis with an information depth as low as 1 nm. SIMS also has high sensitivity…”
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New Perspective on Understanding Contact between Metal and Oxide Through Atomistic Modeling: A Case Study on Tin Oxide in Contact with Common Metals by Tian, Yujia, Kripalani, Devesh, Xue, Ming, Gan, Swee Lee, Zhou, Kun

“…Remarkable efforts have been devoted to the detection, location, and resolution of electrical contact failures. However, because of the complex interplay of…”
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The impact of high glass transition temperature of molding compounds on power package warpage and stress performance by Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee

“…High Glass Transition Temperature (Tg) Molding Compound (MCs) are preferred for power and automotive packages due to their suitability in high temperature…”
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