Search Results - "Fujiwara, Takenori"

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  1. 1

    Solution deposited liquid crystalline semiconductors on a photoalignment layer for organic thin-film transistors by Fujiwara, Takenori, Locklin, Jason, Bao, Zhenan

    Published in Applied physics letters (04-06-2007)
    “…Highly ordered liquid crystalline semiconductors on a light induced alignment layer results in an anisotropic electrical characteristic and an enhanced…”
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    Journal Article
  2. 2

    Thermal amplification of photoinduced optical anisotropy of p -cyanoazobenzene polymer films monitored by temperature scanning ellipsometry by Kidowaki, Masatoshi, Fujiwara, Takenori, Morino, Shin’ya, Ichimura, Kunihiro, Stumpe, Joachim

    Published in Applied physics letters (13-03-2000)
    “…The in situ observation of thermal alteration of photoinduced optical anisotropy of ultrathin films of polymethacrylates having p-cyanoazobenzene side chains…”
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    Journal Article
  3. 3

    Photoimages Formed by Lyotropic Liquid Crystals by Ichimura, Kunihiro, Momose, Masayuki, Fujiwara, Takenori

    Published in Chemistry letters (01-09-2000)
    “…The orientation of lyotropic liquid crystals consisting of about 90 wt% water is controllable on thin films of a polymer with azobenzene side chains, which are…”
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    Journal Article
  4. 4

    Extraordinarily Thermostable Photodichroism of Poly(4-cyano-4′-methacryloyloxyazobenzene) Films by Kidowaki, Masatoshi, Fujiwara, Takenori, Ichimura, Kunihiro

    Published in Chemistry letters (01-07-1999)
    “…Linearly-polarized-light-induced optical anisotropy of a thin film of polymethacrylate with p-cyanoazobenzenes side chains is enhanced at elevated temperatures…”
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    Journal Article
  5. 5

    Surface-assisted Photomanipulation of Orientation of a Polymer Liquid Crystal by Kidowaki, Masatoshi, Fujiwara, Takenori, Ichimura, Kunihiro

    Published in Chemistry letters (01-07-1999)
    “…The alignment photocontrol of liquid crystalline polymer films was achieved by a thin film of a polymethacrylate with p-cyanoazobenzene side chains as a…”
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    Journal Article
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  8. 8

    Excellent Reliability Organic Thermal Interface Materials for SiC Power Module by Shimada, Akira, Sakabe, Yohei, Fujiwara, Takenori

    “…Performance of SiC based power module performance can be increased/enhanced due to its much higher power output, power dissipation and much greater packaging…”
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    Conference Proceeding
  9. 9

    Development of Low Temperature Processable Polyimides for Organic Hybrid Bonding Applications by Nomura, Kota, Jukei, Masaya, Fujiwara, Takenori, Araki, Hitoshi, Honda, Tomoyuki, Shoji, Yu

    “…Low temperature curable polyimides with good process compatibility and minimal device damage have been developed for 3D stacking hybrid bonding technology…”
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    Conference Proceeding
  10. 10

    Novel Photo-definable Low Dk & Df Polyimide for Advanced Package of High Frequency Application by Araki, Hitoshi, Shimada, Akira, Ogasawara, Hisashi, Jukei, Masaya, Fujiwara, Takenori, Tomikawa, Masao

    “…Advanced package requires photo imageable dielectric which possesses low Dk & Df properties for low transmission loss. This paper will introduce a new novel…”
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    Conference Proceeding
  11. 11

    Low Temperature Curable Low Dk & Df Polyimide for Millimeter-Wave Device by Araki, Hitoshi, Shimada, Akira, Ogasawara, Hisashi, Jukei, Masaya, Fujiwara, Takenori, Tomikawa, Masao

    “…In this paper, we developed novel low temperature curable (around 200∼250 °C) low Dk (2.7) & Df (0.002) polyimide with high glass transition temperature (Tg)…”
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    Conference Proceeding
  12. 12

    Development Of Low Dielectric Loss Polyimides And Fabrication Of Advanced Packagings For 5g ApplicationS by Fujiwara, Takenori, Tatsuta, Yoshiko, Matsumura, Kazuyuki, Kanamori, Daisuke, Araki, Hitoshi, Shimada, Akira, Tomikawa, Masao

    “…Recently we have developed novel polyimide adhesive sheet materials (PI sheet) which have advantages such as planarization, via-filling, low shrinkage (low…”
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    Conference Proceeding
  13. 13

    Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications by Sekhar, Vasarla Nagendra, Fujiwara, Takenori, Araki, Hitoshi, Shoji, Yu, Jukei, Masaya, Nomura, Kota, Kumar, Mishra Dileep, Ser Choong, Chong, Rao, Vempati Srinivasa

    “…Hybrid bonding is an emerging technology for advanced packaging and heterogeneous integration. In this work, Cu/polymer-based hybrid bonding is being evaluated…”
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    Conference Proceeding
  14. 14

    Evaluation of single layer adhesive material for thin wafer handling applications by Sekhar, V. N., Ji Hongmiao, Arimoto, Shinji, Okazawa, Toru, Fujiwara, Takenori, Kawano, Masaya

    “…Present study focuses on room temperature mechanical peeling temporary bonding and debonding (TBDB) method using single layer adhesive material, mainly to…”
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    Conference Proceeding
  15. 15

    Higher reliability for low-temperature curable positive-tone photo-definable dielectric materials by Fujiwara, Takenori, Shoji, Yu, Masuda, Yuki, Hashimoto, Keika, Koyama, Yutaro, Isobe, Kimio, Araki, Hitoshi, Okuda, Ryoji, Tomikawa, Masao

    “…In this study, we have developed low-temperature curable positive-tone photo-definable dielectric materials with high elongation property for redistribution…”
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    Conference Proceeding
  16. 16

    Electrical and electroluminescent properties of poly( p-phenylene vinylene) LB films based LEDs using aluminum metal as the electrode by Wu, Aiping, Fujiwara, Takenori, Kakimoto, Masa-aki, Imai, Yoshio, Kubota, Tohru, Iwamoto, Mitsumasa

    Published in Reactive & functional polymers (1996)
    “…The electrical properties of poly( p-phenylene vinylene) (PPV) Langmuir-Blodgett (LB) films were investigated, wherein transparent indium-tin oxide (ITO) and…”
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    Journal Article Conference Proceeding