Search Results - "Gallatin, G."

Statistical limitations of printing 50 and 80 nm contact holes by EUV lithography by Gallatin, G. M., Houle, F. A., Cobb, J. L.

“…Nanoscale photolithography requires accurate formation of very small resist images using high energy photons and a high sensitivity resist. Historically it has…”
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Thermal distortion predictions of a silicon wafer during exposure in a SCALPEL tool by Gianoulakis, S., Liddle, J., Stanton, S., Gallatin, G.

“…Lucent Technologies Bell Laboratories is developing a projection electron lithography system known as SCALPEL for post-optical lithography. SCALPEL employs a…”
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Marks for SCALPEL ® tool optics optimization by Farrow, R.C., Gallatin, G.M., Waskiewicz, W.K., Liddle, J.A., Kizilyalli, I., Kornblit, A., Biddick, C., Blakey, M., Klemens, F., Felker, J., Kraus, J., Mkrtchyan, M., Orphanos, P.A., Layadi, N., Merchant, S.

“…A method for optimizing the electron optics of the SCALPEL exposure tool is described. The method uses the SCALPEL mark detection method with a grating mark as…”
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Mask-membrane impact on image blur in SCALPEL by Mkrtchyan, Masis, Gallatin, Gregg, Liddle, Alexander, Zhu, Xeiqing, Munro, Eric, Waskiewicz, Warren, Muller, David

“…Electron inelastic scattering in thin films is briefly discussed. It is found that in thin films of interest the plasmon generation by an energetic electron is…”
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Surface-emitting distributed feedback semiconductor laser by MACOMBER, S. H, MOTT, J. S, NOLL, R, GALLATIN, G. M, GRATRIX, E. J, O'DWYER, S. L, LAMBERT, S. A

“…Electrically pumped, surface-emitting distributed feedback lasers were for the first time demonstrated without any facet reflections. The devices contained…”
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CMOS compatible alignment marks for the SCALPEL proof of lithography tool by Farrow, R.C., Waskiewicz, W.K., Kizilyalli, I., Ocola, L., Felker, J., Biddick, C., Gallatin, G., Mkrtchyan, M., Blakey, M., Kraus, J., Novembre, A., Orphanos, P., Peabody, M., Kasica, R., Kornblit, A., Klemens, F.

“…SCALPEL alignment marks have been fabricated in a SiO 2/WSi 2 structure using SCALPEL lithography and plasma processing. The positions of the marks were…”
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Analytical model of the “Shot Noise” effect in photoresist by Gallatin, Gregg M., Alexander Liddle, J.

“…Decreasing feature size implies increased sensitivity to statistical fluctuations in various process parameters such as dose and the number of relevant bonds…”
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Initial wafer heating analysis for a SCALPEL lithography system by Stanton, Stuart T., Alexander Liddle, J., Gallatin, Gregg M., Kim, Byungkyu, Engelstad, Roxanne L.

“…A high-throughput SCALPEL tool will employ a typical exposure current of 30 μA and electron column potential of 100 KV, delivering power up to ∼3 W through a…”
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Simulations of a ring resonator free-electron laser by Tokar, R.L., McVey, B.D., Thode, L.E., Gallatin, G.M.

“…A relatively high gain ( approximately=25 to 40%) free-electron laser (FEL) with an optical ring resonator is simulated using the code FELEX. The laser system…”
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Analytical-based solutions for SCALPEL wafer heating by Fares, N., Stanton, S., Liddle, J., Gallatin, G.

“…When operating in high-throughput conditions, SCALPELs 100 keV electron beam causes significant dynamic wafer deformation. To complement extensive finite…”
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Design and test of a through‐the‐mask alignment sensor for a vertical stage x‐ray aligner by Nelson, M., Kreuzer, J. L., Gallatin, G.

“…SVG Lithography is building a production‐ready, vertical stage x‐ray proximity aligner. For aligner‐to‐itself overlays, the aligner overlay specification is a…”
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Space-charge effects in projection electron-beam lithography: Results from the SCALPEL proof-of-lithography system by Liddle, J. A., Blakey, M. I., Bolan, K., Farrow, R. C., Gallatin, G. M., Kasica, R., Katsap, V., Knurek, C. S., Li, J., Mkrtchyan, M., Novembre, A. E., Ocola, L., Orphanos, P. A., Peabody, M. L., Stanton, S. T., Teffeau, K., Waskiewicz, W. K., Munro, E.

“…In projection electron-beam systems resolution and throughput are linked through electron–electron interactions collectively referred to as space-charge…”
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Some one-loop calculations for a g φ 4 field theory by Gallatin, G. M.

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On the one-loop correction in Yang-Mills theories with external sources by Gallatin, G. M.

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Effect of thin-film imaging on line edge roughness transfer to underlayers during etch processes by Goldfarb, Dario L., Mahorowala, Arpan P., Gallatin, Gregg M., Petrillo, Karen E., Temple, Karen, Angelopoulos, Marie, Rasgon, Stacy, Sawin, Herbert H., Allen, Scott D., Lawson, Margaret C., Kwong, Ranee W.

“…For the patterning of sub-100 nm features, a clear understanding of the origin and control of line edge roughness (LER) is extremely desirable, from a…”
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SCALPEL aerial image monitoring: Principles and application to space charge by Gallatin, G. M., Farrow, R. C., Liddle, J. A., Waskiewicz, W. K., Mkrtchyan, M. M., Orphanos, P., Felker, J., Kraus, J., Biddick, C. J., Stanton, S., Novembre, A. E., Blakey, M.

“…We present an approach to real time direct aerial image monitoring which utilizes the information contained in an alignment signal generated by scanning the…”
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Mechanism of Laser Induced Compaction by Gallatin, G

“…Fused Silica is the material of choice for UV optical systems such as the projection optics in microlithography systems. Unfortunately fused silica is not…”
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Generalized Goldstone Theorem: Automatic Imposition of the Higgs Mechanism and Application to Scale and Conformal Symmetry Breaking by Chodos, A, Gallatin, G

“…J.Math.Phys. 42 (2001) 3282-3291 Standard discussions of Goldstone's theorem based on a symmetry of the action assume constant fields and global…”
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Analytic evaluation of the intensity point spread function by Gallatin, Gregg M.

“…The intensity point spread function (PSF) for geometric imaging such as occurs in a projection electron system like SCALPEL is derived analytically from the…”
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Finite element analysis of SCALPEL wafer heating by Kim, Byungkyu, Engelstad, Roxann L., Lovell, Edward G., Stanton, Stuart T., Liddle, J. Alexander, Gallatin, Gregg M.

“…A high-throughput scattering with angular limitation projection electron beam lithography (SCALPEL) tool will typically deliver up to 1.5×10 −4   J to an area…”
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