Search Results - "Fujii, Hiromichi T."

Microstructure and lap shear strength of the weld interface in ultrasonic welding of Al alloy to stainless steel by Fujii, Hiromichi T., Goto, Yuta, Sato, Yutaka S., Kokawa, Hiroyuki

“…Dissimilar welds between Al alloy and stainless steel were produced with an ultrasonic welding technique. The weld strength increased with the welding energy…”
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Thermal transients during processing of materials by very high power ultrasonic additive manufacturing by Sriraman, M.R., Gonser, Matt, Fujii, Hiromichi T., Babu, S.S., Bloss, Matt

“…Dynamic recrystallisation at interfaces has been suggested as the bonding mechanism in the joining of metallic tapes, during very high power ultrasonic…”
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Quantitative Evaluation of Bulk and Interface Microstructures in Al-3003 Alloy Builds Made by Very High Power Ultrasonic Additive Manufacturing by Fujii, Hiromichi T., Sriraman, M. R., Babu, S. S.

“…Ultrasonically consolidated 3003 aluminum alloy builds were prepared with constituent tapes by using a very high power ultrasonic additive manufacturing (UAM)…”
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Mechanical Properties and Microstructure of Dissimilar Friction Stir Welds of 11Cr-Ferritic/Martensitic Steel to 316 Stainless Steel by Sato, Yutaka S., Kokawa, Hiroyuki, Fujii, Hiromichi T., Yano, Yasuhide, Sekio, Yoshihiro

“…Dissimilar joints between ferritic and austenitic steels are of interest for selected applications in next generation fast reactors. In this study, dissimilar…”
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High-strain-rate deformation in ultrasonic additive manufacturing by Fujii, Hiromichi T., Shimizu, Saki, Sato, Yutaka S., Kokawa, Hiroyuki

“…High-strain-rate deformation in ultrasonic additive manufacturing was analyzed by performing microstructural characterization via electron microscopy. The…”
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In situ EBSD observation of grain boundary character distribution evolution during thermomechanical process used for grain boundary engineering of 304 austenitic stainless steel by Tokita, Shun, Kokawa, Hiroyuki, Sato, Yutaka S., Fujii, Hiromichi T.

“…Electron backscatter diffraction (EBSD) was used to examine the microstructural evolution in a one-step thermomechanically processed 304 austenitic stainless…”
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Thermal Transients During Processing of 3003 Al-H18 Multilayer Build by Very High-Power Ultrasonic Additive Manufacturing by Sriraman, M. R., Gonser, Matt, Foster, Daniel, Fujii, Hiromichi T., Babu, S. S., Bloss, Matt

“…Previous investigations suggested a gradient in bond microstructure along the height of a “build” made by very high power ultrasonic additive manufacturing—a…”
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Effect of post-GBE strain-sensitisation on corrosion resistance of grain boundary engineered 304 austenitic stainless steel by Yamada, Gouki, Kokawa, Hiroyuki, Yasuda, Yu, Tokita, Shun, Yokoyama, Takashi, Sato, Yutaka S., Fujii, Hiromichi T., Tsurekawa, Sadahiro

“…Control of grain boundary microstructure for grain boundary engineering (GBE) is effective to prevent intergranular corrosion by disconnection of corrosive…”
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Comparison of Heat Assisted Lap Joints of High-Temperature Superconducting Tapes With Inserted Indium Foils by Ito, Satoshi, Fujii, Hiromichi T., Hayasaka, Ryoichiro, Sato, Yutaka S., Hashizume, Hidetoshi

“…Easy and simple fabrication of a lap joint of high-temperature superconducting (HTS) tapes is desirable for various HTS applications such as power cables and…”
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High-speed TSV filling with molten solder by Ko, Young-Ki, Fujii, Hiromichi T., Sato, Yutaka S., Lee, Chang-Woo, Yoo, Sehoon

“…A novel technique of vacuum-assisted via filling with molten solder was developed in this study. The diameter of the TSV was 30 μm and its depth was 100–200…”
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Effect of post-GBE strain-sensitisation on corrosion resistance of grain boundary engineered 304 austenitic stainless steel: Celebrating the career of Jany Thibault-Penisson in the microscopy of defects and interfaces by YAMADA, Gouki, KOKAWA, Hiroyuki, YASUDA, Yu, TOKITA, Shun, YOKOYAMA, Takashi, SATO, Yutaka S, FUJII, Hiromichi T, TSUREKAWA, Sadahiro

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Advanced solder TSV filling technology developed with vacuum and wave soldering by Young-Ki Ko, Fujii, H. T., Sato, Y. S., Chang-Woo Lee, Sehoon Yoo

“…This research investigated advanced filling technology, different from existing technologies, for the purpose of 3D layering on electronic circuits. Filling…”
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