Search Results - "G, Katti"

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs by Katti, G., Stucchi, M., De Meyer, K., Dehaene, W.

“…Three-dimensional ICs provide a promising option to build high-performance compact SoCs by stacking one or more chips vertically. Through silicon vias (TSVs)…”
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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration by Olmen, J. Van, Huyghebaert, C., Coenen, J., Aelst, J. Van, Sleeckx, E., Ammel, A. Van, Armini, S., Katti, G., Vaes, J., Dehaene, W., Beyne, E., Travaly, Y.

“…In this paper we will highlight key integration issues that were encountered during the development of the 3D-stacked IC Through Silicon Via (TSV) module and…”
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3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot by Marchal, Paul, Bougard, Bruno, Katti, Guruprasad, Stucchi, Michele, Dehaene, Wim, Papanikolaou, Antonis, Verkest, Diederik, Swinnen, Bart, Beyne, Eric

“…It is widely acknowledged that three-dimensional (3-D) technologies offer numerous opportunities for system design. In recent years, significant progress has…”
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Subthreshold current model of FinFETs based on analytical solution of 3-D Poisson's equation by Havaldar, D.S., Katti, G., DasGupta, N., DasGupta, A.

“…The potential variation in the channel obtained from analytical solution of three-dimensional (3-D) Poisson's equation is used to calculate the subthreshold…”
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The effect of leaffolder Cnaphalocrocis medinalis (Guenee) [Lepidoptera: Pyralidae] injury on the plant physiology and yield loss in rice by Padmavathi, Ch, Katti, G., Padmakumari, A. P., Voleti, S. R., Subba Rao, L. V.

“…Influence of leaffolder feeding on chlorophyll, PS II activity and plant–water relations, effect of larval density on leaf damage and time course studies on…”
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Functional significance of Micraspis discolor (F.) (Coccinellidae: Coleoptera) in rice ecosystem by Shanker, C., Mohan, M., Sampathkumar, M., Lydia, Ch, Katti, G.

“…Coccinellids are key predators that are conserved and augmented in agricultural ecosystems, to achieve biological control of pests. Actual quantification of…”
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Temperature driven development of the rice brown planthopper, Nilaparvata lugens (Stål) (Hemiptera: Delphacidae) by JHANSILAKSHMI VATTIKUTI, V. SAILAJA, Y.G. PRASAD, P.M.CHIRUTKAR, G. RAMACHANDRA RAO, A.P. PADMAKUMARI, CH. PADMAVATHI, M. PRABHAKAR

“…Temperature driven development of rice brown planthopper (BPH), Nilaparvata lugens (Stål) (Hemiptera: Delphacidae) population (biotype 4) was examined at seven…”
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Threshold Voltage model for mesa-isolated small geometry fully depleted SOI MOSFETs based on analytical solution of 3-D Poisson's equation by Katti, G., DasGupta, N., DasGupta, A.

“…A threshold voltage model for mesa-isolated fully depleted silicon-on-insulator (FDSOI) MOSFETs, based on the analytical solution of three-dimensional (3-D)…”
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Selection of flowering forbs for conserving natural enemies in rice fields by Shanker, C., Mohan, M., Sampathkumar, M., Lydia, Ch, Katti, G.

“…The diversity of natural enemies harboured by flowering forbs on rice field bunds was recorded. Ageratum conozoides with a maximum Shannon diversity index of…”
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An evaluation of transanal endoscopic microsurgery for rectal adenoma and carcinoma by Katti, G

“…Transanal endoscopic microsurgery was introduced in the early 1980s. Since then, increasing numbers of rectal adenomas are being excised by this technique. The…”
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Test structures for characterization of through silicon vias by Stucchi, M, Perry, D, Katti, G, Dehaene, W

“…As silicon technology reaches extreme sub-um dimensions, the industry has reached for ¿more than Moore¿ solutions to enable advancements in integration, lower…”
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Evaluation of design parameters of eight dental implant designs: a two-dimensional finite element analysis by Desai, S R, Desai, M S, Katti, G, Karthikeyan, I

“…Implants could be considered predictable tools for replacing missing teeth or teeth that are irrational to treat. Implant macrodesign includes thread, body…”
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Rapid palatal expansion in a patient with cleft lip and palate by Katti, Chandrika G, Talapaneni, Ashok Kumar

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Impact of thinning and through silicon via proximity on High-k / Metal Gate first CMOS performance by Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

“…3D integration has the potential to alleviate the performance limitations that CMOS scaling is facing provided that it preserves the integrity of both front…”
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Estimation of a reliable evapotranspiration model and crop coefficient in red gram ( Cajanus cajan L .) for semi-arid environments in India by Singandhupe, RB, Sethi, Ranu Rani, Katti, GS

“…The study aims to compute the reference evapotranspiration (ETo) by six standard methods such as Penman Monteith, Modified Penman, Hargreaves, Radiation…”
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Micropolar Fluid Poro-Elastic Squeeze Film Lubrication between a Cylinder and a Rough Flat Plate - A Special Reference to Synovial Joint Lubrication by Neminath B. Naduvinamani, Savitramma G. Katti

“…In the present paper the effect of micropolar squeeze film lubrication between a cylinder and a poroelastic flat plate is presented. The synovial fluid is…”
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Design Issues and Considerations for Low-Cost 3-D TSV IC Technology by Van der Plas, G, Limaye, P, Loi, I, Mercha, A, Oprins, H, Torregiani, C, Thijs, S, Linten, D, Stucchi, M, Katti, G, Velenis, D, Cherman, V, Vandevelde, B, Simons, V, De Wolf, I, Labie, R, Perry, D, Bronckers, S, Minas, N, Cupac, M, Ruythooren, W, Van Olmen, J, Phommahaxay, A, de Potter de ten Broeck, M, Opdebeeck, A, Rakowski, M, De Wachter, B, Dehan, M, Nelis, M, Agarwal, R, Pullini, A, Angiolini, F, Benini, L, Dehaene, W, Travaly, Y, Beyne, E, Marchal, P

“…In this paper key design issues and considerations of a low-cost 3-D Cu-TSV technology are investigated. The impact of TSV on BEOL interconnect reliability is…”
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Pattern of Anxiety and Depression with Associated Factors in Oral Lichen Planus: A Questionnaire Based Study by G, Katti, S, Shahbaz, M, Amena, C, Katti, SR, Ghali

“…Introduction: Oral lichen planus (OLP) is a common oral disease affecting 0.5 to 2.2% of general population. It is considered as a chronic inflammatory…”
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Monolithic integration of high capacitance (power/ground) and low by Katti, G., Weiliang, Y., Weerasekera, R., Fai, Chang Ka, Dutta, R., Ho, S. W., Li, H. Y., Bhattacharya, S.

“…For both power/ground and data carrying TSVs, TSV resistance is preferred to be as low as possible. Power/ground TSVs should exhibit larger TSV capacitance so…”
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Temperature-Dependent Modeling and Characterization of Through-Silicon Via Capacitance by Katti, G, Stucchi, M, Velenis, D, Soree, B, De Meyer, K, Dehaene, W

“…A semianalytical model of the through-silicon via (TSV) capacitance for elevated operating temperatures is derived and verified with electrical measurements…”
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