Search Results - "GUO, J. D"
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Evidence of cooperative effect on the enhanced superconducting transition temperature at the FeSe/SrTiO3 interface
Published in Nature communications (15-02-2019)“…At the interface between monolayer FeSe films and SrTiO 3 substrates the superconducting transition temperature ( T c ) is unexpectedly high, triggering a…”
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2
Presynaptic 5-HT1B receptor-mediated serotonergic inhibition of glutamate transmission in the bed nucleus of the stria terminalis
Published in Neuroscience (17-02-2010)“…Abstract Activation of neurons in the bed nucleus of the stria terminalis (BNST) plays a critical role in stress and anxiety-related behaviors. Previously, we…”
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3
Prohibitin 1 gene delivery promotes functional recovery in rats with spinal cord injury
Published in Neuroscience (12-02-2015)“…Highlights • The expression of PHB1 was downregulated following SCI in rats. • Ad-PHB1 administration promoted functional recovery in rats with SCI. • Ad-PHB1…”
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4
Bi-directional modulation of bed nucleus of stria terminalis neurons by 5-HT: molecular expression and functional properties of excitatory 5-HT receptor subtypes
Published in Neuroscience (29-12-2009)“…Abstract Activation of neurons in the anterolateral bed nucleus of the stria terminalis (BNSTALG ) plays an important role in mediating the behavioral response…”
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Synthesis, Characterization and Real Molecule DFT Calculations for Neutral Organogallium(I) Aryl Dimers and Monomers: Weakness of GalliumGallium Bonds in Digallenes and Digallynes
Published in Chemistry : a European journal (18-05-2009)“…Move closer: The galliumgallium bond strength in terphenyl gallium(I) dimers [ArGaGaAr] (see figure) is similar to those in other molecules with closed shell…”
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Superconductivity above 130 K in the Hg-Ba-Ca-Cu-O system
Published in Nature (London) (06-05-1993)“…Superconductivity above 130 degrees K in a material containing HgBa2Ca2Cu3O1 plus x, HgBa2CaCu2O6 plus x and an ordered superstructure comprising a defined…”
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GaN Nanowire Functionalized with Atomic Layer Deposition Techniques for Enhanced Immobilization of Biomolecules
Published in Langmuir (07-12-2010)“…We report the use of atomic layer deposition (ALD) coating as a nanobiosensor functionalization strategy for enhanced surface immobilization that may enable…”
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8
Evidence of cooperative effect on the enhanced superconducting transition temperature at the FeSe/SrTiO 3 interface
Published in Nature communications (01-12-2019)“…At the interface between monolayer FeSe films and SrTiO substrates the superconducting transition temperature (T ) is unexpectedly high, triggering a surge of…”
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Journal Article -
9
Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect
Published in Journal of materials science. Materials in electronics (2013)“…Effects of electromigration on microstructure and tensile property were studied in the Sn–1Ag–0.5Cu and Sn–1Ag–0.5Cu–1Zn solder interconnects. While the…”
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10
Antioxidative activities and the total phenolic contents of tonic Chinese Medicinal Herbs
Published in Inflammopharmacology (01-10-2008)“… Chinese medicated diet is an everyday practice in China. In this study, 16 commonly used soup making tonic Chinese medicinal herbs were selected for…”
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11
Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition
Published in Journal of alloys and compounds (01-06-2009)“…Effects of Zn addition on the interfacial reaction between Sn and Ni(P) were investigated by systematically varying the Zn concentration in the Sn solder. It…”
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12
Investigation on enhancing the thermal conductance of gallium-based thermal interface materials using chromium-coated diamond particles
Published in Journal of materials science. Materials in electronics (01-04-2019)“…The focus of this paper is how to efficiently enhance the thermal conductance of gallium-based thermal interface materials (TIMs) and greatly avoid the…”
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13
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints
Published in Journal of electronic materials (01-11-2009)“…The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of…”
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14
Effect of electric current pulse on tensile strength and elongation of casting ZA27 alloy
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25-11-2002)“…The ZA27 alloy cast in the sand mould was treated with strong electric current pulse during the solidification. The experimental results indicated that the…”
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15
Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate
Published in Journal of electronic materials (01-03-2010)“…The effect of polarity on interfacial reactions under high-density electric current was investigated in Cu/FeNi/Sn/FeNi/Cu solder interconnects. A reverse…”
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16
Prediction of prostate cancer aggressiveness with a combination of radiomics and machine learning-based analysis of dynamic contrast-enhanced MRI
Published in Clinical radiology (01-11-2019)“…To investigate whether the combination of radiomics and automatic machine learning-based classification of original images from multiphase dynamic…”
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Changes of axial and radial diffusivities in cerebral white matter led by normal aging
Published in Diagnostic and interventional imaging (2012)“…Abstract Purpose Purpose of the study is to reveal the changes of directional diffusion in cerebral white matter (WM) by normal aging. Materials and methods…”
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Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
Published in Journal of electronic materials (01-03-2009)“…Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 × 10 4 A/cm 2 for 168.5 h at 150°C. When the…”
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Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces
Published in Journal of electronic materials (01-12-2009)“…The thermal resistance of Si/Sn-52In/Cu sandwiched samples was measured by the laser flash method after various stages of thermal cycling. The thermal…”
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Journal Article Conference Proceeding -
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Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current
Published in Journal of materials science. Materials in electronics (01-03-2018)“…In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of…”
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