Search Results - "Fuliang Le"

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package by Fuliang Le, Lee, Shi-Wei Ricky, Lo, Jeffery C. C., Chaoran Yang

“…In this paper, through-silicon-via (TSV) dispensing is introduced to address the underfill challenge for a 3-D chip stack package. An edge flood failure would…”
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Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing by Fuliang Le, Lee, Shi-Wei Ricky, Chaoran Yang, Lo, Jeffery C. C.

“…This paper introduces a through-silicon-via (TSV) dispensing approach to accomplish the underfill process without a conventional reservoir. The vias function…”
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An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test by Fuliang Le, Lo, Jeffery C. C., Xing Qiu, Lee, Shi-Wei Ricky, Xing Li, Chi-Ying Tsui, Wing-Hung Ki

“…Transcorneal electrical stimulation (TcES) is one of the potential therapies to prevent retinal degeneration. This study reports on an implantable medical…”
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Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints by Yang, Chaoran, Le, Fuliang, Lee, S.W. Ricky

“…A detailed experimental study on the fracture mechanism of Cu–Sn intermetallic compounds (IMCs) in the Pb-free solder was presented in this paper. The growth…”
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Fluxless packaging of an implantable medical device for transcorneal electrical stimulation by Fuliang Le, Lo, Jeffery C. C., Xing Qiu, Lee, S. W. Ricky, Xing Li, Chi-Ying Tsui, Wing-Hung Ki

“…Transcorneal electrical stimulation (TcES) is one of the potential therapies to prevent retinal degeneration. This study reports on an implantable medical…”
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Through silicon underfill dispensing for 3D die/interposer stacking by Fuliang Le, Lee, S. W. Ricky, Lau, Kei May, Yue, C. Patrick, Sin, Johnny K. O., Mok, Philip K. T., Wing-Hung Ki, Hoi Wai Choi

“…This study describes a through-silicon-underfill dispensing that the encapsulant is dispensed through through-silicon-vias (TSVs). The TSVs function as…”
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An uninterrupted bird repeller on transmission line by Fuliang Le, Jiawei Luo, Gongping Wu

“…This paper describes a lower consumption bird repeller with an adequate compensating power supply. The bird repeller, installed on transmission tower, can…”
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Through-Silicon-Via Underfill Dispensing for 3D Die/Interposer Stacking by Le, Fuliang

“…The next generation packaging keeps up with the increased demands of functionality by using the third dimension. 3D chip stacking with TSVs has been identified…”
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A humanoid mini-walking robot with a stick by Fuliang Le, Xinyu Wu, Shiqi Yu, Bin Zhang, Yangsheng Xu

“…This paper describes a compact mini-walking robot with Barbie's shape, and its walking is realized with only one actuator. The first remarkable feature of this…”
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Through-Silicon-Via Underfill Dispensing for 3D Die/Interposer Stacking by Le, Fuliang

“…The next generation packaging keeps up with the increased demands of functionality by using the third dimension. 3D chip stacking with TSVs has been identified…”
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Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing by Le, Fuliang, Lee, Shi-Wei Ricky, Tao, Mian, Lo, Jeffery C. C.

“…A through-silicon-via (TSV) underfill dispensing method was introduced in previous studies to fill the under-chip space of a 2. 5D die/interpose package. A jet…”
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Die Tilt Improvement Through Copper Spacers in Solder Paste Printing by Santican, Haima, Dchar, Ilyas, Yandoc, Ding, Le, Fred Fuliang, Latido, Laudemer

“…Solder paste is a susceptible material that requires extensive study to ensure meeting the desired manufacturability responses. The stencil printing process…”
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Thermal Stability Characterization of High-Temperature Solders in Power Surface Mount Devices by Le, Fred Fuliang, Guan, Zunyu, Chen, Haibin, Chaw, Wing Onn, Santican, Haima

“…High-temperature solders are used as attaching materials in some power surface mount devices such as power diodes, MOSFETs, and IGBTs. Power surface mount…”
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Reflow Soldering Using Flux-sprayed Solder Preforms by Le, Fred Fuliang, Guan, Zunyu, Chen, Haibin, Santican, Haima, Ramalingam, Vegneswary A-P

“…This research paper investigates the use of flux-sprayed solder preforms as an alternative method to reduce flux outgassing in reflow soldering. The study…”
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Influence of Porosity on the Mechanical Properties of Hybrid Silver Sintered Joint by Guan, Zunyu, Le, Fred Fuliang, Wu, Jingshen, Yang, Jinglei, Van Der Meulen, Rinse, Chen, Haibin

“…In this study, a type of hybrid Ag sintering paste is selected and characterized. Samples were made under different sintering conditions with rising…”
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