Search Results - "GOSSET, G"

Signaling by IL-1β+IFN-γ and ER stress converge on DP5/Hrk activation: a novel mechanism for pancreatic β-cell apoptosis by Gurzov, E N, Ortis, F, Cunha, D A, Gosset, G, Li, M, Cardozo, A K, Eizirik, D L

“…Chronic inflammation and pro-inflammatory cytokines are important mediators of pancreatic β -cell destruction in type 1 diabetes (T1D). We presently show that…”
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Laboratory metabolic evolution improves acetate tolerance and growth on acetate of ethanologenic Escherichia coli under non-aerated conditions in glucose-mineral medium by Fernández-Sandoval, M. T., Huerta-Beristain, G., Trujillo-Martinez, B., Bustos, P., González, V., Bolivar, F., Gosset, G., Martinez, A.

“…In this work, Escherichia coli MG1655 was engineered to produce ethanol and evolved in a laboratory process to obtain an acetate tolerant strain called MS04 (…”
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Optimum melanin production using recombinant Escherichia coli by Lagunas-Muñoz, V.H, Cabrera-Valladares, N, Bolívar, F, Gosset, G, Martínez, A

“…A parametric study was conducted to define optimum conditions to achieve high yields in the conversion of tyrosine to eumelanin (EuMel) using recombinant…”
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Angle-resolved x-ray photoelectron spectroscopy of ultrathin Al2O3 films grown by atomic layer deposition by Renault, O., Gosset, L. G., Rouchon, D., Ermolieff, A.

“…Thin (45 nm) and ultrathin (4.5–1 nm) Al2O3 layers deposited on HF-stripped Si or thin SiO2 surfaces by atomic layer deposition were studied by angle-resolved…”
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Characterization of sugar mixtures utilization by an Escherichia coli mutant devoid of the phosphotransferase system by HERNANDEZ-MONTALVO, V, VALLE, F, BOLIVAR, F, GOSSET, G

“…Due to catabolite repression in microorganisms, sugar mixtures cannot be metabolized in a rapid and efficient manner. Therefore, the development of mutant…”
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Analysis of carbon metabolism in Escherichia coli strains with an inactive phosphotransferase system by (13)C labeling and NMR spectroscopy by Flores, S, Gosset, G, Flores, N, de Graaf, A A, Bolívar, F

“…We have developed Escherichia coli strains that internalize glucose utilizing the GalP permease instead of the phosphoenolpyruvate:carbohydrate…”
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Response to different environmental stress conditions of industrial and laboratory Saccharomyces cerevisiae strains by GARAY-ARROYO, A, COVARRUBIAS, A. A, CLARK, I, NINO, I, GOSSET, G, MARTINEZ, A

“…Two sets of Saccharomyces cerevisiae strains were compared for their physiological responses to different stress conditions. One group is composed of three…”
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Interface and material characterization of thin Al2O3 layers deposited by ALD using TMA/H2O by Gosset, L.G., Damlencourt, J.-F., Renault, O., Rouchon, D., Holliger, Ph, Ermolieff, A., Trimaille, I., Ganem, J.-J., Martin, F., Séméria, M.-N.

“…Thin Al2O3 layers were grown by atomic layer deposition using trimethylaluminum (TMA) and water as precursors on 1.2 nm thermal SiO2 and HF cleaned Si…”
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Quantitative determination of benazepril and benazeprilat in human plasma by gas chromatography–mass spectrometry using automated 96-well disk plate solid-phase extraction for sample preparation by Pommier, F, Boschet, F, Gosset, G

“…An analytical method for the determination of benazepril and its active metabolite, benazeprilat, in human plasma by capillary gas…”
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Advanced Cu interconnects using air gaps by Gosset, L.G., Farcy, A., de Pontcharra, J., Lyan, Ph, Daamen, R., Verheijden, G.J.A.M., Arnal, V., Gaillard, F., Bouchu, D., Bancken, P.H.L., Vandeweyer, T., Michelon, J., Hoang, V. Nguyen, Hoofman, R.J.O.M., Torres, J.

“…The integration of air gaps for advanced Cu interconnects is mandatory to achieve the performances required for high performance integrated circuits (ICs). The…”
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Engineering the Escherichia coli fermentative metabolism by Orencio-Trejo, M, Utrilla, J, Fernández-Sandoval, M T, Huerta-Beristain, G, Gosset, G, Martinez, A

“…Fermentative metabolism constitutes a fundamental cellular capacity for industrial biocatalysis. Escherichia coli is an important microorganism in the field of…”
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Impact of introducing CuSiN self-aligned barriers in advanced copper interconnects by Chhun, S., Gosset, L.G., Casanova, N., Ney, D., Delille, D., Trouiller, C., Hopstaken, M., Chausse, P., Grégoire, M., Gautier, B., Dupuy, J.-C., Torres, J.

“…Self-aligned barriers have been widely investigated in the replacement of standard PECVD dielectric liners to decrease coupling capacitance. As an alternative…”
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Microbial Origin of Plant-Type 2-Keto-3-Deoxy-d-arabino-Heptulosonate 7-Phosphate Synthases, Exemplified by the Chorismate- and Tryptophan-Regulated Enzyme from Xanthomonas campestris by Gosset, G, Bonner, C A, Jensen, R A

“…Article Usage Stats Services JB Citing Articles Google Scholar PubMed Related Content Social Bookmarking CiteULike Delicious Digg Facebook Google+ Mendeley…”
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Chemical etching solutions for air gap formation using a sacrificial oxide/polymer approach by Gaillard, F., de Pontcharra, J., Gosset, L.G., Lyan, Ph, Bouchu, D., Daamen, R., Louveau, O., Besson, P., Passemard, G., Torres, J.

“…The formation of intra metal level “air cavities” using a sacrificial oxide in a Dual Damascene copper interconnect structure was investigated for different HF…”
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New techniques to characterize properties of advanced dielectric barriers for sub-65 nm technology node by Vitiello, J., Ducote, V., Farcy, A., Gosset, L.G., Le-Friec, Y., Hopstaken, M., Jullian, S., Cordeau, M., Ailhas, C., Chapelon, L.L., Barbier, D., Veillerot, M., Danel, A., Torres, J.

“…Of great interest for sub-65 nm interconnect technologies, low- k barriers are potentially sensitive to Cu diffusion and oxygen-based contamination,…”
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Glucose transport engineering allows mimicking fed‐batch performance in batch mode and selection of superior producer strains by Lara, A. R., Velazquez, D., Gosset, G.

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Cu surface treatment influence on Si adsorption properties of CuSiN self-aligned barriers for sub-65 nm technology node by Chhun, S., Gosset, L.G., Michelon, J., Girault, V., Vitiello, J., Hopstaken, M., Courtas, S., Debauche, C., Bancken, P.H.L., Gaillard, N., Bryce, G., Juhel, M., Pinzelli, L., Guillan, J., Gras, R., Van Schravendijk, B., Dupuy, J.-C., Torres, J.

“…Self-aligned barriers are widely investigated either in replacement of dielectric liners to decrease the total interconnect k value or as a treatment prior…”
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Influence of SiH4 process step on physical and electrical properties of advanced copper interconnects by Chhun, S., Gosset, L.G., Casanova, N., Guillaumond, J.F., Dumont-Girard, P., Federspiel, X., Pantel, R., Arnal, V., Arnaud, L., Torres, J.

“…Self-aligned barriers on copper are widely investigated as a promising solution to replace standard PECVD dielectric barriers for the 65 nm technology node and…”
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Hybrid punch through approach to address electroless related integration issues of hybrid CoWP/SiCN barriers by Guillan, J., Gosset, L.G., Delsol, R., Ollier, E., Brun, Ph, Petitprez, E., Gras, R., Girault, V., Gall, M., Hauschildt, M., Torres, J.

“…Integration of CoWP self-aligned barriers in hybrid stack with SiCN liner in a standard 65 nm technology node integration scheme faces several issues. For…”
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Integration of SiOC air gaps in copper interconnects by Gosset, L.G, Arnal, V, Brun, Ph, Broekaart, M, Monget, C, Casanova, N, Rivoire, M, Oberlin, J.-C, Torres, J

“…The formation of air gaps by means of a non-conformal chemical vapor deposition (CVD) on patterned wafers was successfully demonstrated using SiOC ( K=2.9) as…”
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