Search Results - "Galy, P."

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  1. 1

    Trap Recovery by in-Situ Annealing in Fully-Depleted MOSFET With Active Silicide Resistor by Amor, S., Kilchytska, V., Flandre, D., Galy, P.

    Published in IEEE electron device letters (01-07-2021)
    “…This work reports first original results on the impact of active in-situ electro-thermal recovery, on the electrical and low-frequency noise characteristics of…”
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    Journal Article
  2. 2

    Cryogenic Subthreshold Swing Saturation in FD-SOI MOSFETs Described With Band Broadening by Bohuslavskyi, H., Jansen, A. G. M., Barraud, S., Barral, V., Casse, M., Le Guevel, L., Jehl, X., Hutin, L., Bertrand, B., Billiot, G., Pillonnet, G., Arnaud, F., Galy, P., De Franceschi, S., Vinet, M., Sanquer, M.

    Published in IEEE electron device letters (01-05-2019)
    “…In the standard MOSFET description of the drain current <inline-formula> <tex-math notation="LaTeX"> {I}_{{D}} </tex-math></inline-formula> as a function of…”
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    Journal Article
  3. 3

    Cryogenic Temperature Characterization of a 28-nm FD-SOI Dedicated Structure for Advanced CMOS and Quantum Technologies Co-Integration by Galy, P., Camirand Lemyre, J., Lemieux, P., Arnaud, F., Drouin, D., Pioro-Ladriere, Michel

    “…Silicon co-integration offers compelling scale-up opportunities for quantum computing. In this framework, cryogenic temperature is required for the coherence…”
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    Journal Article
  4. 4

    Improved Retention Characteristics of Z2-FET Employing Half Back-Gate Control by Kwon, S., Navarro, C., Gamiz, F., Galy, P., Cristoloveanu, S., Kim, Y. -T., Ahn, J.

    Published in IEEE transactions on electron devices (01-03-2021)
    “…The structure of zero impact ionization, zero subthreshold swing field-effect transistor (Z 2 -FET) has been modified by stacking a half side of back-gate (BG)…”
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    Journal Article
  5. 5

    3-D TCAD Study of the Implications of Channel Width and Interface States on FD-SOI Z2-FETs by Navarro, C., Navarro, S., Marquez, C., Padilla, J. L., Galy, P., Gamiz, F.

    Published in IEEE transactions on electron devices (01-06-2019)
    “…3-D numerical technology computer-aided design simulations, based on experimental results, are performed to study the origin of the large Z 2 -FET dynamic…”
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    Journal Article
  6. 6

    Memory Operations of Zero Impact Ionization, Zero Subthreshold Swing FET Matrix Without Selectors by Kwon, S., Navarro, C., Galy, P., Cristoloveanu, S., Gamiz, F., Ahn, J., Kim, Y.-T.

    Published in IEEE electron device letters (01-03-2020)
    “…This work experimentally demonstrates the memory operations of a Z 2 -FET (Zero impact ionization, Zero subthreshold swing) matrix without the use of…”
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    Journal Article
  7. 7

    Cryogenic Characterization of 28-nm FD-SOI Ring Oscillators With Energy Efficiency Optimization by Bohuslavskyi, H., Barraud, S., Barral, V., Casse, M., Le Guevel, L., Hutin, L., Bertrand, B., Crippa, A., Jehl, X., Pillonnet, G., Jansen, A. G. M., Arnaud, F., Galy, P., Maurand, R., De Franceschi, S., Sanquer, M., Vinet, M.

    Published in IEEE transactions on electron devices (01-09-2018)
    “…Extensive electrical characterization of ring oscillators (ROs) made in high-<inline-formula> <tex-math notation="LaTeX">{k} </tex-math></inline-formula> metal…”
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    Journal Article
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    Variability Evaluation of 28nm FD-SOI Technology at Cryogenic Temperatures down to 100mK for Quantum Computing by Paz, B. Cardoso, Le Guevel, L., Casse, M., Billiot, G., Pillonnet, G., Jansen, A. G. M., Maurand, R., Haendler, S., Juge, A., Vincent, E., Galy, P., Ghibaudo, G., Vinet, M., de Franceschi, S., Meunier, T., Gaillard, F.

    Published in 2020 IEEE Symposium on VLSI Technology (01-06-2020)
    “…Variability of28nm FD-SOI transistors is evaluated for the first time down to ultra low temperatures (UL T), at T= 1 00mK. High performance is achieved at UL T…”
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    Conference Proceeding
  10. 10

    Temperature and Gate Leakage Influence on the Z2-FET Memory Operation by Marquez, C., Navarro, S., Navarro, C., Salazar, N., Galy, P., Cristoloveanu, S., Gamiz, F.

    “…Advanced 28 nm node FD-SOI Z 2 -FETs with thin top-gate insulator are characterized as capacitor-less DRAM cells. Experimental and 2D-TCAD results demonstrate…”
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    Conference Proceeding
  11. 11

    Novel tetra-acridine derivatives as dual inhibitors of topoisomerase II and the human proteasome by Vispé, S., Vandenberghe, I., Robin, M., Annereau, J.P., Créancier, L., Pique, V., Galy, J.P., Kruczynski, A., Barret, J.M., Bailly, C.

    Published in Biochemical pharmacology (15-06-2007)
    “…Acridine derivatives, such as amsacrine, represent a well known class of multi-targeted anti-cancer agents that generally interfere with DNA synthesis and…”
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    Journal Article
  12. 12

    A full characterization of single pitch IO ESD protection based on silicon controlled rectifier and dynamic trigger circuit in CMOS 32 nm node by BOURGEAT, J, GALY, P, DRAY, A, JIMENEZ, J, MARIN-CUDRAZ, D, JACQUIER, B

    Published in Microelectronics and reliability (01-09-2011)
    “…The reliability of electronic devices against electrostatic discharge stresses is still a severe challenge, particularly for deep sub-micron technologies such…”
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    Conference Proceeding Journal Article
  13. 13

    Evaluation of the ESD performance of local protections based on SCR or bi-SCR with dynamic or static trigger circuit in 32 nm by Bourgeat, J., Entringer, C., Galy, P., Bafleur, M., Marin-Cudraz, D.

    Published in Microelectronics and reliability (01-09-2010)
    “…The reliability of electronic devices against electrostatic discharge stresses is still a severe challenge, particularly for deep sub-micron technologies such…”
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    Journal Article Conference Proceeding
  14. 14

    Beta-Matrix ESD network: Throughout end of placement rules? by Bourgeat, J, Galy, P, Jacquier, B

    “…Electrostatic Discharge (ESD) protection for advanced CMOS technologies is based on efficient device Network. But these protection strategies imply some…”
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    Conference Proceeding
  15. 15

    Comparison between isolated SCR & embedded dual isolated SCR power devices for ESD power clamp in C45nm CMOS technology by Galy, P, Bourgeat, J, Jimenez, J, Entringer, C, Dray, A, Jacquier, B

    “…The Electrostatic Discharge (ESD) protection for advanced CMOS technologies is a challenge due to the technology scaling down. The main purpose of this paper…”
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    Conference Proceeding
  16. 16

    In-situ heater for thermal assist recovery of MOS devices in 28 nm UTBB FD-SOI CMOS technology by Galy, P., Lethiecq, R., Bawedin, M.

    Published in Solid-state electronics (01-06-2020)
    “…Preliminary results are reported on an in-situ heater for thermal assist recovery of MOS transistor and is demonstrated in 28 nm Fully Depleted…”
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    Journal Article
  17. 17

    Capacitance RF Characterization and Modeling of 28 FD-SOI CMOS Transistors down to Cryogenic Temperature by Berlingard, Q., Lugo-Alvarez, J., Bawedin, M., Mota-Frutuoso, T., Durand, C., Gloria, D., Galy, P., Casse, M.

    “…In this study we investigate the capacitance characterization and modeling of CMOS transistors integrated in 28nm Ultra Thin Body and Box (UTBB) Fully Depleted…”
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    Conference Proceeding
  18. 18

    Extended investigation of a novel MOS device for in-situ heating in 28 nm UTBB FD-SOI CMOS technology by Lethiecq, R., Bawedin, M., Galy, P.

    “…This work aims to present an extended investigation of a new N-MOS device designed in 28 nm FD-SOIUTBB high-k metal gate technology for in-situ heating…”
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    Conference Proceeding
  19. 19

    FDSOI for cryoCMOS electronics: device characterization towards compact model by Casse, M., Paz, B. Cardoso, Bergamaschi, F., Ghibaudo, G., Serra, F., Billiot, G., Jansen, A. G. M., Berlingard, Q., Martinie, S., Bedecarrats, T., Contamin, L., Juge, A., Vincent, E., Galy, P., Pavanello, M.A, Vinet, M., Meunier, T., Gaillard, F.

    “…We present a status of FDSOI transistors electrical characterization for very low temperature operation. We highlight in particular singular transport and…”
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    Conference Proceeding
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