Search Results - "GRAVE, D. B"

Feature evolution simulations of copper seed layer deposition using atomic-level particle scattering information by Vyvoda, M.A., Abrams, C.F., Grave, D.B.

“…One of the most important processing steps during copper metallization is the deposition of a thin yet conformal copper seed layer, often using ionized…”
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Feature evolution simulations of copper seed layer deposition using atomic-level particle scattering information : Special issue on the modeling of collisional or near-collisionless low-temperature plasmas by VYVODA, M. A, ABRAMS, C. F, GRAVE, D. B

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